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H01L2224/241

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/241Disposition

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for laser drilling process for an integrated circuit package
- Patent number 12,368,053
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Shen Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 12,368,138
- Issue date Jul 22, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IPD modules with flexible connection scheme in packaging
- Patent number 12,368,141
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High bandwidth die to die interconnect with package area reduction
- Patent number 12,368,137
- Issue date Jul 22, 2025
- Apple Inc.
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,362,309
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including reflective electrode on bank pattern confi...
- Patent number 12,364,075
- Issue date Jul 15, 2025
- Samsung Display Co., Ltd.
- Sung Geun Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,362,308
- Issue date Jul 15, 2025
- INNOLUX CORPORATION
- Hao Jung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,364,015
- Issue date Jul 15, 2025
- Samsung Display Co., Ltd.
- Dong Hee Shin
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 12,356,716
- Issue date Jul 8, 2025
- Samsung Display Co., Ltd.
- Jong Hwan Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die corner removal for underfill crack suppression in semiconductor...
- Patent number 12,347,802
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method manufacturing the same
- Patent number 12,347,785
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microdevice integration into system substrate
- Patent number 12,349,527
- Issue date Jul 1, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of fabricating the same
- Patent number 12,341,139
- Issue date Jun 24, 2025
- Samsung Display Co., Ltd.
- Ki Yeup Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 12,334,486
- Issue date Jun 17, 2025
- Samsung Display Co., Ltd.
- In Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated package including device dies connected via interconne...
- Patent number 12,334,464
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 12,334,476
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-mode wireless charging device
- Patent number 12,322,696
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device reflective bank structure
- Patent number 12,322,738
- Issue date Jun 3, 2025
- Apple Inc.
- Kapil V. Sakariya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,317,658
- Issue date May 27, 2025
- Samsung Display Co., Ltd.
- Hyun Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor module
- Patent number 12,308,355
- Issue date May 20, 2025
- Murata Manufacturing Co., Ltd.
- Takayuki Tsutsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,308,336
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Jungho Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,308,357
- Issue date May 20, 2025
- Samsung Display Co., Ltd.
- Jong Chan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aligning bumps in fan-out packaging process
- Patent number 12,300,659
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Jui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics assemblies with power electronic devices and three-dime...
- Patent number 12,300,653
- Issue date May 13, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 12,300,571
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonics integrated circuit package
- Patent number 12,293,974
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel and display device including the same
- Patent number 12,283,582
- Issue date Apr 22, 2025
- Samsung Display Co., Ltd.
- Eun A Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having insulating pattern with concave-convex pattern
- Patent number 12,283,580
- Issue date Apr 22, 2025
- Samsung Display Co., Ltd.
- Eun Ju Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 12,278,216
- Issue date Apr 15, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package with 3D magnetic core inductor
- Patent number 12,272,637
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250239529
- Publication date Jul 24, 2025
- TDK Corporation
- Reo HANADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT BUILT-IN WIRING BOARD AND METHOD FOR MANUFACTURING COMPON...
- Publication number 20250239535
- Publication date Jul 24, 2025
- IBIDEN CO., LTD.
- Yuichi NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE
- Publication number 20250239556
- Publication date Jul 24, 2025
- InnoLux Corporation
- Ker-Yih KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250233110
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Juhong SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Molded IPD-CoW
- Publication number 20250226334
- Publication date Jul 10, 2025
- STATS ChipPAC Pte Ltd.
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Stacking and Interconnecting Sem...
- Publication number 20250226345
- Publication date Jul 10, 2025
- STATS ChipPAC Pte Ltd.
- YongMoo SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250226285
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Myungsung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLYTIC INDIUM-PALLADIUM-GOLD AS A SURFACE FINISH FOR EMBEDDED...
- Publication number 20250219002
- Publication date Jul 3, 2025
- Intel Corporation
- Shruti Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING STRUCTURE AND DISPLAY PANEL
- Publication number 20250219033
- Publication date Jul 3, 2025
- Industrial Technology Research Institute
- Jui-Wen Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210567
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Kyungdon Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER STRUCTURE FOR HIGH-DENSITY SEMICONDUCTOR PACKA...
- Publication number 20250210568
- Publication date Jun 26, 2025
- MEDIATEK INC.
- Yi-Jou LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20250212520
- Publication date Jun 26, 2025
- SAMSUNG DISPLAY CO., LTD.
- Yeon Kyung KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20250212518
- Publication date Jun 26, 2025
- SAMSUNG DISPLAY CO., LTD.
- Se Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH OPTICAL BRIDGE AND METHOD OF MANUFACTURI...
- Publication number 20250199255
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Hamid ESLAMPOUR
- G02 - OPTICS
Information Patent Application
SYSTEM AND METHODS FOR AN EMBEDDED BRIDGING PACKAGE ARCHITECTURE
- Publication number 20250201690
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER MATERIAL IN A REDISTRIBUTION STRUCTURE OF A SEMICONDUCTOR P...
- Publication number 20250189889
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sih-Hao Liao
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192085
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
- Publication number 20250192086
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Duckgyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250192087
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Neng-Chieh CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Package Having a Main Die and a Dummy Die
- Publication number 20250183191
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20250174534
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY COMPRISING A 3D BLOCK AND METHOD OF MAKING T...
- Publication number 20250174542
- Publication date May 29, 2025
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE OBTAINED BY 3D INTEGRATION AND CORRESPONDING...
- Publication number 20250167157
- Publication date May 22, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Pablo RENAUD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20250167048
- Publication date May 22, 2025
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORM...
- Publication number 20250167060
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250167155
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- SEUNGSOO HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20250160096
- Publication date May 15, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250157996
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20250160095
- Publication date May 15, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES
- Publication number 20250157941
- Publication date May 15, 2025
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS

Disposition

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for laser drilling process for an integrated circuit package

3D semiconductor device and structure with metal layers

IPD modules with flexible connection scheme in packaging

High bandwidth die to die interconnect with package area reduction

Package structure

Display device including reflective electrode on bank pattern confi...

Electronic device

Display device

Display device and method of manufacturing the same

Die corner removal for underfill crack suppression in semiconductor...

Semiconductor structure and method manufacturing the same

Microdevice integration into system substrate

Display device and method of fabricating the same

Display device and method of manufacturing the same

Encapsulated package including device dies connected via interconne...

Semiconductor device with discrete blocks

Dual-mode wireless charging device

Light emitting device reflective bank structure

Display device

Semiconductor device and semiconductor module

Semiconductor package

Display device

Aligning bumps in fan-out packaging process

Electronics assemblies with power electronic devices and three-dime...

Integrated circuit package and method

Photonics integrated circuit package

Pixel and display device including the same

Display device having insulating pattern with concave-convex pattern

3D semiconductor device and structure with metal layers

Integrated fan-out package with 3D magnetic core inductor

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE

COMPONENT BUILT-IN WIRING BOARD AND METHOD FOR MANUFACTURING COMPON...

PACKAGE DEVICE

SEMICONDUCTOR PACKAGE

Semiconductor Device and Method of Making a Molded IPD-CoW

Semiconductor Device and Method of Stacking and Interconnecting Sem...

SEMICONDUCTOR PACKAGE

ELECTROLYTIC INDIUM-PALLADIUM-GOLD AS A SURFACE FINISH FOR EMBEDDED...

HYBRID BONDING STRUCTURE AND DISPLAY PANEL

SEMICONDUCTOR PACKAGE

REDISTRIBUTION LAYER STRUCTURE FOR HIGH-DENSITY SEMICONDUCTOR PACKA...

DISPLAY DEVICE

DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE WITH OPTICAL BRIDGE AND METHOD OF MANUFACTURI...

SYSTEM AND METHODS FOR AN EMBEDDED BRIDGING PACKAGE ARCHITECTURE

POLYMER MATERIAL IN A REDISTRIBUTION STRUCTURE OF A SEMICONDUCTOR P...

SEMICONDUCTOR PACKAGE

CHIP-ON-FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE

Fan-Out Package Having a Main Die and a Dummy Die

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR ASSEMBLY COMPRISING A 3D BLOCK AND METHOD OF MAKING T...

MICROELECTRONIC DEVICE OBTAINED BY 3D INTEGRATION AND CORRESPONDING...

Structure and Method for Fabricating a Computing System with an Int...

THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORM...

SEMICONDUCTOR PACKAGES

MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE

SEMICONDUCTOR PACKAGES

MICRODEVICE INTEGRATION INTO SYSTEM SUBSTRATE

MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES