Double encapsulation or coating and encapsulation

Industry

CPC
H01L23/3135

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3135Double encapsulation or coating and encapsulation

Industries

Patents Grantslast 30 patents

Information Patent Grant
Molded semiconductor package having an embedded inlay
- Patent number 12,283,538
- Issue date Apr 22, 2025
- Infineon Technologies AG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and substrate structure thereof
- Patent number 12,278,173
- Issue date Apr 15, 2025
- Siliconware Precision Industries Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,272,568
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic textile assembly having electronic componentry which is...
- Patent number 12,272,611
- Issue date Apr 8, 2025
- University of Southampton
- Stephen Paul Beeby
- D02 - YARNS MECHANICAL FINISHING OF YARNS OR ROPES WARPING OR BEAMING
Information Patent Grant
Stacked dies and methods for forming bonded structures
- Patent number 12,266,650
- Issue date Apr 1, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 12,266,633
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package process and package structure
- Patent number 12,266,632
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Chi-Chih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacturing semiconductor dev...
- Patent number 12,261,145
- Issue date Mar 25, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Yeon Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 12,261,074
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having a dam structure
- Patent number 12,261,093
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Dongho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded package with electrically isolating dielectric liner
- Patent number 12,255,114
- Issue date Mar 18, 2025
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,255,173
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ling-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method manufacturing the same
- Patent number 12,249,550
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture overlay mark using laser marking process for...
- Patent number 12,249,581
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package for isolation dies
- Patent number 12,243,911
- Issue date Mar 4, 2025
- Texas Instruments Incorporated
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,243,791
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Sunghawn Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure and method of forming the same
- Patent number 12,243,813
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate void filling for an integrated circuit assembly
- Patent number 12,237,300
- Issue date Feb 25, 2025
- Intel Corporation
- Tyler Leuten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having plural stacked first chips sealed in a...
- Patent number 12,237,315
- Issue date Feb 25, 2025
- Kioxia Corporation
- Takayuki Ide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,237,276
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and methods of manufacturing the same
- Patent number 12,237,277
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and method of manufacture
- Patent number 12,237,288
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having wirebonded multi-die stack
- Patent number 12,237,305
- Issue date Feb 25, 2025
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated circuit structures and methods of form...
- Patent number 12,230,549
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor packages
- Patent number 12,224,276
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and power conversion apparatus
- Patent number 12,224,220
- Issue date Feb 11, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method and package structure
- Patent number 12,224,221
- Issue date Feb 11, 2025
- Harvatek Corporation
- Chin-Jui Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including passive devices and methods of for...
- Patent number 12,224,266
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,218,020
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure having molding layer
- Patent number 12,218,095
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250132268
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID STACKING OF SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSE...
- Publication number 20250132302
- Publication date Apr 24, 2025
- Micron Technology, Inc.
- Kwun-Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132214
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multifunctional Adhesion Promoter for Semiconductor Device Packages
- Publication number 20250122413
- Publication date Apr 17, 2025
- Wolfspeed, Inc.
- Afshin Dadvand
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20250125295
- Publication date Apr 17, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20250125289
- Publication date Apr 17, 2025
- STATS ChipPAC Pte Ltd.
- KaiChong CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250125208
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250118699
- Publication date Apr 10, 2025
- Kabushiki Kaisha Toshiba
- Yoshiharu TAKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250118714
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Keumhee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR AN EMBEDDED BRIDGE ARCHITECTURE
- Publication number 20250118720
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTELLIGENT POWER MODULE ARRANGEMENT
- Publication number 20250118634
- Publication date Apr 10, 2025
- Infineon Technologies Austria AG
- Chang Young PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE COMPRISING A POTTING BODY AND PRODUCTION...
- Publication number 20250118610
- Publication date Apr 10, 2025
- SEMIKRON DANFOSS ELEKTRONIK GMBH & CO. KG
- Markus DÜSEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED FLIP CHIP BALL GRID ARRAY PACKAGE WITH IMPROVED...
- Publication number 20250112110
- Publication date Apr 3, 2025
- STMicroelectronics International N.V.
- Florian PERMINJAT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250105078
- Publication date Mar 27, 2025
- Kabushiki Kaisha Toshiba
- Shunsuke SHOJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250096214
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- HYUNSOO CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Package Molded Vertical Interconnection
- Publication number 20250096096
- Publication date Mar 20, 2025
- Apple Inc.
- Kumar Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250096099
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- JAESUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20250096057
- Publication date Mar 20, 2025
- STMicroelectronics International N.V.
- Michael DE CRUZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE WITH GUARD STRUCTURE TO REDUCE OR PREVENT MATERIAL SEEP...
- Publication number 20250096164
- Publication date Mar 20, 2025
- QUALCOMM TECHNOLOGIES, INC.
- Yeng Kwan Hoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE
- Publication number 20250096087
- Publication date Mar 20, 2025
- Sony Semiconductor Solutions Corporation
- Hirohisa YASUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20250096196
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20250087543
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. Hsinchu
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH LATERALLY CONFINED SUBSTRATE AND METHODS...
- Publication number 20250087564
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087637
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION
- Publication number 20250079261
- Publication date Mar 6, 2025
- UTAC Headquarters Pte. Ltd.
- IL Kwon SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, HIGH FREQUENCY DEVICE, AND METHOD OF MANUFACT...
- Publication number 20250079352
- Publication date Mar 6, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Takuma MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250079250
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package
- Publication number 20250079425
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Eunsil Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250079424
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250079320
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS

Double encapsulation or coating and encapsulation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Molded semiconductor package having an embedded inlay

Electronic package and substrate structure thereof

Semiconductor package and manufacturing method thereof

Electronic textile assembly having electronic componentry which is...

Stacked dies and methods for forming bonded structures

Semiconductor structure and method of forming the same

Package process and package structure

Semiconductor device and methods of manufacturing semiconductor dev...

Info structure with copper pillar having reversed profile

Semiconductor packages having a dam structure

Embedded package with electrically isolating dielectric liner

Chip package structure

Semiconductor package and method manufacturing the same

Method of manufacture overlay mark using laser marking process for...

Integrated circuit package for isolation dies

Semiconductor package

Connection structure and method of forming the same

Through-substrate void filling for an integrated circuit assembly

Semiconductor device having plural stacked first chips sealed in a...

Package structure

Package structure and methods of manufacturing the same

Semiconductor die package and method of manufacture

Integrated circuit package having wirebonded multi-die stack

Three-dimensional integrated circuit structures and methods of form...

3D semiconductor packages

Semiconductor module and power conversion apparatus

Packaging method and package structure

Semiconductor packages including passive devices and methods of for...

Semiconductor packages

Chip package structure having molding layer

Patents Applicationslast 30 patents

PACKAGE STRUCTURE

HYBRID STACKING OF SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSE...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Multifunctional Adhesion Promoter for Semiconductor Device Packages

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

INTEGRATED PACKAGE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SYSTEM AND METHODS FOR AN EMBEDDED BRIDGE ARCHITECTURE

INTELLIGENT POWER MODULE ARRANGEMENT

POWER SEMICONDUCTOR MODULE COMPRISING A POTTING BODY AND PRODUCTION...

THERMALLY ENHANCED FLIP CHIP BALL GRID ARRAY PACKAGE WITH IMPROVED...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Electronic Package Molded Vertical Interconnection

SEMICONDUCTOR PACKAGE

ELECTRONIC COMPONENT

DIE PACKAGE WITH GUARD STRUCTURE TO REDUCE OR PREVENT MATERIAL SEEP...

SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

INTEGRATED CIRCUIT PACKAGES AND METHODS

SEMICONDUCTOR PACKAGE WITH LATERALLY CONFINED SUBSTRATE AND METHODS...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION

SEMICONDUCTOR DEVICE, HIGH FREQUENCY DEVICE, AND METHOD OF MANUFACT...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

Semiconductor Package

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES