Disposition

Industry

CPC
H01L2224/491

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/491Disposition

Industries

Patents Grantslast 30 patents

Information Patent Grant
ESD protection device
- Patent number 12,224,579
- Issue date Feb 11, 2025
- Nexperia B.V.
- Hans-Martin Ritter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DC and AC magnetic field protection for MRAM device using magnetic-...
- Patent number 12,218,074
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 12,211,821
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package having first and second lead frames
- Patent number 12,211,824
- Issue date Jan 28, 2025
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable semiconductor packages
- Patent number 12,211,863
- Issue date Jan 28, 2025
- UTAC HEADQUARTERS PTE. LTD.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,199,022
- Issue date Jan 14, 2025
- Fuji Electric Co., Ltd.
- Masayoshi Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,191,287
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,191,289
- Issue date Jan 7, 2025
- Rohm Co., Ltd.
- Yuji Ishimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doped-zirconia ceramic ribbon
- Patent number 12,183,881
- Issue date Dec 31, 2024
- Corning Incorporated
- Michael Edward Badding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of determining a sequence for creating a plurality of wire...
- Patent number 12,183,711
- Issue date Dec 31, 2024
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,701
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an electrical connection between an electronic c...
- Patent number 12,170,262
- Issue date Dec 17, 2024
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,960
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,166,007
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Byeonguk Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and temperature measurement method
- Patent number 12,163,845
- Issue date Dec 10, 2024
- Fuji Electric Co., Ltd.
- Shinichi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 12,154,900
- Issue date Nov 26, 2024
- Rohm Co., Ltd.
- Kentaro Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Long-life extended temperature range embedded diode design for elec...
- Patent number 12,154,814
- Issue date Nov 26, 2024
- Lam Research Corporation
- Siyuan Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light bulb shaped lamp
- Patent number 12,146,619
- Issue date Nov 19, 2024
- Satco Products, Inc.
- Nobuyoshi Takeuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device comprising programmable command-and-address and/or da...
- Patent number 12,142,348
- Issue date Nov 12, 2024
- RAMBUS INC.
- Ian Shaeffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state lighting devices with accessible electrodes and methods...
- Patent number 12,142,708
- Issue date Nov 12, 2024
- Micron Technology, Inc.
- Martin F. Schubert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transceiver and interface for IC package
- Patent number 12,140,809
- Issue date Nov 12, 2024
- Samtec, Inc.
- Eric J. Zbinden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 12,142,592
- Issue date Nov 12, 2024
- SK hynix Inc.
- Jong Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor laser device
- Patent number 12,142,892
- Issue date Nov 12, 2024
- Nichia Corporation
- Hideyuki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including stacked dies with interleaved wire...
- Patent number 12,136,607
- Issue date Nov 5, 2024
- Micron Technology, Inc.
- Koichi Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink, semiconductor package and semiconductor module
- Patent number 12,130,096
- Issue date Oct 29, 2024
- JFE PRECISION CORPORATION
- Hoshiaki Terao
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Light emitting device package
- Patent number 12,119,437
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Soonwon Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 12,119,363
- Issue date Oct 15, 2024
- Tong Hsing Electronic Industries, Ltd.
- Chien-Chen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,119,281
- Issue date Oct 15, 2024
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 12,113,026
- Issue date Oct 8, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method Using Lead Frame Interposer in Bump...
- Publication number 20250054902
- Publication date Feb 13, 2025
- STATS ChipPAC Pte Ltd.
- Peik Eng Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250054901
- Publication date Feb 13, 2025
- Fuji Electric Co., Ltd.
- Seiichi TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250054927
- Publication date Feb 13, 2025
- Rohm Co., Ltd.
- Yuji ISHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046747
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Junyun KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTING DEVICE
- Publication number 20250048938
- Publication date Feb 6, 2025
- Kabushiki Kaisha Toshiba
- Hayato GOTO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING STACKED DIES WITH INTERLEAVED WIRE...
- Publication number 20250029957
- Publication date Jan 23, 2025
- Micron Technology, Inc.
- Koichi Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD
- Publication number 20250030386
- Publication date Jan 23, 2025
- Skyworks Solutions, Inc.
- Weimin Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250022835
- Publication date Jan 16, 2025
- Fuji Electric Co., Ltd.
- Hideo AMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING MEMORY DEVICES STACKED IN STAIRCASE
- Publication number 20250015051
- Publication date Jan 9, 2025
- SK HYNIX INC.
- Byung Deuk JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20250015038
- Publication date Jan 9, 2025
- STMicroelectronics International N.V.
- Pierangelo MAGNI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250006621
- Publication date Jan 2, 2025
- ROHM CO., LTD.
- Ryohei UMENO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250006720
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Daeyoung JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20240429173
- Publication date Dec 26, 2024
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE WIRE COATING DURING WIRE BONDING
- Publication number 20240429196
- Publication date Dec 26, 2024
- Western Digital Technologies, Inc.
- Darryl Wong Jun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE STRUCTURE
- Publication number 20240429143
- Publication date Dec 26, 2024
- Delta Electronics, Inc.
- Jung-Li CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC SYSTEM
- Publication number 20240421266
- Publication date Dec 19, 2024
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROLL TO ROLL SINTERING SYSTEM FOR WIDE INORGANIC TAPE MATERIAL AND...
- Publication number 20240413390
- Publication date Dec 12, 2024
- Corning Incorporated
- Michael Edward Badding
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
TRANSCEIVER AND INTERFACE FOR IC PACKAGE
- Publication number 20240402446
- Publication date Dec 5, 2024
- SAMTEC, INC.
- Eric J. ZBINDEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240387495
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Minwoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH
- Publication number 20240387499
- Publication date Nov 21, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CATHODE FOR A SOLID-STATE BATTERY
- Publication number 20240387863
- Publication date Nov 21, 2024
- Corning Incorporated
- Michael Edward Badding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE INTERCONNECT AND MANUFACTURING METHOD...
- Publication number 20240387427
- Publication date Nov 21, 2024
- NEXPERIA B.V.
- Siu Lung Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED, EFFICIENT SIC POWER MODULE
- Publication number 20240380320
- Publication date Nov 14, 2024
- Wolfspeed, Inc.
- Mrinal K. DAS
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR ASSEMBLY COMPRISING AT LEAST TWO SEMICONDUCTOR ELEMENTS
- Publication number 20240379573
- Publication date Nov 14, 2024
- SIEMENS AKTIENGESELLSCHAFT
- MICHAEL ENDRES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240379512
- Publication date Nov 14, 2024
- Mitsubishi Electric Corporation
- Tomokazu KANNA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH DOUBLE-SIDED FANOUT CHIP PACKAGES
- Publication number 20240363503
- Publication date Oct 31, 2024
- Avago Technologies International Sales Pte. Limited
- Dingyou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTELLIGENT POWER MODULE PACKAGE STRUCTURE AND HYBRID CERAMIC BOARD
- Publication number 20240363516
- Publication date Oct 31, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHIA-SHUAI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ISOLATION WITH CONFORMAL COATING
- Publication number 20240363465
- Publication date Oct 31, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240347426
- Publication date Oct 17, 2024
- ROHM CO., LTD.
- Katsuhiro IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240347499
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Hongjin KIM
- H01 - BASIC ELECTRIC ELEMENTS

