3051826

Information

• Patent Grant
• 3051826

• References
• Source

• Patent Number

  3,051,826

• Date Filed

  Not available

• Date Issued

  Tuesday, August 28, 1962
  62 years ago

• CPC

  • H01L24/26 - Layer connectors
  • B23K20/10 - making use of vibrations
  • H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L24/80 - Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
  • H01L24/83 - using a layer connector
  • H01L2224/8319 - Arrangement of the layer connectors prior to mounting
  • H01L2224/83206 - Direction of oscillation
  • H01L2224/83801 - Soldering or alloying
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01015 - Phosphorus [P]
  • H01L2924/01019 - Potassium [K]
  • H01L2924/01027 - Cobalt [Co]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01067 - Holmium [Ho]
  • H01L2924/01074 - Tungsten [W]
  • H01L2924/01079 - Gold [Au]
  • H01L2924/0132 - Binary Alloys
  • H01L2924/01322 - Eutectic Alloys
  • Y10T29/49124 - On flat or curved insulated base, e.g., printed circuit, etc.

• US Classifications

  • 219 - Electric heating
  • 029 - Metal working
  • 228 - Metal fusion bonding
  • 257 - Active solid-state devices