during manufacturing

Industry

CPC
B81C99/004

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C99/00Subject matter not provided for in other groups of this subclass

Current Industry

B81C99/004during manufacturing

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semi-finished product of electronic device and electronic device
- Patent number 12,129,169
- Issue date Oct 29, 2024
- Merry Electronics Co., Ltd.
- Jen-Yi Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structure and methodology for detecting defects during MEMS device...
- Patent number 11,377,348
- Issue date Jul 5, 2022
- NXP USA, INC.
- Lianjun Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Testing apparatus and testing method thereof
- Patent number 11,368,804
- Issue date Jun 21, 2022
- xMEMS Labs, Inc.
- Yuan-Shuang Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Singulation of wafer level packaging
- Patent number 11,235,971
- Issue date Feb 1, 2022
- Texas Instruments Incorporated
- Clayton Lee Stevenson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structure and methodology for detecting defects during MEMS device...
- Patent number 10,941,037
- Issue date Mar 9, 2021
- NXP USA, INC.
- Lianjun Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus and method for packaging, handling or testing of sensors
- Patent number 10,935,569
- Issue date Mar 2, 2021
- Rosemount Aerospace Inc.
- Jim Golden
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device and method for a threshold sensor
- Patent number 10,793,424
- Issue date Oct 6, 2020
- Invensense, Inc.
- Matthew Julian Thompson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus and method for packaging, handling or testing of sensors
- Patent number 10,782,315
- Issue date Sep 22, 2020
- Rosemount Aerospace Inc.
- Jim Golden
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor characteristic evaluation method and charged particle beam d...
- Patent number 10,737,937
- Issue date Aug 11, 2020
- Hitachi, Ltd.
- Toshiyuki Mine
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Cover based adhesion force measurement system for microelectromecha...
- Patent number 10,717,641
- Issue date Jul 21, 2020
- Invensense, Inc.
- Alexander Castro
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device
- Patent number 10,654,717
- Issue date May 19, 2020
- Cirrus Logic, Inc.
- Euan James Boyd
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Singulation of wafer level packaging
- Patent number 10,611,632
- Issue date Apr 7, 2020
- Texas Instruments Incorporated
- Clayton Lee Stevenson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,522,429
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lee-Chuan Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus and methods for integrated MEMS devices
- Patent number 10,479,676
- Issue date Nov 19, 2019
- MCube, Inc.
- Ben Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus and method for testing a capacitive transducer and/or ass...
- Patent number 10,451,667
- Issue date Oct 22, 2019
- Cirrus Logic, Inc.
- Colin Findlay Steele
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device and method for a threshold sensor
- Patent number 10,399,849
- Issue date Sep 3, 2019
- Invensense, Inc.
- Matthew Julian Thompson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Controlled pulse generation methods and apparatuses for evaluating...
- Patent number 10,393,618
- Issue date Aug 27, 2019
- NXP USA, INC.
- Peter T. Jones
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and device of MEMS process control monitoring and packaged M...
- Patent number 10,343,896
- Issue date Jul 9, 2019
- MCube, Inc.
- Te-Hsi “Terrence” Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for fabricating electronic devices including substantially...
- Patent number 10,336,608
- Issue date Jul 2, 2019
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Szu Huat Goh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Circuit board module comprising a continuous cavity, associated son...
- Patent number 10,206,046
- Issue date Feb 12, 2019
- USOUND GMBH
- Ferruccio Bottoni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure with cavity spacing monitoring functions
- Patent number 10,202,278
- Issue date Feb 12, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jung-Huei Peng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for detecting a perturbation by hysteretic cycle using a non...
- Patent number 10,119,856
- Issue date Nov 6, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Sebastien Hentz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System and method for a microfabricated fracture test structure
- Patent number 10,109,536
- Issue date Oct 23, 2018
- Infineon Technologies AG
- Christoph Glacer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Production method for a detection apparatus and detection apparatuses
- Patent number 10,094,725
- Issue date Oct 9, 2018
- Robert Bosch GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus and methods for integrated MEMS devices
- Patent number 10,046,966
- Issue date Aug 14, 2018
- MCube, Inc.
- Ben Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of detecting whether microelectromechanical system device is...
- Patent number 9,915,679
- Issue date Mar 13, 2018
- Sensortek Technology Corp.
- Hsin-Hung Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inertial angular sensor of balanced MEMS type and method for balanc...
- Patent number 9,869,551
- Issue date Jan 16, 2018
- Sagem Defense Securite
- Alain Jeanroy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate plate for MEMS devices
- Patent number 9,856,140
- Issue date Jan 2, 2018
- Oce-Technologies B.V.
- Maikel A. J. Huygens
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Leak detection using cavity surface quality factor
- Patent number 9,796,585
- Issue date Oct 24, 2017
- Texas Instruments Incorporated
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Centrifuge MEMS stiction detection and screening system and method
- Patent number 9,758,374
- Issue date Sep 12, 2017
- MCube Inc.
- Raymond Merrill
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF SEPARATING GOOD PROBE STRUCTURES FROM DEFECTIVE PROBE ST...
- Publication number 20240017990
- Publication date Jan 18, 2024
- Microfabrica Inc.
- Duy P. Le
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING MIRROR DEVICE
- Publication number 20240002219
- Publication date Jan 4, 2024
- Hamamatsu Photonics K.K.
- Tomoyuki IDE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMI-FINISHED PRODUCT OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE
- Publication number 20220298010
- Publication date Sep 22, 2022
- Merry Electronics Co., Ltd.
- Jen-Yi Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REDUNDANT SENSOR SYSTEM WITH SELF-TEST OF ELECTROMECHANICAL STRUCTURES
- Publication number 20220089435
- Publication date Mar 24, 2022
- NXP USA, Inc.
- Marc Edward Holbein
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REDUNDANT SENSOR SYSTEM WITH SELF-TEST OF ELECTROMECHANICAL STRUCTURES
- Publication number 20210155473
- Publication date May 27, 2021
- NXP USA, Inc.
- Marc Edward Holbein
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRUCTURE AND METHODOLOGY FOR DETECTING DEFECTS DURING MEMS DEVICE...
- Publication number 20210155474
- Publication date May 27, 2021
- NXP USA, Inc.
- Lianjun Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SINGULATION OF WAFER LEVEL PACKAGING
- Publication number 20200231434
- Publication date Jul 23, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Clayton Lee Stevenson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRUCTURE AND METHODOLOGY FOR DETECTING DEFECTS DURING MEMS DEVICE...
- Publication number 20200207618
- Publication date Jul 2, 2020
- NXP USA, Inc.
- Lianjun Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE AND METHOD FOR A THRESHOLD SENSOR
- Publication number 20190382259
- Publication date Dec 19, 2019
- InvenSense, Inc.
- MATTHEW JULIAN THOMPSON
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR CHARACTERISTIC EVALUATION METHOD AND CHARGED PARTICLE BEAM D...
- Publication number 20190292046
- Publication date Sep 26, 2019
- Hitachi, Ltd
- Toshiyuki MINE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
APPARATUS AND METHOD FOR PACKAGING, HANDLING OR TESTING OF SENSORS
