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H01L2924/30205

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/30205Discharge

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including uneven structures and electronic de...
- Patent number 12,347,795
- Issue date Jul 1, 2025
- Samsung Electronics Co., Ltd.
- Bonggyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer reconstitution and die-stitching
- Patent number 12,322,730
- Issue date Jun 3, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming same
- Patent number 12,300,590
- Issue date May 13, 2025
- JCET GROUP CO., LTD.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable large system based on organic interconnect
- Patent number 12,237,269
- Issue date Feb 25, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package
- Patent number 12,166,014
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a passivation layer and method of making
- Patent number 12,002,771
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,916,059
- Issue date Feb 27, 2024
- Infineon Technologies AG
- Andre Schmenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer reconstitution and die-stitching
- Patent number 11,735,567
- Issue date Aug 22, 2023
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,594,500
- Issue date Feb 28, 2023
- Samsung Electronics Co., Ltd.
- Se-Jin Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,532,599
- Issue date Dec 20, 2022
- Monolitic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and manufacturing method thereof
- Patent number 11,373,981
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,342,287
- Issue date May 24, 2022
- Kioxia Corporation
- Daisuke Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic discharge protection in integrated circuits using mat...
- Patent number 11,289,431
- Issue date Mar 29, 2022
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer reconstitution and die-stitching
- Patent number 11,158,607
- Issue date Oct 26, 2021
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,127,733
- Issue date Sep 21, 2021
- Infineon Technologies AG
- Andre Schmenn
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Package structure
- Patent number 11,088,095
- Issue date Aug 10, 2021
- NANYA TECHNOLOGY CORPORATION
- Liang-Pin Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a passivation layer
- Patent number 11,018,100
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 10,950,588
- Issue date Mar 16, 2021
- Industrial Technology Research Institute
- Cheng-Hung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package
- Patent number 10,903,177
- Issue date Jan 26, 2021
- Samsung Electronics Co. Ltd.
- Se-Jin Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with package-level configurability
- Patent number 10,867,991
- Issue date Dec 15, 2020
- Micron Technology, Inc.
- Kevin G. Duesman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and lead frame with resin
- Patent number 10,847,693
- Issue date Nov 24, 2020
- Nichia Corporation
- Ryohei Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit device, oscillator, electronic apparatus, and moving object
- Patent number 10,685,928
- Issue date Jun 16, 2020
- Seiko Epson Corporation
- Takehiro Yamamoto
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Reflection-canceling package trace design
- Patent number 10,685,942
- Issue date Jun 16, 2020
- CREDO TECHNOLOGY GROUP LIMITED
- Xike Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing an electronic device and electronic device
- Patent number 10,622,346
- Issue date Apr 14, 2020
- Infineon Technologies AG
- Andre Schmenn
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device having a passivation layer and method of makin...
- Patent number 10,290,596
- Issue date May 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to electrostatic discharge protection b...
- Patent number 10,020,269
- Issue date Jul 10, 2018
- Skyworks Solutions. Inc.
- Kim Rene Smith
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Transient voltage suppressor apparatus
- Patent number 9,954,355
- Issue date Apr 24, 2018
- UBIQ Semiconductor Corp.
- Chih-Hao Chen
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electrostatic discharge protection apparatus and process
- Patent number 9,941,239
- Issue date Apr 10, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chien Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 9,881,892
- Issue date Jan 30, 2018
- Novatek Microelectronics Corp.
- Jung-Fu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to interconnect conductors to reduce de...
- Patent number 9,735,117
- Issue date Aug 15, 2017
- Skyworks Solutions, Inc.
- Kim Rene Smith
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
3D STACK PACKAGE STRUCTURE
- Publication number 20250192105
- Publication date Jun 12, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250168984
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jin Duck PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER RECONSTITUTION AND DIE-STITCHING
- Publication number 20250157991
- Publication date May 15, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Scalable Large System Based on Organic Interconnect
- Publication number 20250157936
- Publication date May 15, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DISCHARGE DEVICES WITH METALLIZED DIES
- Publication number 20250140620
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Thomas KRONENBERG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062289
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH MULTIPLE STACKED PASSIVE DEVICES
- Publication number 20240421128
- Publication date Dec 19, 2024
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387413
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Jaejun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A PASSIVATION LAYER
- Publication number 20240321787
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lung SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240203812
- Publication date Jun 20, 2024
- RENESAS ELECTRONICS CORPORATION
- Takamichi HOSOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light Emitting Diode Package and Manufacturing Method of The Same,...
- Publication number 20240170468
- Publication date May 23, 2024
- LG Display Co., Ltd.
- Sunghyun Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT
- Publication number 20240162192
- Publication date May 16, 2024
- International Business Machines Corporation
- Arvind Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY AND SEMICONDUCTOR PACKAGE SUBSTRATE...
- Publication number 20240153890
- Publication date May 9, 2024
- King Yuan Electronics Co., Ltd.
- Chia Fong CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240147606
- Publication date May 2, 2024
- Innolux Corporation
- Mu-Fan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-ON-WAFER PACKAGING WITH CONTINUOUS SEAL RING
- Publication number 20240030168
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER RECONSTITUTION AND DIE-STITCHING
- Publication number 20240014178
- Publication date Jan 11, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-WAFER-ON-BOARD STRUCTURE USING SPACER DIE AND METHODS OF FO...
- Publication number 20230420429
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Kai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230411328
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Shinya ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20230307387
- Publication date Sep 28, 2023
- KIOXIA Corporation
- Ayako KAWANISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Scalable Large System Based on Organic Interconnect
- Publication number 20230299007
- Publication date Sep 21, 2023
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20230187396
- Publication date Jun 15, 2023
- SK HYNIX INC.
- Sung Lae OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ELECTRICAL CONTACT STRUCTURES AND RELATED MET...
- Publication number 20220384204
- Publication date Dec 1, 2022
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
- Publication number 20220375861
- Publication date Nov 24, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE
- Publication number 20220271012
- Publication date Aug 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20220208667
- Publication date Jun 30, 2022
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER RECONSTITUTION AND DIE-STITCHING
- Publication number 20220013504
- Publication date Jan 13, 2022
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210280537
- Publication date Sep 9, 2021
- KIOXIA Corporation
- Daisuke KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A PASSIVATION LAYER AND METHOD OF MAKING
- Publication number 20210265292
- Publication date Aug 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lung SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DISCHARGE PROTECTION IN INTEGRATED CIRCUITS USING MAT...
- Publication number 20210202403
- Publication date Jul 1, 2021
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE
- Publication number 20210118824
- Publication date Apr 22, 2021
- Samsung Electronics Co., Ltd.
- Se-Jin YOO
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package including uneven structures and electronic de...

