Discrete devices

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H01L2924/13

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/13Discrete devices

Industries

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Patents Grantslast 30 patents

Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 12,368,138
- Issue date Jul 22, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with through-substrate interconnects and as...
- Patent number 12,368,096
- Issue date Jul 22, 2025
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive based on standard commodity FPGA IC chips using non-vol...
- Patent number 12,368,438
- Issue date Jul 22, 2025
- iCometrue Company Ltd.
- Jin-Yuan Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Structures for providing electrical isolation in semiconductor devices
- Patent number 12,368,139
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chan-Hong Chern
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench-gate power MOSFET with buried field plates
- Patent number 12,363,984
- Issue date Jul 15, 2025
- Kabushiki Kaisha Toshiba
- Saya Shimomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,362,331
- Issue date Jul 15, 2025
- Fuji Electric Co., Ltd.
- Hayato Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure
- Patent number 12,362,219
- Issue date Jul 15, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,355,015
- Issue date Jul 8, 2025
- Kabushiki Kaisha Toshiba
- Tomohiro Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices with backside bond pads under a memory array
- Patent number 12,354,982
- Issue date Jul 8, 2025
- Eric N. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,347,756
- Issue date Jul 1, 2025
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 12,347,813
- Issue date Jul 1, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having biometric sensors and light emitting units
- Patent number 12,349,544
- Issue date Jul 1, 2025
- Innolux Corporation
- Chandra Lius
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device comprising PN junction diode and Schottky barr...
- Patent number 12,341,135
- Issue date Jun 24, 2025
- Rohm Co., Ltd.
- Keiji Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 12,341,107
- Issue date Jun 24, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yi Seul Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,334,466
- Issue date Jun 17, 2025
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,334,409
- Issue date Jun 17, 2025
- Fuji Electric Co., Ltd.
- Yasufumi Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with improved inspectability of stacked semico...
- Patent number 12,334,418
- Issue date Jun 17, 2025
- Denso Corporation
- Syuhei Miyachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,327,808
- Issue date Jun 10, 2025
- Hitachi Power Semiconductor Device, Ltd.
- Naoki Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 12,322,683
- Issue date Jun 3, 2025
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming microelectromechanical s...
- Patent number 12,319,564
- Issue date Jun 3, 2025
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Switching device and electronic circuit
- Patent number 12,316,307
- Issue date May 27, 2025
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,315,823
- Issue date May 27, 2025
- Kabushiki Kaisha Toshiba
- Yoshiharu Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oscillator with fin field-effect transistor (FinFET) resonator
- Patent number 12,316,276
- Issue date May 27, 2025
- Apple Inc.
- Harald Pretl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Limiting failures caused by dendrite growth on semiconductor chips
- Patent number 12,315,836
- Issue date May 27, 2025
- Wolfspeed, Inc.
- Dan Namishia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor module
- Patent number 12,308,355
- Issue date May 20, 2025
- Murata Manufacturing Co., Ltd.
- Takayuki Tsutsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 12,308,305
- Issue date May 20, 2025
- Mitsubishi Electric Corporation
- Daisuke Oya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including semiconductor chip having power tran...
- Patent number 12,308,356
- Issue date May 20, 2025
- Renesas Electronics Corporation
- Toshiyuki Hata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system and related methods
- Patent number 12,308,297
- Issue date May 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yushuang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,308,350
- Issue date May 20, 2025
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Takeshi Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,300,624
- Issue date May 13, 2025
- INNOLUX CORPORATION
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW WARPAGE HIGH DENSITY TRENCH CAPACITOR
- Publication number 20250240981
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Jyun-Ying LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250239534
- Publication date Jul 24, 2025
- Innolux Corporation
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20250239555
- Publication date Jul 24, 2025
- ROHM CO., LTD.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250239560
- Publication date Jul 24, 2025
- Mitsubishi Electric Corporation
- Tetsuo YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING DEVICE AND ELECTRONIC CIRCUIT
- Publication number 20250240006
- Publication date Jul 24, 2025
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGING WITH GALVANIC ISOLATION
- Publication number 20250233055
- Publication date Jul 17, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Cristina ESTACIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED COOLING SEMICONDUCTOR DEVICE
- Publication number 20250233032
- Publication date Jul 17, 2025
- Power Master Semiconductor Co., Ltd.
- Ki-Myung YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250226296
- Publication date Jul 10, 2025
- ROHM CO., LTD.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HEAT FLOW RESTRICTING CONNECTOR
- Publication number 20250226351
- Publication date Jul 10, 2025
- Infineon Technologies Austria AG
- Bhargav Pandya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Devices Including Shape-Memory Metallization
- Publication number 20250226338
- Publication date Jul 10, 2025
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE SEMICONDUCTOR PACKAGE
- Publication number 20250226295
- Publication date Jul 10, 2025
- Infineon Technologies Austria AG
- Bhargav Pandya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL PATH TO CARRIER SUB...
- Publication number 20250218891
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Shih Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF
- Publication number 20250218899
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Isha Datye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250218993
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tian HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH COMPONENT-CARRYING INTERMEDIATE STRUCTURE AND ADDITION...
- Publication number 20250218914
- Publication date Jul 3, 2025
- INFINEON TECHNOLOGIES AG
- Hao ZHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE, MOTOR CONTROLLER, AND VEHICLE
- Publication number 20250221011
- Publication date Jul 3, 2025
- BYD COMPANY LIMITED
- Rui HU
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR POWER MODULE
- Publication number 20250219025
- Publication date Jul 3, 2025
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210503
- Publication date Jun 26, 2025
- Kabushiki Kaisha Toshiba
- Fumiyoshi KAWASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210532
- Publication date Jun 26, 2025
- ROHM CO., LTD.
- Oji SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND RADIO FREQUENCY POWER AMPLIFIER
- Publication number 20250212432
- Publication date Jun 26, 2025
- Murata Manufacturing Co., Ltd.
- Kenji SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250210424
- Publication date Jun 26, 2025
- ROHM CO., LTD.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210504
- Publication date Jun 26, 2025
- Kabushiki Kaisha Toshiba
- Masashi ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20250210553
- Publication date Jun 26, 2025
- UNITED MICROELECTRONICS CORP.
- Yao-Hsien Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER DEVICE, AND POWER MODULE
- Publication number 20250210574
- Publication date Jun 26, 2025
- Kabushiki Kaisha Toshiba
- Fumiyoshi KAWASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER STAGE DEVICE CLIP
- Publication number 20250210579
- Publication date Jun 26, 2025
- NEXPERIA B.V.
- Dolores Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250212480
- Publication date Jun 26, 2025
- Kabushiki Kaisha Toshiba
- Yoshiki Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR POWER CONTROL IN 3D STACKED DIE
- Publication number 20250210497
- Publication date Jun 26, 2025
- ADVANCED MICRO DEVICES, INC.
- Stephen Dussinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroless Deposition Process for Semiconductor Devices
- Publication number 20250201740
- Publication date Jun 19, 2025
- Wolfspeed, Inc.
- Meagan Lenore Coleman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250201673
- Publication date Jun 19, 2025
- RENESAS ELECTRONICS CORPORATION
- Kazuki MATSUMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250201678
- Publication date Jun 19, 2025
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS

