Disposition of the redistribution layers

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H01L2224/0237

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/0237Disposition of the redistribution layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
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- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit packages
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- Issue date Jul 22, 2025
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- Chen-Hua Yu
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
Package structure and method of forming the same
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- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
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- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating package structure including a plurality of an...
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- Issue date Jul 15, 2025
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
Chip redistribution structure and preparation method thereof
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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- Issue date Jun 24, 2025
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- Yi Seul Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
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- Issue date Jun 24, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
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- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sih-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,334,434
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 12,334,476
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lthc as charging barrier in info package formation
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- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including auxiliary dielectric portion
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- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for UBM/RDL routing
- Patent number 12,322,727
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layers around...
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- Issue date Jun 3, 2025
- Semtech Corporation
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Information Patent Grant
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- Taiwan Semiconductor Manufacturing Company, Ltd
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
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- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Tai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistribution plugs
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- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
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- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with improved interposer structure
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- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device having a dummy section
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- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Osamu Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package with controllable standoff
- Patent number 12,300,592
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

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- H01 - BASIC ELECTRIC ELEMENTS
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DISPLAY DEVICE
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- NANYA TECHNOLOGY CORPORATION
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INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE
- Publication number 20250201617
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
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WORKPIECE HOLDER, WAFER CHUCK, WAFER HOLDING METHOD
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- Taiwan Semiconductor Manufacturing Co., Ltd.
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SEMICONDUCTOR PACKAGE
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SEMICONDUCTOR PACKAGE
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- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hao HSU
- H01 - BASIC ELECTRIC ELEMENTS
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PACKAGE STRUCTURE
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- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
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METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A PLURALIT...
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- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Yuan Li
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SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
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- Min Seung JI
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STACKED INTERPOSER STRUCTURES, AND RELATED METHODS
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- Owen R. FAY
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SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
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- Taiwan Semiconductor Manufacturing Company, Ltd.
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- H01 - BASIC ELECTRIC ELEMENTS
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INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
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- Jungsoo BYUN
- H01 - BASIC ELECTRIC ELEMENTS
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System, Device and Methods of Manufacture
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- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
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- Publication date Apr 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Chih-Jing HSU
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SEMICONDUCTOR PACKAGE AND METHODS OF FORMING THE SAME
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- Publication date Apr 24, 2025
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Semiconductor Device Including Via Structure And Method For Manufac...
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- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Disposition of the redistribution layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method

Hybrid integrated circuit packages

Methods of forming semiconductor packages

Fan out package with integrated peripheral devices and methods

Semiconductor device including through die via

Package structure and method of forming the same

Method for fabricating a chip package

Method of fabricating package structure including a plurality of an...

Semiconductor device and method of manufacture

Stacked devices and methods of fabrication

Semiconductor components having conductive vias with aligned back s...

Chip redistribution structure and preparation method thereof

Manufacturing method of semiconductor package

Bare-die smart bridge connected with copper pillars for system-in-p...

Semiconductor device and method of manufacturing thereof

Microelectronic assemblies

Semiconductor device and method of fabricating the same

Package structure and method of forming the same

Semiconductor device with discrete blocks

Lthc as charging barrier in info package formation

Package structure including auxiliary dielectric portion

Device and method for UBM/RDL routing

Semiconductor device and method of forming insulating layers around...

Method of manufacturing die stack structure

Semiconductor structure and manufacturing method thereof

Semiconductor device with redistribution plugs

Package structure

Semiconductor package with improved interposer structure

Method for manufacturing a semiconductor device having a dummy section

Fan-out package with controllable standoff

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION...

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR FORMING DEVICE SUBSTRATE, METHOD FOR FORMING PACKAGE STR...

PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME

SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR PREPARING THE SAME

SEMICONDUCTOR DEVICES INCLUDING RECOGNITION MARKS

DISPLAY DEVICE

BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE

WORKPIECE HOLDER, WAFER CHUCK, WAFER HOLDING METHOD

SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATION BLOCK AND MANUFACTURI...

SEMICONDUCTOR PACKAGE STRUCTURE

CROSS-WAFER RDLS IN CONSTRUCTED WAFERS

SEMICONDUCTOR PACKAGE

ELECTRONIC PACKAGE AND IMPLANTABLE MEDICAL DEVICE INCLUDING SAME

SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR CHIP INCLUDING SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A PLURALIT...

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DU...

POWER MANAGEMENT SYSTEM SWITCHED CAPACITOR VOLTAGE REGULATOR WITH I...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

STACKED INTERPOSER STRUCTURES, AND RELATED METHODS

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

System, Device and Methods of Manufacture

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE AND METHODS OF FORMING THE SAME

Semiconductor Device Including Via Structure And Method For Manufac...

SEMICONDUCTOR PACKAGE WITH SHARED BARRIER LAYER IN REDISTRIBUTION A...