Wafer reconstitution and die-stitching

Package structure and method for forming same

Scalable large system based on organic interconnect

Manufacturing method of package

Semiconductor device having a passivation layer and method of making

Electronic device

Wafer reconstitution and die-stitching

Semiconductor package

3D semiconductor device and structure with metal layers

Package and manufacturing method thereof

Semiconductor device

Electrostatic discharge protection in integrated circuits using mat...

Wafer reconstitution and die-stitching

Electronic device

Package structure

Semiconductor device having a passivation layer

Chip package structure and manufacturing method thereof

Method of manufacturing a semiconductor package

Semiconductor devices with package-level configurability

Light emitting device and lead frame with resin

Circuit device, oscillator, electronic apparatus, and moving object

Reflection-canceling package trace design

Method for manufacturing an electronic device and electronic device

Semiconductor device having a passivation layer and method of makin...

Devices and methods related to electrostatic discharge protection b...

Transient voltage suppressor apparatus

Electrostatic discharge protection apparatus and process

Integrated circuit device

Devices and methods related to interconnect conductors to reduce de...

Patents Applicationslast 30 patents

3D STACK PACKAGE STRUCTURE

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

WAFER RECONSTITUTION AND DIE-STITCHING

Scalable Large System Based on Organic Interconnect

ELECTROSTATIC DISCHARGE DEVICES WITH METALLIZED DIES

PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH MULTIPLE STACKED PASSIVE DEVICES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING A PASSIVATION LAYER

SEMICONDUCTOR DEVICE

Light Emitting Diode Package and Manufacturing Method of The Same,...

STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT

SEMICONDUCTOR PACKAGE ASSEMBLY AND SEMICONDUCTOR PACKAGE SUBSTRATE...

ELECTRONIC DEVICE

WAFER-ON-WAFER PACKAGING WITH CONTINUOUS SEAL RING

WAFER RECONSTITUTION AND DIE-STITCHING

CHIP-ON-WAFER-ON-BOARD STRUCTURE USING SPACER DIE AND METHODS OF FO...

SEMICONDUCTOR DEVICE

MEMORY DEVICE

Scalable Large System Based on Organic Interconnect

SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR PACKAGE ELECTRICAL CONTACT STRUCTURES AND RELATED MET...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS

MANUFACTURING METHOD OF PACKAGE

PACKAGE STRUCTURE AND METHOD FOR FORMING SAME

WAFER RECONSTITUTION AND DIE-STITCHING

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING A PASSIVATION LAYER AND METHOD OF MAKING

ELECTROSTATIC DISCHARGE PROTECTION IN INTEGRATED CIRCUITS USING MAT...

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE