Double layer of resist having the same pattern

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CPC
H05K2203/0577

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0577Double layer of resist having the same pattern

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing cured film, method for manufacturing elect...
- Patent number 12,077,677
- Issue date Sep 3, 2024
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method for manufacturing cured film, method for manufacturing elect...
- Patent number 11,220,604
- Issue date Jan 11, 2022
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Solder resist and printed wiring board
- Patent number 10,321,579
- Issue date Jun 11, 2019
- Ibiden Co., Ltd.
- Yuji Ikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board formation using organic substrates
- Patent number 9,760,002
- Issue date Sep 12, 2017
- International Business Machines Corporation
- Hiroyuki Mori
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Touch panel and method for forming a touch structure
- Patent number 9,733,749
- Issue date Aug 15, 2017
- TPK Touch Solutions Inc.
- Chen-Yu Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board and method for manufacturing same
- Patent number 9,706,652
- Issue date Jul 11, 2017
- LG Innotek Co., Ltd
- Sung Wuk Ryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board formation using organic substrates
- Patent number 9,684,237
- Issue date Jun 20, 2017
- International Business Machines Corporation
- Hiroyuki Mori
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Chip on film and display device having the same
- Patent number 9,583,448
- Issue date Feb 28, 2017
- Samsung Display Co., Ltd.
- Hyeong-Cheol Ahn
- G02 - OPTICS
Information Patent Grant
Printed wiring board, method for manufacturing printed wiring board...
- Patent number 9,578,745
- Issue date Feb 21, 2017
- Ibiden Co., Ltd.
- Kazuhiro Yoshikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method for producing wiring substrate
- Patent number 9,131,621
- Issue date Sep 8, 2015
- NGK Spark Plug Co., Ltd.
- Takahiro Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed circuit board
- Patent number 9,107,332
- Issue date Aug 11, 2015
- Zhen Ding Technology Co., Ltd.
- Wen-Hung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting apparatus and light unit having the same
- Patent number 8,950,925
- Issue date Feb 10, 2015
- LG Innotek Co., Ltd
- Kyong Jun Kim
- F21 - LIGHTING
Information Patent Grant
Light emitting apparatus and light unit having the same
- Patent number 8,646,963
- Issue date Feb 11, 2014
- LG Innotek Co., Ltd
- Kyong Jun Kim
- F21 - LIGHTING
Information Patent Grant
Method for obtaining controlled sidewall profile in print-patterned...
- Patent number 8,551,556
- Issue date Oct 8, 2013
- Palo Alto Research Center Incorporated
- Eric Shrader
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor package and semiconductor p...
- Patent number 8,288,875
- Issue date Oct 16, 2012
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuitized substrate assembly
- Patent number 8,288,266
- Issue date Oct 16, 2012
- Endicott Interconnect Technologies, Inc.
- Norman A. Card
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting apparatus and light unit having the same
- Patent number 8,277,107
- Issue date Oct 2, 2012
- LG Innotek Co., Ltd
- Kyong Jun Kim
- F21 - LIGHTING
Information Patent Grant
Circuit board surface structure and fabrication method thereof
- Patent number 8,164,003
- Issue date Apr 24, 2012
- Unimicron Technology Corp.
- Sao-Hsia Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate and method of fabricating the same and chip packa...
- Patent number 8,158,888
- Issue date Apr 17, 2012
- Advanced Semiconductor Engineering, Inc.
- Chi-Chih Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming plated product using negative photoresist composi...
- Patent number 8,105,763
- Issue date Jan 31, 2012
- Tokyo Ohka Kogyo Co., Ltd.
- Yasuo Masuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 8,074,352
- Issue date Dec 13, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Dong-Jin Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and semiconductor package including the same
- Patent number 8,063,313
- Issue date Nov 22, 2011
- Samsung Electronics Co., Ltd.
- Yun-Jin Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting apparatus and light unit having the same
- Patent number 8,052,317
- Issue date Nov 8, 2011
- LG Innotek Co., Ltd
- Kyong Jun Kim
- F21 - LIGHTING
Information Patent Grant
Light emitting apparatus and light unit having the same
- Patent number 8,052,321
- Issue date Nov 8, 2011
- LG Innotek Co., Ltd
- Kyong Jun Kim
- F21 - LIGHTING
Information Patent Grant
Wired circuit board with interposed metal thin film and producing m...
- Patent number 8,030,576
- Issue date Oct 4, 2011
- Nitto Denko Corporation
- Katsutoshi Kamei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure
- Patent number 7,948,085
- Issue date May 24, 2011
- Unimicron Technology Corp.
- Chao-Wen Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming photosensitive polyimide pattern and electronic...
- Patent number 7,947,428
- Issue date May 24, 2011
- TDK Corporation
- Akifumi Kamijima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making circuitized substrate with selected conductors hav...
- Patent number 7,910,156
- Issue date Mar 22, 2011
- Endicott Interconnect Technologies, Inc.
- Norman A. Card
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing the BGA package board
- Patent number 7,802,361
- Issue date Sep 28, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Kyoung-Ro Yoon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System, apparatus, and method for advanced solder bumping
- Patent number 7,790,598
- Issue date Sep 7, 2010
- Intel Corporation
- Mengzhi Pang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING CURED FILM, METHOD FOR MANUFACTURING ELECT...
- Publication number 20220098419
- Publication date Mar 31, 2022
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
DRY FILM, LAYERED STRUCTURE, PRINTED WIRING BOARD, AND PROCESS FOR...
- Publication number 20140374143
- Publication date Dec 25, 2014
- TAIYO INK MFG. CO., LTD.
- Daichi Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR PRODUCING WIRING SUBSTRATE
- Publication number 20140318846
- Publication date Oct 30, 2014
- NGK SPARK PLUG CO., LTD.
- Takahiro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON FILM AND DISPLAY DEVICE HAVING THE SAME
- Publication number 20140306348
- Publication date Oct 16, 2014
- Hyeong-Cheol Ahn
- G02 - OPTICS
Information Patent Application
LIGHT EMITTING APPARATUS AND LIGHT UNIT HAVING THE SAME
- Publication number 20140146549
- Publication date May 29, 2014
- LG Innotek Co., Ltd.
- Kyong Jun KIM
- G02 - OPTICS
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140069694
- Publication date Mar 13, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Seong Min CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BAORD AND METHOD FOR MANUFACTURING SAME
- Publication number 20140054075
- Publication date Feb 27, 2014
- ZHEN DING TECHNOLOGY CO., LTD.
- WEN-HUNG HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20140000947
- Publication date Jan 2, 2014
- LG Innotek Co., Ltd.
- Sung Wuk Ryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD TO FORM SOLDER DEPOSITS AND NON-MELTING BUMP STRUCTURES ON S...
- Publication number 20130105329
- Publication date May 2, 2013
- Atotech Deutschland GmbH
- Kai-Jens Matejat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING APPARATUS AND LIGHT UNIT HAVING THE SAME
- Publication number 20120326203
- Publication date Dec 27, 2012
- Kyong Jun KIM
- G02 - OPTICS
Information Patent Application
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20120266463
- Publication date Oct 25, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chang Bo LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD SURFACE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20120175265
- Publication date Jul 12, 2012
- Unimicron Technology Corp.
- Sao-Hsia Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING APPARATUS AND LIGHT UNIT HAVING THE SAME
- Publication number 20120007136
- Publication date Jan 12, 2012
- Kyong Jun KIM
- G02 - OPTICS
Information Patent Application
TAMPER EVIDENT PCBA FILM
- Publication number 20110116242
- Publication date May 19, 2011
- Seagate Technology LLC
- Michael Richard Fabry
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING APPARATUS AND LIGHT UNIT HAVING THE SAME
- Publication number 20110103061
- Publication date May 5, 2011
- Kyong Jun KIM
- G02 - OPTICS
Information Patent Application
Printed circuit board and method of manufacturing the same
- Publication number 20110061907
- Publication date Mar 17, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Myung Sam Kang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DRY FILM AND MANUFACTURING METHOD OF DRY FILM
- Publication number 20110059304
- Publication date Mar 10, 2011
- RENESAS ELECTRONICS CORPORATION
- Yoshitaka USHIYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PAC...
- Publication number 20100244280
- Publication date Sep 30, 2010
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE AND METHOD OF FABRICATING THE SAME AND CHIP PACKA...
- Publication number 20100000775
- Publication date Jan 7, 2010
- Advanced Semiconductor Engineering, Inc.
- CHI-CHIH SHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING APPARATUS AND LIGHT UNIT HAVING THE SAME
- Publication number 20090196070
- Publication date Aug 6, 2009
- Kyong Jun KIM
- G02 - OPTICS
Information Patent Application
SYSTEM, APPARATUS, AND METHOD FOR ADVANCED SOLDER BUMPING
- Publication number 20090196000
- Publication date Aug 6, 2009
- Mengzhi Pang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20090179335
- Publication date Jul 16, 2009
- Samsung Electronics Co., Ltd.
- Yun-Jin OH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE, METHOD OF MANF...
- Publication number 20090133908
- Publication date May 28, 2009
- Michael D. Goodner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing printed circuit board
- Publication number 20090133253
- Publication date May 28, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Dong-Jin Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Obtaining Controlled Sidewall Profile in Print-Patterned...
- Publication number 20090130298
- Publication date May 21, 2009
- Palo Alto Research Center Incorporated
- Eric Shrader
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING SAME, AND DISPLAY DEVICE
- Publication number 20090026462
- Publication date Jan 29, 2009
- MITSUBISHI ELECTRIC CORPORATION
- Takafumi HASHIGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making circuitized substrate with selected conductors hav...
- Publication number 20080241359
- Publication date Oct 2, 2008
- Endicott Interconnect Technologies, Inc.
- Norman A. Card
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wired circuit board and producing method thereof
- Publication number 20080217048
- Publication date Sep 11, 2008
- Nitto Denko Corporation
- Katsutoshi Kamei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD SURFACE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20080217046
- Publication date Sep 11, 2008
- Phoenix Precision Technology Corporation
- Sao-Hsia Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING THE BGA PACKAGE BOARD
- Publication number 20080216314
- Publication date Sep 11, 2008
- Samsung Electro-Mechanics CO., LTD.
- Kyoung-Ro Yoon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Double layer of resist having the same pattern

