Disc shaped leadless component

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CPC
H05K2201/10643

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10643Disc shaped leadless component

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device including coin-cell battery
- Patent number 12,144,123
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Kiwook Han
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Holder for a button cell, arrangement comprising a holder, and meth...
- Patent number 11,903,131
- Issue date Feb 13, 2024
- Wurth Elektronik eiSos GmbH & Co. KG
- Alexander Treml
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip capacitors
- Patent number 9,743,530
- Issue date Aug 22, 2017
- Texas Instruments Incorporated
- Chikara Azuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly method for converting the precursors to capacitors
- Patent number 9,119,321
- Issue date Aug 25, 2015
- Texas Instruments Incorporated
- Azuma Chikara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for vertically-structured passive components
- Patent number 9,095,067
- Issue date Jul 28, 2015
- Wintec Industries, Inc.
- Kong-Chen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing laminated device
- Patent number 8,759,156
- Issue date Jun 24, 2014
- Infineon Technologies AG
- Martin Standing
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mountable PPTC device with integral weld plate
- Patent number 8,686,826
- Issue date Apr 1, 2014
- Tyco Electronics Corporation
- Daniel A. Chandler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for vertically-structured passive components
- Patent number 8,593,825
- Issue date Nov 26, 2013
- Wintec Industries, Inc.
- Kong-Chen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,378,231
- Issue date Feb 19, 2013
- Ibiden Co., Ltd.
- Kiyotaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low profile discrete electronic components and applications of same
- Patent number 8,324,727
- Issue date Dec 4, 2012
- Samsung Electronics Co., Ltd.
- Joseph C. Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded laminated device
- Patent number 8,319,334
- Issue date Nov 27, 2012
- Infineon Technologies AG
- Martin Standing
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with embedded chip capacitor
- Patent number 8,279,616
- Issue date Oct 2, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Han Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing electronic component built-in substrate
- Patent number 8,116,066
- Issue date Feb 14, 2012
- Shinko Electric Industries Co., Ltd.
- Osamu Inoue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for coupling a battery within an embedded system
- Patent number 8,091,224
- Issue date Jan 10, 2012
- GE Intelligent Platforms Embedded Systems, Inc.
- David S. Slaton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mountable PPTC device with integral weld plate
- Patent number 7,920,045
- Issue date Apr 5, 2011
- Tyco Electronics Corporation
- Daniel A. Chandler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Providing an embedded capacitor in a circuit board
- Patent number 7,791,896
- Issue date Sep 7, 2010
- Teradata US, Inc.
- Jun Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low profile discrete electronic components and applications of same
- Patent number 7,701,323
- Issue date Apr 20, 2010
- Interconnect Portfolio LLC
- Joseph C. Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board configuration
- Patent number 7,672,140
- Issue date Mar 2, 2010
- Tensolite LLC
- Bruce Lane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead plate-attached coin-type battery whose lead plate is attached...
- Patent number 7,625,666
- Issue date Dec 1, 2009
- Sanyo Electric Co. Ltd.
- Tomoyuki Shose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded multilayer chip capacitor and printed circuit board having...
- Patent number 7,499,258
- Issue date Mar 3, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Chang Hoon Shim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer board with decoupling function
- Patent number 7,417,870
- Issue date Aug 26, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Sung Taek Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Battery holder
- Patent number 7,378,184
- Issue date May 27, 2008
- High Tech Computer, Corp.
- Jih-Chen Yeh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical devices
- Patent number 7,355,504
- Issue date Apr 8, 2008
- Tyco Electronics Corporation
- Gregory A. Graves
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
AC coupling circuit having a large capacitance and a good frequency...
- Patent number 7,196,909
- Issue date Mar 27, 2007
- Sumitomo Electric Industries, Ltd.
- Tomokazu Katsuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Press-activated electronic component discharging facilitating appar...
- Patent number 7,177,158
- Issue date Feb 13, 2007
- Inventec Corporation
- Zi-Gui Luo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit protection device
- Patent number 7,148,785
- Issue date Dec 12, 2006
- Tyco Electronics Corporation
- Paul N. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct current cut structure
- Patent number 7,046,100
- Issue date May 16, 2006
- Fujitsu Limited
- Takatoshi Yagisawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single layer capacitor with dissimilar metallizations
- Patent number 6,917,509
- Issue date Jul 12, 2005
- Daniel F. Devoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package having a flexible substrate with ends connected...
- Patent number 6,841,855
- Issue date Jan 11, 2005
- Intel Corporation
- Edward W. Jaeck
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for interconnecting, in three dimensions, electronic components
- Patent number 6,809,367
- Issue date Oct 26, 2004
- 3D Plus
- Christian Val
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE INCLUDING COIN-CELL BATTERY
- Publication number 20230109385
- Publication date Apr 6, 2023
- Samsung Electronics Co., Ltd.
- Kiwook HAN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Holder for a Button Cell, Arrangement Comprising a Holder, and Meth...
- Publication number 20220192025
- Publication date Jun 16, 2022
- Würth Elektronik eiSos GmbH & Co. KG
- Alexander Treml
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and Method for Vertically-Structured Passive Components
- Publication number 20140055968
- Publication date Feb 27, 2014
- Kong-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING LAMINATED DEVICE
- Publication number 20130011972
- Publication date Jan 10, 2013
- INFINEON TECHNOLOGIES AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assembly Method for Converting the Precursors to Capacitors
- Publication number 20120079717
- Publication date Apr 5, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Azuma Chikara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip Capacitor Precursors
- Publication number 20120081832
- Publication date Apr 5, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Azuma Chikara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR COUPLING A BATTERY WITHIN AN EMBEDDED SYSTEM
- Publication number 20120039053
- Publication date Feb 16, 2012
- David S. SLATON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip capacitor embedment method
- Publication number 20110179642
- Publication date Jul 28, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Han Kim
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Surface Mountable PPTC Device with Integral Weld Plate
- Publication number 20110183162
- Publication date Jul 28, 2011
- Tyco Electronics Corporation
- Daniel A. Chandler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board with embedded chip capacitor
- Publication number 20110180312
- Publication date Jul 28, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Han Kim
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Apparatus and Method for Vertically-Structured Passive Components
- Publication number 20110085311
- Publication date Apr 14, 2011
- Wintec Industries, Inc.
- Kong-Chen Chen
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
EMBEDDED LAMINATED DEVICE
- Publication number 20110031611
- Publication date Feb 10, 2011
- INFINEON TECHNOLOGIES AG
- Martin Standing
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low Profile Discrete Electronic Components and Applications of Same
- Publication number 20100165525
- Publication date Jul 1, 2010
- Interconnect Portfolio LLC
- Joseph C. Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR COUPLING A BATTERY WITHIN AN EMBEDDED SYSTEM
- Publication number 20100083497
- Publication date Apr 8, 2010
- David S. SLATON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD FOR MEMORY CARD, AND MEMORY CARD HAVING THE SAME
- Publication number 20100055943
- Publication date Mar 4, 2010
- Jeong Hyun PARK
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100027228
- Publication date Feb 4, 2010
- IBIDEN CO., LTD.
- Kiyotaka TSUKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP CAPACITOR PRECURSORS, PACKAGED SEMICONDUCTORS, AND ASSEMBLY ME...
- Publication number 20090296310
- Publication date Dec 3, 2009
- Azuma Chikara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING PASSIVE COMPONENT BUMPS
- Publication number 20090273079
- Publication date Nov 5, 2009
- Sony Ericsson Mobile Communications AB
- J. Thomas Lovskog
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC COMPONENT BUILT-IN SUBSTRATE
- Publication number 20090215231
- Publication date Aug 27, 2009
- Shinko Electric Industries Co., Ltd.
- Osamu INOUE
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Circuit board configuration
- Publication number 20090183905
- Publication date Jul 23, 2009
- Conesys, Inc.
- Bruce Ray Lane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board with embedded chip capacitor and chip capacit...
- Publication number 20090085691
- Publication date Apr 2, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Han Kim
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Lead plate-attached coin-type battery whose lead plate is attached...
- Publication number 20080081253
- Publication date Apr 3, 2008
- Sanyo Electric Co., Ltd.
- Tomoyuki Shose
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multi-layer board with decoupling function
- Publication number 20070194876
- Publication date Aug 23, 2007
- Samsung Electro-Mechanics CO., LTD.
- Sung Taek Lim
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Printed circuit board with embedded electronic components
- Publication number 20060291173
- Publication date Dec 28, 2006
- Samsung Electro-Mechanics CO., LTD.
- Suk-Hyeon Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Embedded multilayer chip capacitor and printed circuit board having...
- Publication number 20060198079
- Publication date Sep 7, 2006
- Samsung Electro-Mechanics CO., LTD.
- Chang Hoon Shim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BATTERY HOLDER
- Publication number 20050287423
- Publication date Dec 29, 2005
- Jih-Chen Yeh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Direct current cut structure
- Publication number 20050225408
- Publication date Oct 13, 2005
- FUJITSU LIMITED
- Takatoshi Yagisawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Surface mountable PPTC device with integral weld plate
- Publication number 20050200447
- Publication date Sep 15, 2005
- Daniel A. Chandler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical devices
- Publication number 20040246092
- Publication date Dec 9, 2004
- Gregory A. Graves
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
AC coupling circuit having a large capacitance and a good frequency...
- Publication number 20040223306
- Publication date Nov 11, 2004
- Tomokazu Katsuyama
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Disc shaped leadless component

