Dispersed materials

Industry

CPC
H05K1/092

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/092Dispersed materials

Industries

Patents Grantslast 30 patents

Information Patent Grant
Conductive paste and electronic device
- Patent number 12,224,081
- Issue date Feb 11, 2025
- BEIJING DREAM INK TECHNOLOGIES CO., LTD.
- Zhongwei Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring
- Patent number 12,223,147
- Issue date Feb 11, 2025
- Japan Aviation Electronics Industry, Limited
- Akitoshi Sakaue
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Conductive ink interconnected devices
- Patent number 12,213,250
- Issue date Jan 28, 2025
- NCR Voyix Corporation
- John Paul Bacalso Aliganga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Branched proximal connectors for high density neural interfaces
- Patent number 12,186,570
- Issue date Jan 7, 2025
- VERILY LIFE SCIENCES LLC
- Bo Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring
- Patent number 12,182,369
- Issue date Dec 31, 2024
- Japan Aviation Electronics Industry, Limited
- Akitoshi Sakaue
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board
- Patent number 12,101,880
- Issue date Sep 24, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hee-Joon Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive resin composition, circuit board fabricated using conduc...
- Patent number 12,094,622
- Issue date Sep 17, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tomohiro Fukao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible and stretchable structures
- Patent number 12,096,563
- Issue date Sep 17, 2024
- Liquid Wire Inc.
- Mark William Ronay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic textiles and methods for fabrication thereof
- Patent number 12,075,564
- Issue date Aug 27, 2024
- Purdue Research Foundation
- Chi Hwan Lee
- D06 - TREATMENT OF TEXTILES OR THE LIKE LAUNDERING FLEXIBLE MATERIALS NOT OTH...
Information Patent Grant
Pure copper plate, copper/ceramic bonded body, and insulated circui...
- Patent number 12,035,469
- Issue date Jul 9, 2024
- Mitsubishi Materials Corporation
- Hirotaka Matsunaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroconductive substrate having metal wiring, method for produci...
- Patent number 12,035,470
- Issue date Jul 9, 2024
- Tanaka Kikinzoku Kogyo K.K.
- Kenjiro Koshiji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable mounting board and method for manufacturing stretchable...
- Patent number 12,035,464
- Issue date Jul 9, 2024
- Murata Manufacturing Co., Ltd.
- Yui Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection body, method for manufacturing connection body, and conn...
- Patent number 12,034,260
- Issue date Jul 9, 2024
- Dexerials Corporation
- Ryota Aizaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting method and mounting structure formed by the same
- Patent number 12,028,986
- Issue date Jul 2, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Naomichi Ohashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for preparing same, and electronic device
- Patent number 12,028,965
- Issue date Jul 2, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Qing Gong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Additively manufactured metal energetic ligand precursors and combu...
- Patent number 12,017,279
- Issue date Jun 25, 2024
- Triad National Security, LLC
- Bryce Tappan
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Rules for sensor integrated substrates
- Patent number 12,011,942
- Issue date Jun 18, 2024
- Smith & Nephew PLC
- Allan Kenneth Frazer Grugeon Hunt
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Printed wiring
- Patent number 12,014,012
- Issue date Jun 18, 2024
- Japan Aviation Electronics Industry, Limited
- Akitoshi Sakaue
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Ceramic-based circuit board assemblies formed using metal nanoparti...
- Patent number 12,016,118
- Issue date Jun 18, 2024
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive device, method for producing conductive device, and radio
- Patent number 12,009,586
- Issue date Jun 11, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takuya Mino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molecular ink and method for printing resistive film coatings
- Patent number 11,999,864
- Issue date Jun 4, 2024
- LIQUID X PRINTED METALS, INC.
- Robert Swisher
- G01 - MEASURING TESTING
Information Patent Grant
Printed film electrostatic concentration for radon detection
- Patent number 11,977,194
- Issue date May 7, 2024
- National Research Council of Canada
- Ryan Hunter Griffin
- G01 - MEASURING TESTING
Information Patent Grant
Circuit board for transmitting high-frequency signal and method for...
- Patent number 11,950,357
- Issue date Apr 2, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Fu-Yun Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Highly electrically conductive silver ink composition and wiring ob...
- Patent number 11,939,482
- Issue date Mar 26, 2024
- DIC Corporation
- Saori Yamaguchi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Transparent conductive circuit
- Patent number 11,943,865
- Issue date Mar 26, 2024
- Chasm Advanced Materials, Inc.
- Richard P. Heroux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor and method for operating sensor
- Patent number 11,933,754
- Issue date Mar 19, 2024
- LG Electronics Inc.
- Myungwon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic cover
- Patent number 11,920,765
- Issue date Mar 5, 2024
- ABB Schweiz AG
- Fabrice Martins
- F21 - LIGHTING
Information Patent Grant
Pattern transfer printing systems and methods
- Patent number 11,910,537
- Issue date Feb 20, 2024
- Wuhan DR Laser Technology Corp,. LTD
- Gad Igra
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method and system for fabricating cross-layer pattern
- Patent number 11,904,525
- Issue date Feb 20, 2024
- Stratasys Ltd.
- Daniel Dikovsky
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Copper ink for high conductivity fine printing
- Patent number 11,891,532
- Issue date Feb 6, 2024
- Bhavana Deore
