Dual damascene by forming vias in the via-level dielectric prior to deposition of the trench-level dielectric

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H01L2221/1031

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/1031Dual damascene by forming vias in the via-level dielectric prior to deposition of the trench-level dielectric

Industries

Patents Grantslast 30 patents

Information Patent Grant
Etch damage and ESL free dual damascene metal interconnect
- Patent number 11,955,376
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method of making
- Patent number 11,776,845
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 11,569,123
- Issue date Jan 31, 2023
- Sony Corporation
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and methods thereof
- Patent number 11,222,842
- Issue date Jan 11, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method of making
- Patent number 11,189,524
- Issue date Nov 30, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch damage and ESL free dual damascene metal interconnect
- Patent number 11,171,041
- Issue date Nov 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices including conductive interconnect structures, related elect...
- Patent number 11,158,571
- Issue date Oct 26, 2021
- Micron Technology, Inc.
- Jonathan T. Doebler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming interconnection structure
- Patent number 11,075,112
- Issue date Jul 27, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 10,985,102
- Issue date Apr 20, 2021
- Sony Corporation
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming the same
- Patent number 10,923,392
- Issue date Feb 16, 2021
- Tokyo Electron Limited
- Soo Doo Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via blocking layer
- Patent number 10,672,650
- Issue date Jun 2, 2020
- Intel Corporation
- Rami Hourani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive line system and process
- Patent number 10,643,916
- Issue date May 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu Yi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-damascene formation with dielectric spacer and thin liner
- Patent number 10,629,478
- Issue date Apr 21, 2020
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively etched self-aligned via processes
- Patent number 10,593,594
- Issue date Mar 17, 2020
- Micromaterials LLC
- Yung-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming the same
- Patent number 10,541,174
- Issue date Jan 21, 2020
- Tokyo Electron Limited
- Soo Doo Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 10,497,645
- Issue date Dec 3, 2019
- Samsung Electronics Co., Ltd.
- Yubo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing interconnection
- Patent number 10,468,348
- Issue date Nov 5, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-line protection from process induced dielectric damage
- Patent number 10,446,436
- Issue date Oct 15, 2019
- NXP USA, INC.
- William Ernest Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 10,431,621
- Issue date Oct 1, 2019
- Sony Corporation
- Yoshihisa Kagawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Fabrication method of semiconductor substrate
- Patent number 10,403,573
- Issue date Sep 3, 2019
- Siliconware Precision Industries Co., Ltd.
- Wei-Che Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch damage and ESL free dual damascene metal interconnect
- Patent number 10,312,136
- Issue date Jun 4, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive line system and process
- Patent number 10,269,675
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu Yi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having interconnect layer that includes dielec...
- Patent number 10,262,944
- Issue date Apr 16, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Chieh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 10,217,705
- Issue date Feb 26, 2019
- Samsung Electronics Co., Ltd.
- Yubo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 10,068,796
- Issue date Sep 4, 2018
- TOSHIBA MEMORY CORPORATION
- Toshiyuki Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and operation method thereof
- Patent number 10,049,930
- Issue date Aug 14, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 10,038,024
- Issue date Jul 31, 2018
- Sony Corporation
- Yoshihisa Kagawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Air-gap assisted etch self-aligned dual Damascene
- Patent number 10,002,785
- Issue date Jun 19, 2018
- Microchip Technology Incorporated
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor constructions
- Patent number 9,984,977
- Issue date May 29, 2018
- Micron Technology, Inc.
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with a sidewall layer and an ultra-thick metal l...
- Patent number 9,947,577
- Issue date Apr 17, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hung Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING
- Publication number 20230369099
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Hsi-Wen TIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS THEREOF
- Publication number 20220130757
- Publication date Apr 28, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Wen CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING
- Publication number 20220084875
- Publication date Mar 17, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Hsi-Wen TIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH DAMAGE AND ESL FREE DUAL DAMASCENE METAL INTERCONNECT
- Publication number 20220059404
- Publication date Feb 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE WITH SIDEWALL PROTECTION LAYER
- Publication number 20210351065
- Publication date Nov 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Che-Cheng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE...
- Publication number 20210265200
- Publication date Aug 26, 2021
- SONY CORPORATION
- Yoshihisa Kagawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING CONDUCTIVE INTERCONNECT STRUCTURES,...
- Publication number 20200203272
- Publication date Jun 25, 2020
- Micron Technology, Inc.
- Jonathan T. Doebler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20200006129
- Publication date Jan 2, 2020
- TOKYO ELECTRON LIMITED
- Soo Doo CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH DAMAGE AND ESL FREE DUAL DAMASCENE METAL INTERCONNECT
- Publication number 20190279896
- Publication date Sep 12, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Line System and Process
- Publication number 20190252283
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu Yi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20190148292
- Publication date May 16, 2019
- Samsung Electronics Co., Ltd.
- Yubo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-LINE PROTECTION FROM PROCESS INDUCED DIELECTRIC DAMAGE
- Publication number 20190096749
- Publication date Mar 28, 2019
- NXP USA, Inc.
- WILLIAM ERNEST EDWARDS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-DAMASCENE FORMATION WITH DIELECTRIC SPACER AND THIN LINER
- Publication number 20190067087
- Publication date Feb 28, 2019
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20190043804
- Publication date Feb 7, 2019
- Samsung Electronics Co., Ltd.
- Yubo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN-LIKE FIELD EFFECT TRANSISTOR DEVICE
- Publication number 20180350676
- Publication date Dec 6, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE...
- Publication number 20180277585
- Publication date Sep 27, 2018
- SONY CORPORATION
- Yoshihisa Kagawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20180211870
- Publication date Jul 26, 2018
- Soo Doo CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA BLOCKING LAYER
- Publication number 20180174893
- Publication date Jun 21, 2018
- Intel Corporation
- RAMI HOURANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR SUBSTRATE
- Publication number 20180158774
- Publication date Jun 7, 2018
- Siliconware Precision Industries Co., Ltd.
- Wei-Che Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND OPERATION METHOD THEREOF
- Publication number 20180151431
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Line System and Process
- Publication number 20180108590
- Publication date Apr 19, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu Yi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20180090369
- Publication date Mar 29, 2018
- Toshiba Memory Corporation
- Toshiyuki SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH DAMAGE AND ESL FREE DUAL DAMASCENE METAL INTERCONNECT
- Publication number 20180033684
- Publication date Feb 1, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA BLOCKING LAYER
- Publication number 20170330794
- Publication date Nov 16, 2017
- Intel Corporation
- RAMI HOURANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Constructions
- Publication number 20170263563
- Publication date Sep 14, 2017
- Micron Technology, Inc.
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH A SIDEWALL LAYER AND AN ULTRA-THICK METAL L...
- Publication number 20170069530
- Publication date Mar 9, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hung LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Line System and Process
- Publication number 20160293511
- Publication date Oct 6, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu Yi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Line System and Process
- Publication number 20140264863
- Publication date Sep 18, 2014
- Yu Yi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE FOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140217605
- Publication date Aug 7, 2014
- Siliconware Precision Industries Co., Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING PASSIVATION LAYER ENCAPSULANT
- Publication number 20140183757
- Publication date Jul 3, 2014
- International Business Machines Corporation
- Brian M. Erwin
- H01 - BASIC ELECTRIC ELEMENTS

