Multi-layer board with decoupling function

Abstract

A multi-layer board having a superior decoupling function in a low frequency band and a radio frequency band. The multi-layer board includes a board body having a plurality of stacked dielectric layers, power terminals connected through a via, ground terminals connected through a via and an integrated circuit component connected to the power and ground terminals. The multi-layer board also includes a power line unit connected to the power terminals and the integrated circuit component and a ground line unit connected to the ground terminals and the integrated circuit component. The multi-layer board further includes at least one multilayer chip capacitor mounted on the board body and connected between the power terminal and the ground terminal formed on the board body and at least one thin film capacitor mounted inside the board body and connected between the power line unit and the ground line unit.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features and other advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

FIG. 1 is a structural diagram illustrating a conventional multi-layer board having a Multilayer Chip Capacitor (MLCC);

FIG. 2 is an equivalent circuit diagram illustrating decoupling capacitance between a power line and a ground line of FIG. 1;

FIG. 3 is a structural diagram illustrating a multi-layer board having a decoupling function according to the present invention;

FIG. 4 is a partially enlarged structural diagram, illustrating the multi-layer board including a thin film capacitor shown in FIG. 3;

FIG. 5 is an equivalent circuit diagram illustrating decoupling capacitance between a power line and a ground line of FIG. 3;

FIG. 6 is a graph comparing the frequency response characteristics between the multi-layer board according to the present invention and the conventional multi-layer board having a Low Inductance Ceramic Capacitor (LICC); and

FIG. 7 is a graph comparing the frequency characteristics between the multi-layer board according to the present invention and the conventional multi-layer board having a Super Low Inductance Capacitor (SLIC).

Claims

1. A multi-layer board having a decoupling function comprising: a board body having a plurality of stacked dielectric layers, power and ground terminals formed on upper and lower surfaces thereof, the power terminals formed on the upper and lower surfaces thereof connected with each other through a power via and the ground terminals formed on upper and lower surfaces thereof connected with each other through a ground via, and an integrated circuit component mounted on the upper surface thereof and connected to the power terminals and the ground terminals;a power line unit formed on a predetermined one of the plurality of dielectric layers of the board body, the power line unit connected to the power terminals and the integrated chip component;a ground line unit formed on a predetermined one of the plurality of dielectric layers of the board body, the groundline unit connected to the ground terminals and the integrated circuit component;at least one multilayer chip capacitor mounted on the upper surface of the board body and connected between the power terminal and the ground terminal formed on the upper surface of the board body; andat least one thin film capacitor mounted inside the board body and connected between the power line unit and the ground line unit.

2. The multi-layer board according to claim 1, wherein the power line unit comprises: a first power line formed on the upper surface of the board body and connected to the power terminal formed on the upper surface of the board body; anda second power line formed inside the board body and connected to the power via connecting the power terminals formed on the upper and lower surfaces of the board body.

3. The multi-layer board according to claim 2, wherein, the thin film capacitor is connected between the first power line and the ground line unit.

4. The multi-layer board according to claim 2, wherein the thin film capacitor is connected between the second power line and the ground line unit.