Dissolving insulating materials

Industry

CPC
H05K2203/0769

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0769Dissolving insulating materials

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods of making metal patterns on flexible substrate
- Patent number 11,950,372
- Issue date Apr 2, 2024
- 3M INNOVATION PROPERTIES
- Henrik B. van Lengerich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,917,768
- Issue date Feb 27, 2024
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fluororesin base material, printed wiring board, and circuit module
- Patent number 11,364,714
- Issue date Jun 21, 2022
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Satoshi Kiya
- B32 - LAYERED PRODUCTS
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,266,027
- Issue date Mar 1, 2022
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,032,915
- Issue date Jun 8, 2021
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for treating millimetre and/or micrometre and/or nanometre s...
- Patent number 11,027,481
- Issue date Jun 8, 2021
- EV Group E. Thallner GmbH
- Gerald Mittendorfer
- B32 - LAYERED PRODUCTS
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 10,757,820
- Issue date Aug 25, 2020
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing flexible electronic circuits having conform...
- Patent number 10,595,417
- Issue date Mar 17, 2020
- VERILY LIFE SCIENCES LLC
- Brian Marc Pepin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible conductive track arrangement and manufacturing method
- Patent number 10,492,701
- Issue date Dec 3, 2019
- Koninklijke Philips N.V.
- Franciscus Theodorus Agricola
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Conductive patterns and methods of using them
- Patent number 10,462,908
- Issue date Oct 29, 2019
- Alpha Assembly Solutions Inc.
- Oscar Khaselev
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Biodegradable materials for multilayer transient printed circuit bo...
- Patent number 10,292,263
- Issue date May 14, 2019
- The Board of Trustees of the University of Illinois
- John A. Rogers
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Materials, electronic systems and modes for active and passive tran...
- Patent number 10,154,592
- Issue date Dec 11, 2018
- The Board of Trustees of the University of Illinois
- John A. Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transient electronic devices comprising inorganic or hybrid inorgan...
- Patent number 10,143,086
- Issue date Nov 27, 2018
- The Board of Trustees of the University of Illinois
- John A. Rogers
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Etch-resistant inkjet inks for manufacturing conductive patterns
- Patent number 10,039,193
- Issue date Jul 31, 2018
- Agfa-Gevaert
- Rita Torfs
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Polyimide-containing layer and method for etching polyimide-contain...
- Patent number 9,982,108
- Issue date May 29, 2018
- Industrial Technology Research Institute
- Chih-Cheng Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Recyclable circuit assembly
- Patent number 9,706,693
- Issue date Jul 11, 2017
- IN2TEC LIMITED
- Christopher Hunt
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Hot melt compositions with improved etch resistance
- Patent number 9,611,402
- Issue date Apr 4, 2017
- Rohm and Haas Electronics Materials LLC
- Krishna Balantrapu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a high-aspect ratio conductive pattern on a su...
- Patent number 9,615,463
- Issue date Apr 4, 2017
- Oscar Khaselev
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hot melt compositions with improved etch resistance
- Patent number 9,598,590
- Issue date Mar 21, 2017
- Rohm and Haas Electronic Materials LLC
- Krishna Balantrapu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterned conductive structure and method for forming the same
- Patent number 9,595,754
- Issue date Mar 14, 2017
- Wistron NeWeb Corp.
- Babak Radi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transient electronic devices comprising inorganic or hybrid inorgan...
- Patent number 9,496,229
- Issue date Nov 15, 2016
- The Board of Trustees of the University of Illinois
- John A. Rogers
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Hot melt compositions with improved etch resistance
- Patent number 9,453,139
- Issue date Sep 27, 2016
- Rohm and Haas Electronic Materials LLC
- Krishna Balantrapu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Resin composition for solder bump formation, solder bump formation...
- Patent number 9,415,469
- Issue date Aug 16, 2016
- San-ei Kagaku Co., Ltd.
- Yasuhiro Takase
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
In situ-built pin-grid arrays for coreless substrates, and methods...
- Patent number 9,111,916
- Issue date Aug 18, 2015
- Intel Corporation
- Mihir K Roy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring method, structure having wiring provided on surface, semicon...
- Patent number 9,082,635
- Issue date Jul 14, 2015
- Panasonic Corporation
- Shingo Yoshioka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrical components and methods of manufacturing electrical compo...
- Patent number 9,049,779
- Issue date Jun 2, 2015
- Tyco Electronics Corporation
- David Bruce Sarraf
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
In situ-built pin-grid arrays for coreless substrates, and methods...
- Patent number 8,952,540
- Issue date Feb 10, 2015
- Intel Corporation
- Mihir K Roy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing circuit board, and circuit board obtained using...
- Patent number 8,698,003
- Issue date Apr 15, 2014
- Panasonic Corporation
- Shingo Yoshioka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
In situ-built pin-grid arrays for coreless substrates, and methods...
- Patent number 8,686,566
- Issue date Apr 1, 2014
- Intel Corporation
- Mihir K. Roy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for formation of electrical conductors on a subst...
- Patent number 8,635,761
- Issue date Jan 28, 2014
- Xerox Corporation
- Yiliang Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF MAKING METAL PATTERNS ON FLEXIBLE SUBSTRATE
- Publication number 20240206076
- Publication date Jun 20, 2024
- 3M Innovative Properties Company
- Henrik B. van Lengerich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF MAKING METAL PATTERNS ON FLEXIBLE SUBSTRATE
- Publication number 20210161018
- Publication date May 27, 2021
- 3M Innovative Properties Company
- Henrik B. van Lengerich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ETCH-RESISTANT INKJET INKS FOR MANUFACTURING CONDUCTIVE PATTERNS
- Publication number 20170013723
- Publication date Jan 12, 2017
- Agfa-Gevaert
- Rita TORFS
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WIRING METHOD, STRUCTURE HAVING WIRING PROVIDED ON SURFACE, SEMICON...
- Publication number 20150271924
- Publication date Sep 24, 2015
- PANASONIC CORPORATION
- Shingo Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MATERIALS, ELECTRONIC SYSTEMS AND MODES FOR ACTIVE AND PASSIVE TRAN...
- Publication number 20140323968
- Publication date Oct 30, 2014
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- John A. ROGERS
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
TRANSIENT ELECTRONIC DEVICES COMPRISING INORGANIC OR HYBRID INORGAN...
- Publication number 20140305900
- Publication date Oct 16, 2014
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- John A. ROGERS
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
IN SITU-BUILT PIN-GRID ARRAYS FOR CORELESS SUBSTRATES, AND METHODS...
- Publication number 20140179060
- Publication date Jun 26, 2014
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED DISCRETE COMPONENT MOUNTING ON ORGANIC SUBSTRATE
- Publication number 20140158414
- Publication date Jun 12, 2014
- CHRIS BALDWIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL COMPONENTS AND METHODS OF MANUFACTURING ELECTRICAL COMPO...
- Publication number 20140144674
- Publication date May 29, 2014
- Tyco Electronics Corporation
- David Bruce Sarraf
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Recyclable Circuit Assembly
- Publication number 20130188323
- Publication date Jul 25, 2013
- Christopher Hunt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR FORMATION OF ELECTRICAL CONDUCTORS ON A SUBST...
- Publication number 20130068511
- Publication date Mar 21, 2013
- Xerox Corporation
- Yiliang Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRING METHOD, STRUCTURE HAVING WIRING PROVIDED ON SURFACE, SEMICON...
- Publication number 20130056247
- Publication date Mar 7, 2013
- PANASONIC CORPORATION
- Shingo Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
IN SITU-BUILT PIN-GRID ARRAYS FOR CORELESS SUBSTRATES, AND METHODS...
- Publication number 20130001794
- Publication date Jan 3, 2013
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING METHOD FOR MULTILAYER PRINTED CIRCUIT BOARD
- Publication number 20120308718
- Publication date Dec 6, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Ryoichi Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL FLEX CONTACT CARRIERS #2
- Publication number 20120012365
- Publication date Jan 19, 2012
- GABE CHERIAN
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD OF PRODUCING CIRCUIT BOARD, AND CIRCUIT BOARD OBTAINED USING...
- Publication number 20110247860
- Publication date Oct 13, 2011
- Panasonic Electric Works Co., Ltd.
- Shingo YOSHIOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR ELECTROCONDUCTIVE PATTERN FORMATION
- Publication number 20100330504
- Publication date Dec 30, 2010
- Munetoshi Irisawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR PRODUCING CIRCUIT BOARD
- Publication number 20100044078
- Publication date Feb 25, 2010
- AJINOMOTO CO., INC.
- Hirohisa Narahashi
- B32 - LAYERED PRODUCTS
Information Patent Application
FILM FOR METAL FILM TRANSFER, METHOD FOR TRANSFERRING METAL FILM AN...
- Publication number 20100040874
- Publication date Feb 18, 2010
- AJINOMOTO CO., INC.
- Hirohisa Narahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD
- Publication number 20090314528
- Publication date Dec 24, 2009
- PANASONIC CORPORATION
- Takayuki Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TFCC (TM) & SWCC (TM) thermal flex contact carriers
- Publication number 20090032915
- Publication date Feb 5, 2009
- Gabe Cherian
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Fabricating method for multilayer printed circuit board
- Publication number 20090014411
- Publication date Jan 15, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Ryoichi Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PART MOUNTING BOARD AND METHOD OF MOUNTING THE SAME
- Publication number 20080212301
- Publication date Sep 4, 2008
- NEC Corporation
- Kouki MASUDA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CONDUCTIVE PATTERNS AND METHODS OF USING THEM
- Publication number 20080137316
- Publication date Jun 12, 2008
- Oscar Khaselev
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Holder for surface mount device during reflow
- Publication number 20080005901
- Publication date Jan 10, 2008
- My Jang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
NO-WICK(TM) 2 INTERCONNECTIONS
- Publication number 20070284706
- Publication date Dec 13, 2007
- Gabe Cherian
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR FORMING RADIO FREQUENCY ANTENNA
- Publication number 20070273605
- Publication date Nov 29, 2007
- RCD TECHNOLOGY INC.
- Robert R. Oberle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Facility and method for high-performance circuit board connection
- Publication number 20070194089
- Publication date Aug 23, 2007
- Ralph Ebbutt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing substrate with cavity
- Publication number 20070066045
- Publication date Mar 22, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Hoe Ku Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible Structures For Sensors And Electronics
- Publication number 20070020445
- Publication date Jan 25, 2007
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- Chang Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Dissolving insulating materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of making metal patterns on flexible substrate