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240414850
- Publication date Dec 12, 2024
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SYSTEM FOR PROVIDING ILLUMINATING OBJECTS WITHIN SUBSTRATE
- Publication number 20240349424
- Publication date Oct 17, 2024
- John Simonetti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DESIGN RULES FOR SENSOR INTEGRATED SUBSTRATES
- Publication number 20240316972
- Publication date Sep 26, 2024
- Smith & Nephew PLC
- Allan Kenneth Frazer Grugeon Hunt
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
CIRCUIT DEVICE
- Publication number 20240306294
- Publication date Sep 12, 2024
- AUO Corporation
- CHUN-YUEH HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC-BASED CIRCUIT BOARD ASSEMBLIES FORMED USING METAL NANOPARTI...
- Publication number 20240292531
- Publication date Aug 29, 2024
- Kuprion Inc.
- Alfred A. ZINN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SYSTEM FOR PROVIDING A COMPOSITE OF CIRCUITRY AND FABRIC
- Publication number 20240283452
- Publication date Aug 22, 2024
- HTI Technology and Industries, Inc.
- John Simonetti
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PRINTED WIRING
- Publication number 20240272754
- Publication date Aug 15, 2024
- Japan Aviation Electronics Industry, Limited
- Akitoshi SAKAUE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Transparent Conductive Circuit
- Publication number 20240276638
- Publication date Aug 15, 2024
- Chasm Advanced Materials, Inc.
- Richard P. Heroux
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FABRICATING FUNCTIONAL CIRCUITS ON 3D FREEFORM SURFACES VIA INTENSE...
- Publication number 20240276648
- Publication date Aug 15, 2024
- The Penn State Research Foundation
- Ning Yi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND CHIP PACKAGE COMPRISING SAME
- Publication number 20240268031
- Publication date Aug 8, 2024
- LG Innotek Co., Ltd.
- In Jae LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240244745
- Publication date Jul 18, 2024
- BEIJING DREAM INK TECHNOLOGIES CO., LTD.
- Zhongwei REN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE RESIN COMPOSITION
- Publication number 20240228745
- Publication date Jul 11, 2024
- SAKATA INX CORPORATION
- Yuki SHIRAKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fully Printed Sensor with Internal Ion Reservoirs
- Publication number 20240237206
- Publication date Jul 11, 2024
- The Regents of the University of Colorado, a Body Corporate
- Elliot J. STRAND
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING
- Publication number 20240184409
- Publication date Jun 6, 2024
- Japan Aviation Electronics Industry, Limited
- Akitoshi SAKAUE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGING STRUCTURE, PACKAGING SUBSTRATE, AND MANUFACTURING METHOD...
- Publication number 20240170301
- Publication date May 23, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- ZHI-CHENG LAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR ADDITIVE MANUFACTURING OF ELECTRONICS
- Publication number 20240164016
- Publication date May 16, 2024
- Aviv Mordechai RONEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING HIGHLY SUSTAINAB...
- Publication number 20240147631
- Publication date May 2, 2024
- Liquid Wire, LLC
- Jorge E. Carbo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CONFORMAL HIGH TEMPERATURE ELECTRONICS USING COPPER NANOINK
- Publication number 20240101850
- Publication date Mar 28, 2024
- The Research Foundation for The State University of New York
- Shenqiang REN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID SOFT-RIGID ELECTRICAL INTERCONNECTION SYSTEM
- Publication number 20240091528
- Publication date Mar 21, 2024
- ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE (EPFL)
- Florian FALLEGGER
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
CIRCUIT BOARD CONNECTION STRUCTURE AND PREPARATION METHOD THEREFOR
- Publication number 20240098908
- Publication date Mar 21, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHIH-CHIEH FU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE RESIN COMPOSITION
- Publication number 20240084154
- Publication date Mar 14, 2024
- SAKATA INX CORPORATION
- Masayuki SASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE INK INTERCONNECTED DEVICES
- Publication number 20240074045
- Publication date Feb 29, 2024
- NCR Corporation
- John Paul Bacalso Aliganga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20240049398
- Publication date Feb 8, 2024
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
A METHOD FOR MAKING A LIGHTING DEVICE
- Publication number 20240032199
- Publication date Jan 25, 2024
- SIGNFY HOLDING B.V.
- Aldegonda Lucia WEIJERS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD AND METHOD FOR PRODUCING WIRING CIRCUIT BOARD
- Publication number 20240015884
- Publication date Jan 11, 2024
- Nitto Denko Corporation
- Shusaku SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIRECT METAL PRINTING WITH STEREOLITHOGRAPHY
- Publication number 20230405918
- Publication date Dec 21, 2023
- Arizona Board of Regents on behalf of Arizona State University
- Zhi Zhao
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Printed Circuit Board and Manufacturing Method Thereof
- Publication number 20230413430
- Publication date Dec 21, 2023
- UNIMICRON TECHNOLOGY CORPORATION
- Po-Hsiang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE AQUEOUS INK COMPOSITION FOR FILLING IN ENGRAVED MICROPAT...
- Publication number 20230399533
- Publication date Dec 14, 2023
- DAEDONG CO., LTD.
- Seung Taeg LEE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DEVICE, SYSTEM AND MANUFACTURING METHOD FOR ELECTRONIC STRAIN SENSOR
- Publication number 20230400369
- Publication date Dec 14, 2023
- SLEEPTITE PTY LTD
- Cameron VAN DEN DUNGEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE STRUCTURE
- Publication number 20230371187
- Publication date Nov 16, 2023
- AMAZING COOL TECHNOLOGY CORPORATION
- Shiann-Tsong TSAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Dispersed materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Conductive paste and electronic device

Printed wiring

Conductive ink interconnected devices

Branched proximal connectors for high density neural interfaces

Printed wiring

Printed circuit board

Conductive resin composition, circuit board fabricated using conduc...

Flexible and stretchable structures

Electronic textiles and methods for fabrication thereof

Pure copper plate, copper/ceramic bonded body, and insulated circui...

Electroconductive substrate having metal wiring, method for produci...

Stretchable mounting board and method for manufacturing stretchable...

Connection body, method for manufacturing connection body, and conn...

Mounting method and mounting structure formed by the same

Circuit board and method for preparing same, and electronic device

Additively manufactured metal energetic ligand precursors and combu...

Rules for sensor integrated substrates

Printed wiring

Ceramic-based circuit board assemblies formed using metal nanoparti...

Conductive device, method for producing conductive device, and radio

Molecular ink and method for printing resistive film coatings

Printed film electrostatic concentration for radon detection

Circuit board for transmitting high-frequency signal and method for...

Highly electrically conductive silver ink composition and wiring ob...

Transparent conductive circuit

Sensor and method for operating sensor

Electronic cover

Pattern transfer printing systems and methods

Method and system for fabricating cross-layer pattern

Copper ink for high conductivity fine printing

Patents Applicationslast 30 patents

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD AND SYSTEM FOR PROVIDING ILLUMINATING OBJECTS WITHIN SUBSTRATE

DESIGN RULES FOR SENSOR INTEGRATED SUBSTRATES

CIRCUIT DEVICE

CERAMIC-BASED CIRCUIT BOARD ASSEMBLIES FORMED USING METAL NANOPARTI...

METHOD AND SYSTEM FOR PROVIDING A COMPOSITE OF CIRCUITRY AND FABRIC

PRINTED WIRING

Transparent Conductive Circuit

FABRICATING FUNCTIONAL CIRCUITS ON 3D FREEFORM SURFACES VIA INTENSE...

CIRCUIT BOARD AND CHIP PACKAGE COMPRISING SAME

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

CONDUCTIVE RESIN COMPOSITION

Fully Printed Sensor with Internal Ion Reservoirs

PRINTED WIRING

PACKAGING STRUCTURE, PACKAGING SUBSTRATE, AND MANUFACTURING METHOD...

SYSTEMS AND METHODS FOR ADDITIVE MANUFACTURING OF ELECTRONICS

DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING HIGHLY SUSTAINAB...

PRINTED CONFORMAL HIGH TEMPERATURE ELECTRONICS USING COPPER NANOINK

HYBRID SOFT-RIGID ELECTRICAL INTERCONNECTION SYSTEM

CIRCUIT BOARD CONNECTION STRUCTURE AND PREPARATION METHOD THEREFOR

CONDUCTIVE RESIN COMPOSITION

CONDUCTIVE INK INTERCONNECTED DEVICES

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

A METHOD FOR MAKING A LIGHTING DEVICE

WIRING CIRCUIT BOARD AND METHOD FOR PRODUCING WIRING CIRCUIT BOARD

DIRECT METAL PRINTING WITH STEREOLITHOGRAPHY

Printed Circuit Board and Manufacturing Method Thereof

CONDUCTIVE AQUEOUS INK COMPOSITION FOR FILLING IN ENGRAVED MICROPAT...

DEVICE, SYSTEM AND MANUFACTURING METHOD FOR ELECTRONIC STRAIN SENSOR

PACKAGE SUBSTRATE STRUCTURE