Dual purpose resist

Industry

CPC
H05K2203/0571

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0571Dual purpose resist

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming a solderable solder deposit on a contact pad
- Patent number 11,032,914
- Issue date Jun 8, 2021
- Atotech Deutschland GmbH
- Kai-Jens Matejat
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Accurate positioning and alignment of a component during processes...
- Patent number 10,667,387
- Issue date May 26, 2020
- ams Sensors Singapore Pte. Ltd.
- Peter Riel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing substrate and substrate and mask film
- Patent number 9,857,687
- Issue date Jan 2, 2018
- TOKAI SHINEI ELECTRONICS INIDUSTRY CO., LTD
- Kazunori Tsuge
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Flexible circuit assembly and method therof
- Patent number 9,704,644
- Issue date Jul 11, 2017
- James Jen-Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pattern and manufacturing method thereof
- Patent number 9,615,450
- Issue date Apr 4, 2017
- LG Chem, Ltd.
- Ji-Young Hwang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Wiring board
- Patent number 9,560,739
- Issue date Jan 31, 2017
- NGK Spark Plug Co., Ltd.
- Tomohiro Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing conductive member, conductive member, and...
- Patent number 9,411,080
- Issue date Aug 9, 2016
- FUJIFILM Corporation
- Kensuke Katagiri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Resin composition and method for producing circuit board
- Patent number 9,175,151
- Issue date Nov 3, 2015
- Panasonic Corporation
- Yuko Konno
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing printed circuit board
- Patent number 9,107,332
- Issue date Aug 11, 2015
- Zhen Ding Technology Co., Ltd.
- Wen-Hung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing insulated conductive pattern and laminate
- Patent number 9,060,452
- Issue date Jun 16, 2015
- LG Chem, Ltd.
- Ji-Young Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition and method for producing circuit board
- Patent number 8,877,843
- Issue date Nov 4, 2014
- Panasonic Corporation
- Yuko Konno
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Conductive pattern and manufacturing method thereof
- Patent number 8,637,776
- Issue date Jan 28, 2014
- LG Chem, Ltd.
- Ji-Young Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 8,637,775
- Issue date Jan 28, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Kyoung Hwan Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for the production of a metal-ceramic substrate, preferably...
- Patent number 8,584,924
- Issue date Nov 19, 2013
- Curamik Electronics GmbH
- Jürgen Schulz-Harder
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method of manufacturing coreless substrate
- Patent number 8,555,494
- Issue date Oct 15, 2013
- Intel Corporation
- Houssam Jomaa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 8,497,434
- Issue date Jul 30, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Jae-Seok Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip part manufacturing method and chip parts
- Patent number 8,426,249
- Issue date Apr 23, 2013
- Panasonic Corporation
- Mitio Ohba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating touch sensor panels
- Patent number 8,388,852
- Issue date Mar 5, 2013
- Apple Inc.
- Lili Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for the production of a metal-ceramic substrate, preferably...
- Patent number 8,342,384
- Issue date Jan 1, 2013
- Curamik Electronics GmbH
- Jürgen Schulz-Harder
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of making an electronic device and electronic device substrate
- Patent number 8,230,588
- Issue date Jul 31, 2012
- Hitachi Cable, Ltd.
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making an embedded structure
- Patent number 8,191,248
- Issue date Jun 5, 2012
- Unimicron Technology Corp.
- Yi-Chun Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating blind via structure of substrate
- Patent number 8,037,586
- Issue date Oct 18, 2011
- Unimicron Technology Corp.
- Wei-Ming Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a patterned conductive layer
- Patent number 7,992,293
- Issue date Aug 9, 2011
- Hanita Coatings R.C.A. Ltd
- Yoash Carmi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device substrate, electronic device and methods for maki...
- Patent number 7,880,091
- Issue date Feb 1, 2011
- Hitachi Cable, Ltd.
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a substrate with cavity
- Patent number 7,858,437
- Issue date Dec 28, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Hoe-Ku Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed wiring board
- Patent number 7,765,692
- Issue date Aug 3, 2010
- Ibiden Co., Ltd.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector structure of circuit board and method for fabr...
- Patent number 7,608,929
- Issue date Oct 27, 2009
- Phoenix Precision Technology Corporation
- Wen-Hung Hu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing printed wiring board
- Patent number 7,594,320
- Issue date Sep 29, 2009
- Ibiden Co., Ltd.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring line structure and method for forming the same
- Patent number 7,569,333
- Issue date Aug 4, 2009
- AU Optronics Corp.
- Tzeng-Guang Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 7,480,151
- Issue date Jan 20, 2009
- Dai Nippon Printing Co., Ltd.
- Yoichi Miura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING A SOLDERABLE SOLDER DEPOSIT ON A CONTACT PAD
- Publication number 20190350088
- Publication date Nov 14, 2019
- Atotech Deutschland GmbH
- Kai-Jens MATEJAT
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ACCURATE POSITIONING AND ALIGNMENT OF A COMPONENT DURING PROCESSES...
- Publication number 20180235080
- Publication date Aug 16, 2018
- HEPTAGON MICRO OPTICS PTE. LTD.
- Peter Riel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR FORMING PATTERNED COPPER LINES THROUGH ELECTR...
- Publication number 20150034589
- Publication date Feb 5, 2015
- LAM RESEARCH CORPORATION
- Alan Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20140174811
- Publication date Jun 26, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Young Soon KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD FOR SUBSTRATE
- Publication number 20140175705
- Publication date Jun 26, 2014
- NGK Spark Plug Co., Ltd.
- Yousuke MORITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE PATTERN AND MANUFACTURING METHOD THEREOF
- Publication number 20140151109
- Publication date Jun 5, 2014
- LG CHEM, LTD.
- Ji-Young Hwang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140110023
- Publication date Apr 24, 2014
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kyoung Hwan LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BAORD AND METHOD FOR MANUFACTURING SAME
- Publication number 20140054075
- Publication date Feb 27, 2014
- ZHEN DING TECHNOLOGY CO., LTD.
- WEN-HUNG HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION AND METHOD FOR PRODUCING CIRCUIT BOARD
- Publication number 20130337188
- Publication date Dec 19, 2013
- PANASONIC CORPORATION
- Yuko Konno
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20130312901
- Publication date Nov 28, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Jae-Seok LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SURFACE MOUNTING ELECTRONIC COMPONENT, AND SUBSTRATE HAV...
- Publication number 20130175074
- Publication date Jul 11, 2013
- Omron Corporation
- Wakahiro Kawai
- B32 - LAYERED PRODUCTS
Information Patent Application
MULTI-LAYER WIRING BOARD
- Publication number 20120285732
- Publication date Nov 15, 2012
- Kazumasa TAKEUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR THE PRODUCTION OF A METAL-CERAMIC SUBSTRATE, PREFERABLY...
- Publication number 20120193324
- Publication date Aug 2, 2012
- Jürgen SCHULZ-HARDER
- B32 - LAYERED PRODUCTS
Information Patent Application
EMBEDDED STRUCTURE OF CIRCUIT BOARD
- Publication number 20120160551
- Publication date Jun 28, 2012
- Yi-Chun Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120138337
- Publication date Jun 7, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Eung Soo KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE PATTERN AND MANUFACTURING METHOD THEREOF
- Publication number 20120031647
- Publication date Feb 9, 2012
- LG CHEM, LTD.
- Ji-Young Hwang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR FABRICATING TOUCH SENSOR PANELS
- Publication number 20120024816
- Publication date Feb 2, 2012
- Lili Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR MANUFACTURING INSULATED CONDUCTIVE PATTERN AND LAMINATE
- Publication number 20110290548
- Publication date Dec 1, 2011
- LG CHEM, LTD.
- Ji-Young Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board and Method Of Manufacturing The Same
- Publication number 20110247858
- Publication date Oct 13, 2011
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kyoung Hwan LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20110088930
- Publication date Apr 21, 2011
- Samsung Electro-Mechanics CO., LTD.
- Jae-Seok LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Post bump and method of forming the same
- Publication number 20110012261
- Publication date Jan 20, 2011
- SAMSUNG ELECTRO-MECHANICS
- Jin-Won Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Manufacturing an Electrical Component on a Substrate
- Publication number 20100301006
- Publication date Dec 2, 2010
- Peter L.J. Nilsson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PART MANUFACTURING METHOD AND CHIP PARTS
- Publication number 20100255638
- Publication date Oct 7, 2010
- PANASONIC CORPORATION
- Mitio Ohba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate having metal post and method of manufacturing the same
- Publication number 20100132998
- Publication date Jun 3, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Dong Gyu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER WIRING BOARD
- Publication number 20100065313
- Publication date Mar 18, 2010
- Kazumasa Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED STRUCTURE AND METHOD FOR MAKING THE SAME
- Publication number 20100065324
- Publication date Mar 18, 2010
- Yi-Chun Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FABRICATING BLIND VIA STRUCTURE OF SUBSTRATE
- Publication number 20100031502
- Publication date Feb 11, 2010
- Unimicron Technology Corp.
- Wei-Ming Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE SUBSTRATE, ELECTRONIC DEVICE AND METHODS FOR MAKI...
- Publication number 20090323299
- Publication date Dec 31, 2009
- Hitachi Cable, Ltd.
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERNS OF CONDUCTIVE OBJECTS ON A SUBSTRATE AND METHOD OF PRODUCI...
- Publication number 20090293268
- Publication date Dec 3, 2009
- Yoash CARMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Post bump and method of forming the same
- Publication number 20090184420
- Publication date Jul 23, 2009
- SAMSUNG ELECTROMECHANICS CO., LTD.
- Jin-Won Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Dual purpose resist

