Dual damascene structure

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CPC
H01L2224/05006

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05006Dual damascene structure

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with spacers for self aligned vias
- Patent number 11,984,359
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Pokuan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Industrial chip scale package for microelectronic device
- Patent number 11,749,616
- Issue date Sep 5, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including thick pad
- Patent number 11,652,076
- Issue date May 16, 2023
- Samsung Electronics Co., Ltd.
- Taeho Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including thick pad
- Patent number 11,355,467
- Issue date Jun 7, 2022
- Samsung Electronics Co., Ltd.
- Taeho Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with spacers for self aligned vias
- Patent number 11,264,277
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Pokuan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid sidewall barrier facilitating low resistance interconnection
- Patent number 11,069,566
- Issue date Jul 20, 2021
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack structure and method of fabricating the same
- Patent number 10,879,214
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and methods of manufacturing same, and display pane...
- Patent number 10,304,856
- Issue date May 28, 2019
- BOE Technology Group Co., Ltd.
- Zuqiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of forming a pad structure having enhanced rel...
- Patent number 9,911,707
- Issue date Mar 6, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and manufacturing method for the...
- Patent number 9,892,988
- Issue date Feb 13, 2018
- Dawning Leading Technology Inc.
- Yu-Shan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad structure, an electronic component, and a method for ma...
- Patent number 9,723,716
- Issue date Aug 1, 2017
- Infineon Technologies AG
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,673,147
- Issue date Jun 6, 2017
- Kabushiki Kaisha Toshiba
- Kenro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming integrated circuitry
- Patent number 9,666,573
- Issue date May 30, 2017
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High quality electrical contacts between integrated circuit chips
- Patent number 9,646,882
- Issue date May 9, 2017
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High quality electrical contacts between integrated circuit chips
- Patent number 9,490,212
- Issue date Nov 8, 2016
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical breakdown protection layer
- Patent number 9,362,239
- Issue date Jun 7, 2016
- GLOBALFOUNDRIES Inc.
- Oliver Aubel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with low-melting-temperature conductive reg...
- Patent number 9,318,313
- Issue date Apr 19, 2016
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,287,225
- Issue date Mar 15, 2016
- Kabushiki Kaisha Toshiba
- Kenro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through substrate via structures and methods of forming the same
- Patent number 9,263,382
- Issue date Feb 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ku-Feng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for realizing a connecting structure
- Patent number 9,224,704
- Issue date Dec 29, 2015
- Soitec
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die edge contacts for semiconductor devices
- Patent number 9,190,347
- Issue date Nov 17, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure, semiconductor structure and method of manufacturing a se...
- Patent number 9,000,585
- Issue date Apr 7, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a copper plug
- Patent number 8,922,019
- Issue date Dec 30, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through substrate via structures and methods of forming the same
- Patent number 8,803,322
- Issue date Aug 12, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ku-Feng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 8,779,593
- Issue date Jul 15, 2014
- Renesas Electronics Corporation
- Tamotsu Ogata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a copper plug
- Patent number 8,749,059
- Issue date Jun 10, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a copper plug
- Patent number 8,741,769
- Issue date Jun 3, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of forming a pad structure having enhanced rel...
- Patent number 8,723,325
- Issue date May 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a contact pad, method of manufacturing a conta...
- Patent number 8,669,666
- Issue date Mar 11, 2014
- Infineon Technologies AG
- Markus Hammer
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device having a copper plug
- Patent number 8,610,283
- Issue date Dec 17, 2013
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH SPACERS FOR SELF ALIGNED VIAS
- Publication number 20240297077
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Pokuan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE WITH SOLDERABLE POWER PAD
- Publication number 20240194580
- Publication date Jun 13, 2024
- INFINEON TECHNOLOGIES AG
- Susanne Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE
- Publication number 20240162163
- Publication date May 16, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20230260941
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING THICK PAD
- Publication number 20220262757
- Publication date Aug 18, 2022
- Samsung Electronics Co., LTD
- Taeho KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SPACERS FOR SELF ALIGNED VIAS
- Publication number 20220181207
- Publication date Jun 9, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Pokuan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING THICK PAD
- Publication number 20210217720
- Publication date Jul 15, 2021
- Samsung Electronics Co., Ltd.
- Taeho KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, AND DISPLAY P...
- Publication number 20180076228
- Publication date Mar 15, 2018
- BOE TECHNOLOGY GROUP CO., LTD.
- Zuqiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SUBSTRATE VIA STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20140327151
- Publication date Nov 6, 2014
- Ku-Feng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF FORMING A PAD STRUCTURE HAVING ENHANCED REL...
- Publication number 20140225253
- Publication date Aug 14, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A COPPER PLUG
- Publication number 20140054778
- Publication date Feb 27, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT SUPPORT PILLAR STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICE...
- Publication number 20140015127
- Publication date Jan 16, 2014
- AGERE SYSTEMS LLC
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Edge Contacts for Semiconductor Devices
- Publication number 20130328215
- Publication date Dec 12, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH LOW-MELTING-TEMPERATURE CONDUCTIVE REG...
- Publication number 20130285056
- Publication date Oct 31, 2013
- STMicroelectronics S.r. I.
- Alberto PAGANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A COPPER PLUG
- Publication number 20130157458
- Publication date Jun 20, 2013
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SUBSTRATE VIA STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20130093098
- Publication date Apr 18, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ku-Feng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20130062777
- Publication date Mar 14, 2013
- Renesas Electronics Corporation
- Tamotsu OGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A COPPER PLUG
- Publication number 20120168952
- Publication date Jul 5, 2012
- International Business Machines Corporation
- MUKTA G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM ENHANCED PALLADIUM CMP PROCESS
- Publication number 20120142183
- Publication date Jun 7, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Mona M. EISSA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
STRUCTURE, SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING A SE...
- Publication number 20120104600
- Publication date May 3, 2012
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR REALISING A CONNECTING STRUCTURE
- Publication number 20120094469
- Publication date Apr 19, 2012
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL WIRING STRUCTURES FOR UNIFORM CURRENT DENSITY IN C4 BALLS
- Publication number 20120080797
- Publication date Apr 5, 2012
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Edge Contacts for Semiconductor Devices
- Publication number 20120056328
- Publication date Mar 8, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICES AND METHO...
- Publication number 20110195544
- Publication date Aug 11, 2011
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing Device Mismatch by Adjusting Titanium Formation
- Publication number 20110084391
- Publication date Apr 14, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A COPPER PLUG
- Publication number 20110079907
- Publication date Apr 7, 2011
- International Business Machines Corporation
- MUKTA G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond Pad Design for Reducing the Effect of Package Stress
- Publication number 20110031618
- Publication date Feb 10, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Processing a Contact Pad, Method of Manufacturing a Conta...
- Publication number 20110031625
- Publication date Feb 10, 2011
- Markus Hammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20100301488
- Publication date Dec 2, 2010
- NEC ELECTRONICS CORPORATION
- Noriaki Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF FORMING A PAD STRUCTURE HAVING ENHANCED REL...
- Publication number 20100283149
- Publication date Nov 11, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Dual damascene structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with spacers for self aligned vias

