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H01L2224/85206

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85206Direction of oscillation

Industries

Patents Grantslast 30 patents

Information Patent Grant
Wire bonding method and wire bonding device
- Patent number 11,404,393
- Issue date Aug 2, 2022
- Kaijo Corporation
- Eiji Kimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,586,777
- Issue date Mar 10, 2020
- Renesas Electronics Corporation
- Kentaro Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method for contacting said semiconducto...
- Patent number RE47854
- Issue date Feb 11, 2020
- Infineon Technologies AG
- Reinhold Bayerer
Information Patent Grant
Electric conductor track, method, and use
- Patent number 10,438,871
- Issue date Oct 8, 2019
- Continental Teves AG & Co. oHG
- Svenja Raukopf
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor device including applying u...
- Patent number 9,508,678
- Issue date Nov 29, 2016
- Renesas Electronics Corporation
- Naoki Kawanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper ball bond features and structure
- Patent number 9,461,012
- Issue date Oct 4, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating wire bonding structure
- Patent number 9,289,846
- Issue date Mar 22, 2016
- Siliconware Precision Industries Co., Ltd.
- Wei-Sheng Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support structures and clamping systems for semiconductor devices d...
- Patent number 9,038,998
- Issue date May 26, 2015
- Orthodyne Electronics Corporation
- Jonathan Michael Byars
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Copper ball bond features and structure
- Patent number 8,907,485
- Issue date Dec 9, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus
- Patent number 8,800,843
- Issue date Aug 12, 2014
- Shinkawa Ltd.
- Nobuyuki Aoyagi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die bond film, dicing die bond film, and semiconductor device
- Patent number 8,779,586
- Issue date Jul 15, 2014
- Nitto Denko Corporation
- Kenji Oonishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for providing near-hermetically coated integrated circuit as...
- Patent number 8,581,108
- Issue date Nov 12, 2013
- Rockwell Collins, Inc.
- Alan P. Boone
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gold wire for semiconductor element connection
- Patent number 8,415,797
- Issue date Apr 9, 2013
- Nippon Steel & Sumikin Materials Co., Ltd.
- Keiichi Kimura
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Wirebonded semiconductor package
- Patent number 8,357,998
- Issue date Jan 22, 2013
- Advanced Semiconductor Engineering, Inc.
- Wen Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method
- Patent number 8,308,049
- Issue date Nov 13, 2012
- Kabushiki Kaisha Toshiba
- Mitsuhiro Nakao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method for the same
- Patent number 8,134,240
- Issue date Mar 13, 2012
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for controlling the generation of ultrasonic wire...
- Patent number 8,020,746
- Issue date Sep 20, 2011
- Technische Universitaet Berlin
- Ute Geissler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tool head for attaching an electrical conductor on the contact surf...
- Patent number 7,581,667
- Issue date Sep 1, 2009
- Robert Bosch GmbH
- Manfred Reinold
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor component and method for contracting said semiconduct...
- Patent number 7,462,557
- Issue date Dec 9, 2008
- Infineon Technologies AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond with improved shear strength
- Patent number 7,314,157
- Issue date Jan 1, 2008
- ASM Technology Singapore Pte. Ltd.
- Yam Mo Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor component and method for contacting said semiconducto...
- Patent number 7,151,318
- Issue date Dec 19, 2006
- Eupec Europäische Gesellschaft für Leistungshalbleiter GmbH & Co. KG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic vibration mode for wire bonding
- Patent number 6,685,083
- Issue date Feb 3, 2004
- Micron Technology, Inc.
- Tongbi Jiang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic vibration mode for wire bonding
- Patent number 6,367,685
- Issue date Apr 9, 2002
- Tongbi Jiang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic vibration mode for wire bonding
- Patent number 6,244,498
- Issue date Jun 12, 2001
- Micron Semiconductor, Inc.
- Tongbi Jiang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with bonded wires
- Patent number 5,828,116
- Issue date Oct 27, 1998
- Denso Corporation
- Kenichi Ao
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device having an improved connection arrangement betw...
- Patent number 5,777,391
- Issue date Jul 7, 1998
- Hitachi, Ltd.
- Atsushi Nakamura
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device having a mechanical buffer
- Patent number 5,235,212
- Issue date Aug 10, 1993
- Kabushiki Kaisha Toshiba
- Yoshio Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method
- Patent number 5,148,964
- Issue date Sep 22, 1992
- Kabushiki Kaisha Toshiba
- Yasuhiko Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding method
- Patent number 5,115,960
- Issue date May 26, 1992
- Kabushiki Kaisha Toshiba
- Yasuhiko Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic wire bonder
- Patent number 4,958,762
- Issue date Sep 25, 1990
- Kabushiki Kaisha Toshiba
- Yasuhiko Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDING METHOD AND WIRE BONDING DEVICE
- Publication number 20210366869
- Publication date Nov 25, 2021
- KAIJO CORPORATION
- Eiji KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180108629
- Publication date Apr 19, 2018
- RENESAS ELECTRONICS CORPORATION
- Kentaro YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20160254357
- Publication date Sep 1, 2016
- Masatoshi AKETA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Semiconductor Device
- Publication number 20150228618
- Publication date Aug 13, 2015
- RENESAS ELECTRONICS CORPORATION
- Naoki KAWANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Ball Bond Features and Structure
- Publication number 20140054781
- Publication date Feb 27, 2014
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE WIRE OF SILVER-PALLADIUM ALLOY COATED WITH METALLIC THIN...
- Publication number 20130233593
- Publication date Sep 12, 2013
- WIRE TECHNOLOGY CO., LTD.
- Jun-Der LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT STRUCTURES AND CLAMPING SYSTEMS FOR SEMICONDUCTOR DEVICES D...
- Publication number 20120274014
- Publication date Nov 1, 2012
- Orthodyne Electronics Corporation
- Jonathan Michael Byars
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120153444
- Publication date Jun 21, 2012
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BOND FILM, DICING DIE BOND FILM, AND SEMICONDUCTOR DEVICE
- Publication number 20110210455
- Publication date Sep 1, 2011
- Kenji Oonishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BONDING APPARATUS
- Publication number 20110155789
- Publication date Jun 30, 2011
- SHINKAWA LTD.
- Nobuyuki Aoyagi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100200969
- Publication date Aug 12, 2010
- Advanced Semiconductor Engineering, Inc.
- Wen Pin HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD
- Publication number 20100096437
- Publication date Apr 22, 2010
- Kabushiki Kaisha Toshiba
- Mitsuhiro Nakao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND DEVICE FOR CONTROLLING THE GENERATION OF ULTRASONIC WIRE...
- Publication number 20100025453
- Publication date Feb 4, 2010
- Technische Universitaet Berlin
- Ute Geissler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20090321927
- Publication date Dec 31, 2009
- Fujitsu Microelectronics Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GOLD WIRE FOR SEMICONDUCTOR ELEMENT CONNECTION
- Publication number 20090115059
- Publication date May 7, 2009
- Nippon Steel Materials Co., Ltd
- Keiichi Kimura
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Wire bonding method, wire bonding apparatus and semiconductor device
- Publication number 20080054440
- Publication date Mar 6, 2008
- FUJITSU LIMITED
- Takayoshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method for the same
- Publication number 20080023831
- Publication date Jan 31, 2008
- FUJITSU LIMITED
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPILLARY FOR A BONDING TOOL
- Publication number 20070125831
- Publication date Jun 7, 2007
- Srikanth NARASIMALU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Component And Method For Contracting Said Semiconduct...
- Publication number 20070087553
- Publication date Apr 19, 2007
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bond with improved shear strength
- Publication number 20060032894
- Publication date Feb 16, 2006
- ASM Technology Singapore Pte Ltd
- Yam Mo Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor component and method for bonding said semiconductor c...
- Publication number 20040227257
- Publication date Nov 18, 2004
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tool head for attaching an electrical conductor on the contact surf...
- Publication number 20040129761
- Publication date Jul 8, 2004
- Manfred Reinold
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Novel ultrasonic vibration mode for wire bonding
- Publication number 20020096554
- Publication date Jul 25, 2002
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS