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming a solderable solder deposit on a contact pad

Accurate positioning and alignment of a component during processes...

Method of manufacturing substrate and substrate and mask film

Flexible circuit assembly and method therof

Conductive pattern and manufacturing method thereof

Wiring board

Method for manufacturing conductive member, conductive member, and...

Resin composition and method for producing circuit board

Method for manufacturing printed circuit board

Method for manufacturing insulated conductive pattern and laminate

Resin composition and method for producing circuit board

Conductive pattern and manufacturing method thereof

Printed circuit board and method of manufacturing the same

Method for the production of a metal-ceramic substrate, preferably...

Method of manufacturing coreless substrate

Printed circuit board and manufacturing method thereof

Chip part manufacturing method and chip parts

Method for fabricating touch sensor panels

Method for the production of a metal-ceramic substrate, preferably...

Method of making an electronic device and electronic device substrate

Method for making an embedded structure

Method for fabricating blind via structure of substrate

Method of manufacturing a patterned conductive layer

Electronic device substrate, electronic device and methods for maki...

Method for manufacturing a substrate with cavity

Method of manufacturing printed wiring board

Electrical connector structure of circuit board and method for fabr...

Method of manufacturing printed wiring board

Wiring line structure and method for forming the same

Wiring board and method of manufacturing the same

Patents Applicationslast 30 patents

METHOD OF FORMING A SOLDERABLE SOLDER DEPOSIT ON A CONTACT PAD

ACCURATE POSITIONING AND ALIGNMENT OF A COMPONENT DURING PROCESSES...

SYSTEM AND METHOD FOR FORMING PATTERNED COPPER LINES THROUGH ELECTR...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD FOR SUBSTRATE

CONDUCTIVE PATTERN AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BAORD AND METHOD FOR MANUFACTURING SAME

RESIN COMPOSITION AND METHOD FOR PRODUCING CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

METHOD FOR SURFACE MOUNTING ELECTRONIC COMPONENT, AND SUBSTRATE HAV...

MULTI-LAYER WIRING BOARD

METHOD FOR THE PRODUCTION OF A METAL-CERAMIC SUBSTRATE, PREFERABLY...

EMBEDDED STRUCTURE OF CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

CONDUCTIVE PATTERN AND MANUFACTURING METHOD THEREOF

METHOD FOR FABRICATING TOUCH SENSOR PANELS

METHOD FOR MANUFACTURING INSULATED CONDUCTIVE PATTERN AND LAMINATE

Printed Circuit Board and Method Of Manufacturing The Same

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Post bump and method of forming the same

Method of Manufacturing an Electrical Component on a Substrate

CHIP PART MANUFACTURING METHOD AND CHIP PARTS

Substrate having metal post and method of manufacturing the same

MULTI-LAYER WIRING BOARD

EMBEDDED STRUCTURE AND METHOD FOR MAKING THE SAME

METHOD FOR FABRICATING BLIND VIA STRUCTURE OF SUBSTRATE

ELECTRONIC DEVICE SUBSTRATE, ELECTRONIC DEVICE AND METHODS FOR MAKI...

PATTERNS OF CONDUCTIVE OBJECTS ON A SUBSTRATE AND METHOD OF PRODUCI...

Post bump and method of forming the same