Industrial chip scale package for microelectronic device

Semiconductor devices including thick pad

Semiconductor devices including thick pad

Semiconductor device with spacers for self aligned vias

Hybrid sidewall barrier facilitating low resistance interconnection

Die stack structure and method of fabricating the same

Array substrate and methods of manufacturing same, and display pane...

Structure and method of forming a pad structure having enhanced rel...

Semiconductor packaging structure and manufacturing method for the...

Contact pad structure, an electronic component, and a method for ma...

Semiconductor device and manufacturing method thereof

Methods of forming integrated circuitry

High quality electrical contacts between integrated circuit chips

High quality electrical contacts between integrated circuit chips

Vertical breakdown protection layer

Semiconductor structure with low-melting-temperature conductive reg...

Semiconductor device and manufacturing method thereof

Through substrate via structures and methods of forming the same

Process for realizing a connecting structure

Die edge contacts for semiconductor devices

Structure, semiconductor structure and method of manufacturing a se...

Semiconductor device having a copper plug

Through substrate via structures and methods of forming the same

Semiconductor integrated circuit device

Semiconductor device having a copper plug

Semiconductor device having a copper plug

Structure and method of forming a pad structure having enhanced rel...

Method of processing a contact pad, method of manufacturing a conta...

Semiconductor device having a copper plug

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH SPACERS FOR SELF ALIGNED VIAS

POWER SEMICONDUCTOR DEVICE WITH SOLDERABLE POWER PAD

INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE

Semiconductor Device and Method

SEMICONDUCTOR DEVICES INCLUDING THICK PAD

SEMICONDUCTOR DEVICE WITH SPACERS FOR SELF ALIGNED VIAS

SEMICONDUCTOR DEVICES INCLUDING THICK PAD

ARRAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, AND DISPLAY P...

THROUGH SUBSTRATE VIA STRUCTURES AND METHODS OF FORMING THE SAME

STRUCTURE AND METHOD OF FORMING A PAD STRUCTURE HAVING ENHANCED REL...

SEMICONDUCTOR DEVICE HAVING A COPPER PLUG

CONTACT SUPPORT PILLAR STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICE...

Die Edge Contacts for Semiconductor Devices

SEMICONDUCTOR STRUCTURE WITH LOW-MELTING-TEMPERATURE CONDUCTIVE REG...

SEMICONDUCTOR DEVICE HAVING A COPPER PLUG

THROUGH SUBSTRATE VIA STRUCTURES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICE HAVING A COPPER PLUG

ALUMINUM ENHANCED PALLADIUM CMP PROCESS

STRUCTURE, SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING A SE...

PROCESS FOR REALISING A CONNECTING STRUCTURE

METAL WIRING STRUCTURES FOR UNIFORM CURRENT DENSITY IN C4 BALLS

Die Edge Contacts for Semiconductor Devices

SOLDER BUMP STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICES AND METHO...

Reducing Device Mismatch by Adjusting Titanium Formation

SEMICONDUCTOR DEVICE HAVING A COPPER PLUG

Bond Pad Design for Reducing the Effect of Package Stress

Method of Processing a Contact Pad, Method of Manufacturing a Conta...

Semiconductor device

STRUCTURE AND METHOD OF FORMING A PAD STRUCTURE HAVING ENHANCED REL...