Single-layer circuit board, multi-layer circuit board, and manufact...

Fluororesin base material, printed wiring board, and circuit module

Single-layer circuit board, multi-layer circuit board, and manufact...

Single-layer circuit board, multi-layer circuit board, and manufact...

Method for treating millimetre and/or micrometre and/or nanometre s...

Single-layer circuit board, multi-layer circuit board, and manufact...

Method of manufacturing flexible electronic circuits having conform...

Flexible conductive track arrangement and manufacturing method

Conductive patterns and methods of using them

Biodegradable materials for multilayer transient printed circuit bo...

Materials, electronic systems and modes for active and passive tran...

Transient electronic devices comprising inorganic or hybrid inorgan...

Etch-resistant inkjet inks for manufacturing conductive patterns

Polyimide-containing layer and method for etching polyimide-contain...

Recyclable circuit assembly

Hot melt compositions with improved etch resistance

Method for producing a high-aspect ratio conductive pattern on a su...

Hot melt compositions with improved etch resistance

Patterned conductive structure and method for forming the same

Transient electronic devices comprising inorganic or hybrid inorgan...

Hot melt compositions with improved etch resistance

Resin composition for solder bump formation, solder bump formation...

In situ-built pin-grid arrays for coreless substrates, and methods...

Wiring method, structure having wiring provided on surface, semicon...

Electrical components and methods of manufacturing electrical compo...

In situ-built pin-grid arrays for coreless substrates, and methods...

Method of producing circuit board, and circuit board obtained using...

In situ-built pin-grid arrays for coreless substrates, and methods...

System and method for formation of electrical conductors on a subst...

Patents Applicationslast 30 patents

METHODS OF MAKING METAL PATTERNS ON FLEXIBLE SUBSTRATE

METHODS OF MAKING METAL PATTERNS ON FLEXIBLE SUBSTRATE

ETCH-RESISTANT INKJET INKS FOR MANUFACTURING CONDUCTIVE PATTERNS

WIRING METHOD, STRUCTURE HAVING WIRING PROVIDED ON SURFACE, SEMICON...

MATERIALS, ELECTRONIC SYSTEMS AND MODES FOR ACTIVE AND PASSIVE TRAN...

TRANSIENT ELECTRONIC DEVICES COMPRISING INORGANIC OR HYBRID INORGAN...

IN SITU-BUILT PIN-GRID ARRAYS FOR CORELESS SUBSTRATES, AND METHODS...

RECESSED DISCRETE COMPONENT MOUNTING ON ORGANIC SUBSTRATE

ELECTRICAL COMPONENTS AND METHODS OF MANUFACTURING ELECTRICAL COMPO...

Recyclable Circuit Assembly

SYSTEM AND METHOD FOR FORMATION OF ELECTRICAL CONDUCTORS ON A SUBST...

WIRING METHOD, STRUCTURE HAVING WIRING PROVIDED ON SURFACE, SEMICON...

IN SITU-BUILT PIN-GRID ARRAYS FOR CORELESS SUBSTRATES, AND METHODS...

FABRICATING METHOD FOR MULTILAYER PRINTED CIRCUIT BOARD

THERMAL FLEX CONTACT CARRIERS #2

METHOD OF PRODUCING CIRCUIT BOARD, AND CIRCUIT BOARD OBTAINED USING...

METHOD FOR ELECTROCONDUCTIVE PATTERN FORMATION

PROCESS FOR PRODUCING CIRCUIT BOARD

FILM FOR METAL FILM TRANSFER, METHOD FOR TRANSFERRING METAL FILM AN...

WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD

TFCC (TM) & SWCC (TM) thermal flex contact carriers

Fabricating method for multilayer printed circuit board

ELECTRONIC PART MOUNTING BOARD AND METHOD OF MOUNTING THE SAME

CONDUCTIVE PATTERNS AND METHODS OF USING THEM

Holder for surface mount device during reflow

NO-WICK(TM) 2 INTERCONNECTIONS

METHOD FOR FORMING RADIO FREQUENCY ANTENNA

Facility and method for high-performance circuit board connection

Method for manufacturing substrate with cavity

Flexible Structures For Sensors And Electronics