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device including coin-cell battery

Holder for a button cell, arrangement comprising a holder, and meth...

Chip capacitors

Assembly method for converting the precursors to capacitors

Apparatus and method for vertically-structured passive components

Method of producing laminated device

Surface mountable PPTC device with integral weld plate

Apparatus and method for vertically-structured passive components

Semiconductor device and method for manufacturing the same

Low profile discrete electronic components and applications of same

Embedded laminated device

Printed circuit board with embedded chip capacitor

Method of manufacturing electronic component built-in substrate

Method for coupling a battery within an embedded system

Surface mountable PPTC device with integral weld plate

Providing an embedded capacitor in a circuit board

Low profile discrete electronic components and applications of same

Circuit board configuration

Lead plate-attached coin-type battery whose lead plate is attached...

Embedded multilayer chip capacitor and printed circuit board having...

Multi-layer board with decoupling function

Battery holder

Electrical devices

AC coupling circuit having a large capacitance and a good frequency...

Press-activated electronic component discharging facilitating appar...

Circuit protection device

Direct current cut structure

Single layer capacitor with dissimilar metallizations

Electronic package having a flexible substrate with ends connected...

Device for interconnecting, in three dimensions, electronic components

Patents Applicationslast 30 patents

ELECTRONIC DEVICE INCLUDING COIN-CELL BATTERY

Holder for a Button Cell, Arrangement Comprising a Holder, and Meth...

Apparatus and Method for Vertically-Structured Passive Components

METHOD OF PRODUCING LAMINATED DEVICE

Assembly Method for Converting the Precursors to Capacitors

Chip Capacitor Precursors

SYSTEM AND METHOD FOR COUPLING A BATTERY WITHIN AN EMBEDDED SYSTEM

Chip capacitor embedment method

Surface Mountable PPTC Device with Integral Weld Plate

Printed circuit board with embedded chip capacitor

Apparatus and Method for Vertically-Structured Passive Components

EMBEDDED LAMINATED DEVICE

Low Profile Discrete Electronic Components and Applications of Same

SYSTEM AND METHOD FOR COUPLING A BATTERY WITHIN AN EMBEDDED SYSTEM

CIRCUIT BOARD FOR MEMORY CARD, AND MEMORY CARD HAVING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

CHIP CAPACITOR PRECURSORS, PACKAGED SEMICONDUCTORS, AND ASSEMBLY ME...

SEMICONDUCTOR PACKAGE HAVING PASSIVE COMPONENT BUMPS

METHOD OF MANUFACTURING ELECTRONIC COMPONENT BUILT-IN SUBSTRATE

Circuit board configuration

Printed circuit board with embedded chip capacitor and chip capacit...

Lead plate-attached coin-type battery whose lead plate is attached...

Multi-layer board with decoupling function

Printed circuit board with embedded electronic components

Embedded multilayer chip capacitor and printed circuit board having...

BATTERY HOLDER

Direct current cut structure

Surface mountable PPTC device with integral weld plate

Electrical devices

AC coupling circuit having a large capacitance and a good frequency...