- Publication number 20190154729
- Publication date May 23, 2019
- Rosemount Aerospace Inc.
- Jim Golden
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
APPARATUS AND METHODS FOR INTEGRATED MEMS DEVICES
- Publication number 20180346328
- Publication date Dec 6, 2018
- MCUBE, INC.
- Ben LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
APPARATUS AND METHOD FOR PACKAGING, HANDLING OR TESTING OF SENSORS
- Publication number 20180299482
- Publication date Oct 18, 2018
- Rosemount Aerospace Inc.
- Jim Golden
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE
- Publication number 20180170749
- Publication date Jun 21, 2018
- Cirrus Logic International Semiconductor Ltd.
- Euan James BOYD
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CIRCUIT BOARD MODULE COMPRISING A CONTINUOUS CAVITY, ASSOCIATED SON...
- Publication number 20180091905
- Publication date Mar 29, 2018
- USound GmbH
- ANDREA RUSCONI CLERICI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS FOR FABRICATING ELECTRONIC DEVICES INCLUDING SUBSTANTIALLY...
- Publication number 20170291813
- Publication date Oct 12, 2017
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Szu Huat Goh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
APPARATUS AND METHODS FOR INTEGRATED MEMS DEVICES
- Publication number 20170283256
- Publication date Oct 5, 2017
- MCUBE, INC.
- Ben LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
System and Method for a Microfabricated Fracture Test Structure
- Publication number 20170243793
- Publication date Aug 24, 2017
- INFINEON TECHNOLOGIES AG
- Christoph Glacer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRODUCTION METHOD FOR A DETECTION APPARATUS AND DETECTION APPARATUSES
- Publication number 20170205301
- Publication date Jul 20, 2017
- ROBERT BOSCH GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LEAK DETECTION USING CAVITY SURFACE QUALITY FACTOR
- Publication number 20170174511
- Publication date Jun 22, 2017
- TEXAS INSTRUMENTS INCORPORATED
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
APPARATUS AND METHOD FOR TESTING A CAPACITIVE TRANSDUCER AND/OR ASS...
- Publication number 20170160337
- Publication date Jun 8, 2017
- Cirrus Logic International Semiconductor Ltd.
- Colin Findlay Steele
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method For Wafer-Level Chip Scale Package Testing
- Publication number 20170113929
- Publication date Apr 27, 2017
- Memsic Semiconductor (Wuxi) Co., Ltd.
- Yang Zhao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEM FOR WAFER-LEVEL TESTING OF MEMS PRESSURE SENSORS
- Publication number 20160116361
- Publication date Apr 28, 2016
- FREESCALE SEMICONDUCTOR, INC.
- BRUNO J. DEBEURRE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODOLOGY AND SYSTEM FOR WAFER-LEVEL TESTING OF MEMS PRESSURE SEN...
- Publication number 20160107887
- Publication date Apr 21, 2016
- FREESCALE SEMICONDUCTOR, INC.
- BRUNO J. DEBEURRE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CENTRIFUGE MEMS STICTION DETECTION AND SCREENING SYSTEM AND METHOD
- Publication number 20150284245
- Publication date Oct 8, 2015
- MCube Inc.
- RAYMOND MERRILL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEM AND METHODS OF USE
- Publication number 20150177272
- Publication date Jun 25, 2015
- Jason V. Clark
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND DEVICE OF MEMS PROCESS CONTROL MONITORING AND PACKAGED M...
- Publication number 20150111332
- Publication date Apr 23, 2015
- MCube Inc.
- TE-HSI "TERRENCE" LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUBSTRATE PLATE FOR MEMS DEVICES
- Publication number 20150102835
- Publication date Apr 16, 2015
- OCE-TECHNOLOGIES B.V.
- Maikel A.J. HUYGENS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING MEMS DEVICES WITH RELIABLE HERMETIC SEAL
- Publication number 20140356989
- Publication date Dec 4, 2014
- Analog Devices, Inc.
- Li Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Temporary optical wave diffusion-promoting film adhered to lidded M...
- Publication number 20140320847
- Publication date Oct 30, 2014
- Hewlett-Packard Development Company, L.P.
- Danijel Gostovic
- B81 - MICRO-STRUCTURAL TECHNOLOGY

during manufacturing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semi-finished product of electronic device and electronic device

Structure and methodology for detecting defects during MEMS device...

Testing apparatus and testing method thereof

Singulation of wafer level packaging

Structure and methodology for detecting defects during MEMS device...

Apparatus and method for packaging, handling or testing of sensors

Device and method for a threshold sensor

Apparatus and method for packaging, handling or testing of sensors

Sensor characteristic evaluation method and charged particle beam d...

Cover based adhesion force measurement system for microelectromecha...

MEMS device

Singulation of wafer level packaging

Method of manufacturing semiconductor device

Apparatus and methods for integrated MEMS devices

Apparatus and method for testing a capacitive transducer and/or ass...

Device and method for a threshold sensor

Controlled pulse generation methods and apparatuses for evaluating...

Method and device of MEMS process control monitoring and packaged M...

Methods for fabricating electronic devices including substantially...

Circuit board module comprising a continuous cavity, associated son...

Semiconductor structure with cavity spacing monitoring functions

Method for detecting a perturbation by hysteretic cycle using a non...

System and method for a microfabricated fracture test structure

Production method for a detection apparatus and detection apparatuses

Apparatus and methods for integrated MEMS devices

Method of detecting whether microelectromechanical system device is...

Inertial angular sensor of balanced MEMS type and method for balanc...

Substrate plate for MEMS devices

Leak detection using cavity surface quality factor

Centrifuge MEMS stiction detection and screening system and method

Patents Applicationslast 30 patents

METHODS OF SEPARATING GOOD PROBE STRUCTURES FROM DEFECTIVE PROBE ST...

METHOD FOR MANUFACTURING MIRROR DEVICE

SEMI-FINISHED PRODUCT OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE

REDUNDANT SENSOR SYSTEM WITH SELF-TEST OF ELECTROMECHANICAL STRUCTURES

REDUNDANT SENSOR SYSTEM WITH SELF-TEST OF ELECTROMECHANICAL STRUCTURES

STRUCTURE AND METHODOLOGY FOR DETECTING DEFECTS DURING MEMS DEVICE...

SINGULATION OF WAFER LEVEL PACKAGING

STRUCTURE AND METHODOLOGY FOR DETECTING DEFECTS DURING MEMS DEVICE...

DEVICE AND METHOD FOR A THRESHOLD SENSOR

SENSOR CHARACTERISTIC EVALUATION METHOD AND CHARGED PARTICLE BEAM D...

APPARATUS AND METHOD FOR PACKAGING, HANDLING OR TESTING OF SENSORS

APPARATUS AND METHODS FOR INTEGRATED MEMS DEVICES

APPARATUS AND METHOD FOR PACKAGING, HANDLING OR TESTING OF SENSORS

MEMS DEVICE

CIRCUIT BOARD MODULE COMPRISING A CONTINUOUS CAVITY, ASSOCIATED SON...

METHODS FOR FABRICATING ELECTRONIC DEVICES INCLUDING SUBSTANTIALLY...

APPARATUS AND METHODS FOR INTEGRATED MEMS DEVICES

System and Method for a Microfabricated Fracture Test Structure

PRODUCTION METHOD FOR A DETECTION APPARATUS AND DETECTION APPARATUSES

LEAK DETECTION USING CAVITY SURFACE QUALITY FACTOR

APPARATUS AND METHOD FOR TESTING A CAPACITIVE TRANSDUCER AND/OR ASS...

Method For Wafer-Level Chip Scale Package Testing

SYSTEM FOR WAFER-LEVEL TESTING OF MEMS PRESSURE SENSORS

METHODOLOGY AND SYSTEM FOR WAFER-LEVEL TESTING OF MEMS PRESSURE SEN...

CENTRIFUGE MEMS STICTION DETECTION AND SCREENING SYSTEM AND METHOD

MICROELECTROMECHANICAL SYSTEM AND METHODS OF USE

METHOD AND DEVICE OF MEMS PROCESS CONTROL MONITORING AND PACKAGED M...

SUBSTRATE PLATE FOR MEMS DEVICES

METHOD OF MANUFACTURING MEMS DEVICES WITH RELIABLE HERMETIC SEAL

Temporary optical wave diffusion-promoting film adhered to lidded M...