Direction of oscillation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wire bonding method and wire bonding device

Semiconductor device and method of manufacturing the same

Semiconductor component and method for contacting said semiconducto...

Electric conductor track, method, and use

Method of manufacturing a semiconductor device including applying u...

Copper ball bond features and structure

Method for fabricating wire bonding structure

Support structures and clamping systems for semiconductor devices d...

Copper ball bond features and structure

Bonding apparatus

Die bond film, dicing die bond film, and semiconductor device

Method for providing near-hermetically coated integrated circuit as...

Gold wire for semiconductor element connection

Wirebonded semiconductor package

Wire bonding method

Semiconductor device and manufacturing method for the same

Method and device for controlling the generation of ultrasonic wire...

Tool head for attaching an electrical conductor on the contact surf...

Semiconductor component and method for contracting said semiconduct...

Wire bond with improved shear strength

Semiconductor component and method for contacting said semiconducto...

Ultrasonic vibration mode for wire bonding

Ultrasonic vibration mode for wire bonding

Ultrasonic vibration mode for wire bonding

Semiconductor device with bonded wires

Semiconductor device having an improved connection arrangement betw...

Semiconductor device having a mechanical buffer

Wire bonding method

Wire bonding method

Ultrasonic wire bonder

Patents Applicationslast 30 patents

WIRE BONDING METHOD AND WIRE BONDING DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

Method of Manufacturing Semiconductor Device

Copper Ball Bond Features and Structure

COMPOSITE WIRE OF SILVER-PALLADIUM ALLOY COATED WITH METALLIC THIN...

SUPPORT STRUCTURES AND CLAMPING SYSTEMS FOR SEMICONDUCTOR DEVICES D...

SEMICONDUCTOR DEVICE

DIE BOND FILM, DICING DIE BOND FILM, AND SEMICONDUCTOR DEVICE

BONDING APPARATUS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

BONDING METHOD

METHOD AND DEVICE FOR CONTROLLING THE GENERATION OF ULTRASONIC WIRE...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME

GOLD WIRE FOR SEMICONDUCTOR ELEMENT CONNECTION

Wire bonding method, wire bonding apparatus and semiconductor device

Semiconductor device and manufacturing method for the same

CAPILLARY FOR A BONDING TOOL

Semiconductor Component And Method For Contracting Said Semiconduct...

Wire bond with improved shear strength

Semiconductor component and method for bonding said semiconductor c...

Tool head for attaching an electrical conductor on the contact surf...

Novel ultrasonic vibration mode for wire bonding