Disposition

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

ESD protection device

DC and AC magnetic field protection for MRAM device using magnetic-...

Package-on-package assembly with wire bond vias

Power semiconductor package having first and second lead frames

Reliable semiconductor packages

Semiconductor module

Package structure

Semiconductor device

Doped-zirconia ceramic ribbon

Methods of determining a sequence for creating a plurality of wire...

Semiconductor device

Method for forming an electrical connection between an electronic c...

Semiconductor device

Semiconductor package

Semiconductor device and temperature measurement method

Semiconductor device and semiconductor package

Long-life extended temperature range embedded diode design for elec...

Light bulb shaped lamp

Memory device comprising programmable command-and-address and/or da...

Solid state lighting devices with accessible electrodes and methods...

Transceiver and interface for IC package

Power amplifier modules including semiconductor resistor and tantal...

Semiconductor package including stacked semiconductor chips

Semiconductor laser device

Semiconductor devices including stacked dies with interleaved wire...

Heat sink, semiconductor package and semiconductor module

Light emitting device package

Sensor package structure

Hermetic package for high CTE mismatch

Multi-chip package and method of providing die-to-die interconnects...

Patents Applicationslast 30 patents

Semiconductor Device and Method Using Lead Frame Interposer in Bump...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

COMPUTING DEVICE

SEMICONDUCTOR DEVICES INCLUDING STACKED DIES WITH INTERLEAVED WIRE...

POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD

SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE HAVING MEMORY DEVICES STACKED IN STAIRCASE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

SELECTIVE WIRE COATING DURING WIRE BONDING

POWER MODULE STRUCTURE

OPTOELECTRONIC SYSTEM

ROLL TO ROLL SINTERING SYSTEM FOR WIDE INORGANIC TAPE MATERIAL AND...

TRANSCEIVER AND INTERFACE FOR IC PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH

CATHODE FOR A SOLID-STATE BATTERY

SEMICONDUCTOR DEVICE PACKAGE INTERCONNECT AND MANUFACTURING METHOD...

HIGH SPEED, EFFICIENT SIC POWER MODULE

SEMICONDUCTOR ASSEMBLY COMPRISING AT LEAST TWO SEMICONDUCTOR ELEMENTS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES WITH DOUBLE-SIDED FANOUT CHIP PACKAGES

INTELLIGENT POWER MODULE PACKAGE STRUCTURE AND HYBRID CERAMIC BOARD

DIE ISOLATION WITH CONFORMAL COATING

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE