Disposition of the additional element

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H01L2224/05089

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05089Disposition of the additional element

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Patents Grantslast 30 patents

Information Patent Grant
Structure and method for semiconductor packaging
- Patent number 11,705,414
- Issue date Jul 18, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for bonding improvement
- Patent number 11,158,591
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Chan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for bonding improvement
- Patent number 10,734,339
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Chan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 9,269,732
- Issue date Feb 23, 2016
- Xintec Inc.
- Chia-Lun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increasing dielectric strength by optimizing dummy metal distribution
- Patent number 8,434,041
- Issue date Apr 30, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING PAD, INTEGRATED CIRCUIT ELEMENT, AND INTEGRATED CIRCUIT DEVICE
- Publication number 20240258254
- Publication date Aug 1, 2024
- Mitsubishi Electric Corporation
- Yuki TERADO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING
- Publication number 20230299027
- Publication date Sep 21, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE FOR BONDING IMPROVEMENT
- Publication number 20200357762
- Publication date Nov 12, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Chan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING
- Publication number 20190109105
- Publication date Apr 11, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Increasing Dielectric Strength by Optimizing Dummy Metal Distribution
- Publication number 20120180018
- Publication date Jul 12, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20110156218
- Publication date Jun 30, 2011
- Chia-Lun TSAI
- H01 - BASIC ELECTRIC ELEMENTS