Disposition of the redistribution layers

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H01L2224/0237

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/0237Disposition of the redistribution layers

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a semiconductor device including a pluralit...
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Information Patent Grant
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Information Patent Grant
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Disposition of the redistribution layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing a semiconductor device including a pluralit...

System, device and methods of manufacture

Semiconductor device with composite conductive features and method...

Semiconductor package and methods of forming the same

Stacked interposer structures

Barrier structures between external electrical connectors

Interposer and semiconductor package including the same

Stiffener package and method of fabricating stiffener package

Semiconductor device with redistribution structure

Semiconductor package with shared barrier layer in redistribution a...

Semiconductor packages and methods of forming the same

Sensor packages

Semiconductor device, circuit board structure and manufacturing met...

Semiconductor package structure and method for preparing the same

Semiconductor device and a manufacturing method thereof

Semiconductor device including via structure and method for manufac...

Display substrate and preparation method thereof, and display appar...

Fan-out package with cavity substrate

Manufacturing method of circuit carrier with chip mounted thereon

Fine pitch copper pillar package and method

Semiconductor device and method of manufacture

IC package including multi-chip unit with bonded integrated heat sp...

Semiconductor device with a dielectric between portions

Process control for package formation

Fan-out packages with warpage resistance

Methods of forming semiconductor structure

Stacked semiconductor devices and methods of forming same

Method of fabricating redistribution circuit structure

Embedded metal insulator metal structure

Semiconductor device packages and methods of manufacturing the same

Patents Applicationslast 30 patents

MICROELECTRONIC ASSEMBLIES

Advanced Device Assembly Structures And Methods

Heterogeneous Fan-Out Structure and Method of Manufacture

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYER AND METHOD THEREFOR

Method of Manufacturing a Package Having an Electronic Component an...

LIGHT EMITTING DIODE MODULE AND DISPLAY DEVICE HAVING THE SAME

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

FACE-TO-FACE THROUGH-SILICON VIA MULTI-CHIP SEMICONDUCTOR APPARATUS...

Semiconductor structure and forming method thereof

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

WRAP-AROUND SOURCE/DRAIN METHOD OF MAKING CONTACTS FOR BACKSIDE METALS

CONDUCTIVE LINES FOR INTERCONNECTION IN STACKED DEVICE STRUCTURES

METHOD OF FORMING PACKAGE

Semiconductor Interconnect Structure and Method

BONDING STRUCTURE AND METHOD OF FORMING SAME

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE HAVING WIRED UNDER BUMP STRUCTURE AND METHOD T...

Chip Package Structure with Bump

FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH

Package with Organic Integrated Circuit Substrate Embedded in Inorg...

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATI...

Semiconductor Package and Method of Manufacturing The Same

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

DUMMY METAL BONDING PADS FOR UNDERFILL APPLICATION IN SEMICONDUCTOR...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

REDUCTION OF CRACKS IN PASSIVATION LAYER