Dual damascene by forming vias in the via-level dielectric prior to deposition of the trench-level dielectric

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Etch damage and ESL free dual damascene metal interconnect

Semiconductor arrangement and method of making

Semiconductor device, fabrication method for a semiconductor device...

Interconnect structure and methods thereof

Semiconductor arrangement and method of making

Etch damage and ESL free dual damascene metal interconnect

Devices including conductive interconnect structures, related elect...

Method of forming interconnection structure

Semiconductor device, fabrication method for a semiconductor device...

Interconnect structure and method of forming the same

Via blocking layer

Conductive line system and process

Dual-damascene formation with dielectric spacer and thin liner

Selectively etched self-aligned via processes

Interconnect structure and method of forming the same

Semiconductor devices

Method for manufacturing interconnection

In-line protection from process induced dielectric damage

Semiconductor device, fabrication method for a semiconductor device...

Fabrication method of semiconductor substrate

Etch damage and ESL free dual damascene metal interconnect

Conductive line system and process

Semiconductor device having interconnect layer that includes dielec...

Semiconductor devices

Semiconductor device manufacturing method

Memory device and operation method thereof

Semiconductor device, fabrication method for a semiconductor device...

Air-gap assisted etch self-aligned dual Damascene

Semiconductor constructions

Integrated circuit with a sidewall layer and an ultra-thick metal l...

Patents Applicationslast 30 patents

SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING

INTERCONNECT STRUCTURE AND METHODS THEREOF

SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING

ETCH DAMAGE AND ESL FREE DUAL DAMASCENE METAL INTERCONNECT

INTERCONNECTION STRUCTURE WITH SIDEWALL PROTECTION LAYER

SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE...

SEMICONDUCTOR DEVICES INCLUDING CONDUCTIVE INTERCONNECT STRUCTURES,...

INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

ETCH DAMAGE AND ESL FREE DUAL DAMASCENE METAL INTERCONNECT

Conductive Line System and Process

SEMICONDUCTOR DEVICES

IN-LINE PROTECTION FROM PROCESS INDUCED DIELECTRIC DAMAGE

DUAL-DAMASCENE FORMATION WITH DIELECTRIC SPACER AND THIN LINER

SEMICONDUCTOR DEVICES

FIN-LIKE FIELD EFFECT TRANSISTOR DEVICE

SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE...

INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

VIA BLOCKING LAYER

FABRICATION METHOD OF SEMICONDUCTOR SUBSTRATE

MEMORY DEVICE AND OPERATION METHOD THEREOF

Conductive Line System and Process

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

ETCH DAMAGE AND ESL FREE DUAL DAMASCENE METAL INTERCONNECT

VIA BLOCKING LAYER

Semiconductor Constructions

INTEGRATED CIRCUIT WITH A SIDEWALL LAYER AND AN ULTRA-THICK METAL L...

Conductive Line System and Process

Conductive Line System and Process

INTERCONNECTION STRUCTURE FOR PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICE INCLUDING PASSIVATION LAYER ENCAPSULANT