Double exposure of the same photosensitive layer

Industry

CPC
H05K2203/0505

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0505Double exposure of the same photosensitive layer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Wired circuit board and production method thereof
- Patent number 11,266,024
- Issue date Mar 1, 2022
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wired circuit board and production method thereof
- Patent number 11,032,913
- Issue date Jun 8, 2021
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Zero-misalignment via-pad structures
- Patent number 10,645,813
- Issue date May 5, 2020
- Intel Corporation
- Brandon M. Rawlings
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Zero-misalignment via-pad structures
- Patent number 10,187,998
- Issue date Jan 22, 2019
- Intel Corporation
- Brandon M. Rawlings
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Zero-misalignment via-pad structures
- Patent number 9,713,264
- Issue date Jul 18, 2017
- Intel Corporation
- Brandon M. Rawlings
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Suspension board with circuit and producing method thereof
- Patent number 8,927,870
- Issue date Jan 6, 2015
- Nitto Denko Corporation
- Yasushi Tamura
- G11 - INFORMATION STORAGE
Information Patent Grant
Suspension board with circuit and producing method thereof
- Patent number 8,872,036
- Issue date Oct 28, 2014
- Nitto Denko Corporation
- Yasushi Tamura
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for electroconductive pattern formation
- Patent number 8,546,066
- Issue date Oct 1, 2013
- Mitsubishi Paper Mills Limited
- Munetoshi Irisawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Suspension board with circuit and production method thereof
- Patent number 8,450,613
- Issue date May 28, 2013
- Nitto Denko Corporation
- Yasushi Tamura
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 8,399,801
- Issue date Mar 19, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Hwa-Sub Oh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board having flow preventin...
- Patent number 8,336,201
- Issue date Dec 25, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Jin Won Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with solder bump on solder pad and flow preve...
- Patent number 8,039,761
- Issue date Oct 18, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Jin Won Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Exposure device with mechanism for forming alignment marks and expo...
- Patent number 7,969,553
- Issue date Jun 28, 2011
- ORC Manufacturing Co., Ltd.
- Jin Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterning compositions, masks, and methods
- Patent number 7,626,185
- Issue date Dec 1, 2009
- Battelle Memorial Institute
- Stephen J. Krak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating electrical connections of circuit board
- Patent number 7,216,424
- Issue date May 15, 2007
- Phoenix Precision Technology Corporation
- Ying-Tung Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating metallic interconnects on electronic components
- Patent number 7,172,966
- Issue date Feb 6, 2007
- Infineon Technologies AG
- Axel Brintzinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making bondable leads using positive photoresist and stru...
- Patent number 7,087,510
- Issue date Aug 8, 2006
- Tessera, Inc.
- Mitchell Koblis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multi-layer printed wiring board
- Patent number 6,893,576
- Issue date May 17, 2005
- Fujitsu Limited
- Akitaka Nakayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Production of photoresist coatings
- Patent number 6,686,122
- Issue date Feb 3, 2004
- Vantico Inc.
- Frans Setiabudi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing printed circuit boards with rough conducting s...
- Patent number 6,627,091
- Issue date Sep 30, 2003
- Siemens Aktiengesellschaft
- Jozef Van Puymbroeck
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for direct digital printing of circuit boards
- Patent number 6,579,660
- Issue date Jun 17, 2003
- Creo Il. Ltd.
- Murray Figov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a metallic pattern by photolithography
- Patent number 6,340,626
- Issue date Jan 22, 2002
- International Business Machines Corporation
- Kamalesh S. Desai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Multiple polarity mask exposure method
- Patent number 6,110,624
- Issue date Aug 29, 2000
- International Business Machines Corporation
- Michael S. Hibbs
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Circuit board substrate for use in fabricating a circuit board on w...
- Patent number 6,004,734
- Issue date Dec 21, 1999
- N. Edward Berg
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Image reversal method for repairing defective areas on microelectro...
- Patent number 5,459,013
- Issue date Oct 17, 1995
- MCNC
- Michele J. Berry
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Process for fabricating printed circuit boards
- Patent number 5,384,230
- Issue date Jan 24, 1995
- N. Edward Berg
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Application specific tape automated bonding
- Patent number 5,378,581
- Issue date Jan 3, 1995
- The Foxboro Company
- Robert D. Vernon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Procedure for the production of printed circuit boards provided wit...
- Patent number 5,358,622
- Issue date Oct 25, 1994
- Firma Korsten & Goossens
- Gunter Korsten
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming a patterned mask
- Patent number 5,290,608
- Issue date Mar 1, 1994
- MacDermid, Incorporated
- John Grunwald
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Application specific tape automated bonding
- Patent number 5,260,168
- Issue date Nov 9, 1993
- The Foxboro Company
- Robert D. Vernon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ZERO-MISALIGNMENT VIA-PAD STRUCTURES
- Publication number 20170280568
- Publication date Sep 28, 2017
- Intel Corporation
- Brandon M. Rawlings
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF
- Publication number 20130157200
- Publication date Jun 20, 2013
- Nitto Denko Corporation
- Yasushi Tamura
- G11 - INFORMATION STORAGE
Information Patent Application
Method of manufacturing printed circuit board having flow preventin...
- Publication number 20120000067
- Publication date Jan 5, 2012
- SAMSUNG ELLECTRO-MECHANICS CO., LTD.
- Jin Won Choi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR ELECTROCONDUCTIVE PATTERN FORMATION
- Publication number 20100330504
- Publication date Dec 30, 2010
- Munetoshi Irisawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20100258545
- Publication date Oct 14, 2010
- Samsung Electro-Mechanics CO., LTD.
- Hwa-Sub OH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Suspension board with circuit and production method thereof
- Publication number 20100224391
- Publication date Sep 9, 2010
- Nitto Denko Corporation
- Yasushi Tamura
- G11 - INFORMATION STORAGE
Information Patent Application
Printed Circuit Board Having Flow Preventing Dam And Manufacturing...
- Publication number 20100116534
- Publication date May 13, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Jin Won Choi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Pattern Formation Method
- Publication number 20090111062
- Publication date Apr 30, 2009
- HITACHI VIA MECHANICS, LTD.
- Masako Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EXPOSURE DEVICE WITH MECHANISM FOR FORMING ALIGNMENT MARKS AND EXPO...
- Publication number 20090059195
- Publication date Mar 5, 2009
- Jin Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERNING COMPOSITIONS, MASKS, AND METHODS
- Publication number 20080135784
- Publication date Jun 12, 2008
- Battelle Memorial Institute
- Stephen J. Krak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for fabricating electrical connections of circuit board
- Publication number 20060043158
- Publication date Mar 2, 2006
- Phoenix Precision Technology Corporation
- Ying-Tung Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making bondable leads using positive photoresist and stru...
- Publication number 20060030140
- Publication date Feb 9, 2006
- Tessera, Inc.
- Mitchell Koblis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package having protective layer for re-routing lines...
- Publication number 20060017161
- Publication date Jan 26, 2006
- Jae-Sik Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for fabricating metallic interconnects on electronic components
- Publication number 20050186786
- Publication date Aug 25, 2005
- Axel Brintzinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Etching method and method of manufacturing circuit device using the...
- Publication number 20050101136
- Publication date May 12, 2005
- Shinya Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making bondable leads using positive photoresist and stru...
- Publication number 20030008489
- Publication date Jan 9, 2003
- Tessera, Inc.
- Mitchell Koblis
- H01 - BASIC ELECTRIC ELEMENTS

Double exposure of the same photosensitive layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wired circuit board and production method thereof

Wired circuit board and production method thereof

Zero-misalignment via-pad structures

Zero-misalignment via-pad structures

Zero-misalignment via-pad structures

Suspension board with circuit and producing method thereof

Suspension board with circuit and producing method thereof

Method for electroconductive pattern formation

Suspension board with circuit and production method thereof

Method of manufacturing printed circuit board

Method of manufacturing printed circuit board having flow preventin...

Printed circuit board with solder bump on solder pad and flow preve...

Exposure device with mechanism for forming alignment marks and expo...

Patterning compositions, masks, and methods

Method for fabricating electrical connections of circuit board

Method for fabricating metallic interconnects on electronic components

Method of making bondable leads using positive photoresist and stru...

Method of manufacturing multi-layer printed wiring board

Production of photoresist coatings

Method for producing printed circuit boards with rough conducting s...

Process for direct digital printing of circuit boards

Method for making a metallic pattern by photolithography

Multiple polarity mask exposure method

Circuit board substrate for use in fabricating a circuit board on w...

Image reversal method for repairing defective areas on microelectro...

Process for fabricating printed circuit boards

Application specific tape automated bonding

Procedure for the production of printed circuit boards provided wit...

Method for forming a patterned mask

Application specific tape automated bonding

Patents Applicationslast 30 patents

ZERO-MISALIGNMENT VIA-PAD STRUCTURES

SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF

Method of manufacturing printed circuit board having flow preventin...

METHOD FOR ELECTROCONDUCTIVE PATTERN FORMATION

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

Suspension board with circuit and production method thereof

Printed Circuit Board Having Flow Preventing Dam And Manufacturing...

Pattern Formation Method

EXPOSURE DEVICE WITH MECHANISM FOR FORMING ALIGNMENT MARKS AND EXPO...

PATTERNING COMPOSITIONS, MASKS, AND METHODS

Method for fabricating electrical connections of circuit board

Method of making bondable leads using positive photoresist and stru...

Semiconductor package having protective layer for re-routing lines...

Method for fabricating metallic interconnects on electronic components

Etching method and method of manufacturing circuit device using the...

Method of making bondable leads using positive photoresist and stru...