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing cured film, method for manufacturing elect...

Method for manufacturing cured film, method for manufacturing elect...

Solder resist and printed wiring board

Circuit board formation using organic substrates

Touch panel and method for forming a touch structure

Printed circuit board and method for manufacturing same

Circuit board formation using organic substrates

Chip on film and display device having the same

Printed wiring board, method for manufacturing printed wiring board...

Wiring substrate and method for producing wiring substrate

Method for manufacturing printed circuit board

Light emitting apparatus and light unit having the same

Light emitting apparatus and light unit having the same

Method for obtaining controlled sidewall profile in print-patterned...

Method of manufacturing a semiconductor package and semiconductor p...

Circuitized substrate assembly

Light emitting apparatus and light unit having the same

Circuit board surface structure and fabrication method thereof

Circuit substrate and method of fabricating the same and chip packa...

Method of forming plated product using negative photoresist composi...

Method of manufacturing printed circuit board

Printed circuit board and semiconductor package including the same

Light emitting apparatus and light unit having the same

Light emitting apparatus and light unit having the same

Wired circuit board with interposed metal thin film and producing m...

Circuit board structure

Method for forming photosensitive polyimide pattern and electronic...

Method of making circuitized substrate with selected conductors hav...

Method for manufacturing the BGA package board

System, apparatus, and method for advanced solder bumping

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING CURED FILM, METHOD FOR MANUFACTURING ELECT...

DRY FILM, LAYERED STRUCTURE, PRINTED WIRING BOARD, AND PROCESS FOR...

WIRING SUBSTRATE AND METHOD FOR PRODUCING WIRING SUBSTRATE

CHIP ON FILM AND DISPLAY DEVICE HAVING THE SAME

LIGHT EMITTING APPARATUS AND LIGHT UNIT HAVING THE SAME

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED CIRCUIT BAORD AND METHOD FOR MANUFACTURING SAME

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

METHOD TO FORM SOLDER DEPOSITS AND NON-MELTING BUMP STRUCTURES ON S...

LIGHT EMITTING APPARATUS AND LIGHT UNIT HAVING THE SAME

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

CIRCUIT BOARD SURFACE STRUCTURE AND FABRICATION METHOD THEREOF

LIGHT EMITTING APPARATUS AND LIGHT UNIT HAVING THE SAME

TAMPER EVIDENT PCBA FILM

LIGHT EMITTING APPARATUS AND LIGHT UNIT HAVING THE SAME

Printed circuit board and method of manufacturing the same

DRY FILM AND MANUFACTURING METHOD OF DRY FILM

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PAC...

CIRCUIT SUBSTRATE AND METHOD OF FABRICATING THE SAME AND CHIP PACKA...

LIGHT EMITTING APPARATUS AND LIGHT UNIT HAVING THE SAME

SYSTEM, APPARATUS, AND METHOD FOR ADVANCED SOLDER BUMPING

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE, METHOD OF MANF...

Method of manufacturing printed circuit board

Method for Obtaining Controlled Sidewall Profile in Print-Patterned...

WIRING SUBSTRATE AND METHOD OF MANUFACTURING SAME, AND DISPLAY DEVICE

Method of making circuitized substrate with selected conductors hav...

Wired circuit board and producing method thereof

CIRCUIT BOARD SURFACE STRUCTURE AND FABRICATION METHOD THEREOF

METHOD FOR MANUFACTURING THE BGA PACKAGE BOARD