Discrete devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

3D semiconductor device and structure with metal layers

Microelectronic devices with through-substrate interconnects and as...

Logic drive based on standard commodity FPGA IC chips using non-vol...

Structures for providing electrical isolation in semiconductor devices

Trench-gate power MOSFET with buried field plates

Semiconductor device and manufacturing method thereof

3D semiconductor memory device and structure

Semiconductor device

Memory devices with backside bond pads under a memory array

Semiconductor device

Semiconductor package and related methods

Electronic device having biometric sensors and light emitting units

Semiconductor device comprising PN junction diode and Schottky barr...

Semiconductor device and method of manufacturing thereof

Semiconductor module

Semiconductor module

Semiconductor module with improved inspectability of stacked semico...

Semiconductor device

Power module semiconductor device and inverter equipment, and fabri...

Semiconductor device and method of forming microelectromechanical s...

Switching device and electronic circuit

Semiconductor device

Oscillator with fin field-effect transistor (FinFET) resonator

Limiting failures caused by dendrite growth on semiconductor chips

Semiconductor device and semiconductor module

Power semiconductor device

Semiconductor device including semiconductor chip having power tran...

Semiconductor package system and related methods

Semiconductor device

Electronic device

Patents Applicationslast 30 patents

LOW WARPAGE HIGH DENSITY TRENCH CAPACITOR

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SWITCHING DEVICE AND ELECTRONIC CIRCUIT

ELECTRONIC DEVICE PACKAGING WITH GALVANIC ISOLATION

DOUBLE-SIDED COOLING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE WITH HEAT FLOW RESTRICTING CONNECTOR

Power Semiconductor Devices Including Shape-Memory Metallization

MULTI-DIE SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL PATH TO CARRIER SUB...

INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

PACKAGE WITH COMPONENT-CARRYING INTERMEDIATE STRUCTURE AND ADDITION...

SEMICONDUCTOR POWER MODULE, MOTOR CONTROLLER, AND VEHICLE

SEMICONDUCTOR POWER MODULE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND RADIO FREQUENCY POWER AMPLIFIER

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICE, POWER DEVICE, AND POWER MODULE

POWER STAGE DEVICE CLIP

SEMICONDUCTOR DEVICE

SYSTEMS AND METHODS FOR POWER CONTROL IN 3D STACKED DIE

Electroless Deposition Process for Semiconductor Devices

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME