Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Industry

CPC
H05K3/403

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/403Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Industries

Patents Grantslast 30 patents

Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 11,978,730
- Issue date May 7, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for manufacturing electrical components using e...
- Patent number 11,970,783
- Issue date Apr 30, 2024
- FABRIC8LABS, INC.
- David Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for manufacturing transparent circuit board
- Patent number 11,950,371
- Issue date Apr 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertically spaced intra-level interconnect line metallization for i...
- Patent number 11,948,874
- Issue date Apr 2, 2024
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor interposer employing castellated through-vias
- Patent number 11,950,363
- Issue date Apr 2, 2024
- DexCom, Inc.
- Sean Frick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 11,950,356
- Issue date Apr 2, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for circuit interconnects
- Patent number 11,937,368
- Issue date Mar 19, 2024
- OpenLight Photonics, Inc.
- Christopher Paul Wyland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate and a manufacturing method of the multilayer s...
- Patent number 11,923,123
- Issue date Mar 5, 2024
- Murata Manufacturing Co., Ltd.
- Kazutaka Muraoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device housings with patterned electrolytic plating layers
- Patent number 11,910,538
- Issue date Feb 20, 2024
- Hewlett-Packard Development Company, L.P.
- Yi-Chen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hard disk drive suspension pad pre-solder sidewalls
- Patent number 11,908,497
- Issue date Feb 20, 2024
- Western Digital Technologies, Inc.
- Irizo Naniwa
- G11 - INFORMATION STORAGE
Information Patent Grant
Manufacturing method of package structure
- Patent number 11,895,780
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible connectors for expansion board
- Patent number 11,881,646
- Issue date Jan 23, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Marco Assale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit mother board and detection method thereof
- Patent number 11,871,511
- Issue date Jan 9, 2024
- WUHAN TIANMA MICRO-ELECTRONICS CO., LTD.
- Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Creating inductors, resistors, capacitors and other structures in p...
- Patent number 11,864,327
- Issue date Jan 2, 2024
- International Business Machines Corporation
- Gerald Bartley
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Sn—Bi and copper powder conductive paste in through hole of insulat...
- Patent number 11,864,317
- Issue date Jan 2, 2024
- Nichia Corporation
- Masaaki Katsumata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rogowski coil integrated in glass substrate
- Patent number 11,856,711
- Issue date Dec 26, 2023
- Infineon Technologies Austria AG
- Alexander Breymesser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Field device of process measurement technology, measuring sensor an...
- Patent number 11,835,375
- Issue date Dec 5, 2023
- Endress + Hauser Flowtec AG
- Benjamin Schwenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 11,798,932
- Issue date Oct 24, 2023
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Right angle sidewall and button interconnects for molded SiPs
- Patent number 11,765,838
- Issue date Sep 19, 2023
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sealed package and method of forming same
- Patent number 11,744,518
- Issue date Sep 5, 2023
- Medtronic, Inc.
- David A Ruben
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Interconnect structure having conductor extending along dielectric...
- Patent number 11,737,205
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistive PCB traces for improved stability
- Patent number 11,723,149
- Issue date Aug 8, 2023
- Kioxia Corporation
- Stephen Pardoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit carrier, package, and method for manufacturing a package
- Patent number 11,723,155
- Issue date Aug 8, 2023
- Siemens Aktiengesellschaft
- Stefan Pfefferlein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded module
- Patent number 11,696,400
- Issue date Jul 4, 2023
- RISING TECHNOLOGIES CO., LTD.
- Shuzo Akejima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of carrier structure
- Patent number 11,690,180
- Issue date Jun 27, 2023
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and systems for detecting defects in devices using X-rays
- Patent number 11,688,067
- Issue date Jun 27, 2023
- Bruker Nano, Inc.
- David Lewis Adler
- G01 - MEASURING TESTING
Information Patent Grant
Inspection method of printed wiring board
- Patent number 11,683,891
- Issue date Jun 20, 2023
- Ibiden Co., Ltd.
- Yasuhiro Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Acousto-optic modulator system and device with connections and rela...
- Patent number 11,662,612
- Issue date May 30, 2023
- Eagle Technology, LLC
- Peter A. Wasilousky
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods and systems for printed circuit board design based on autom...
- Patent number 11,662,479
- Issue date May 30, 2023
- Bruker Nano, Inc.
- David Lewis Adler
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,665,832
- Issue date May 30, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FILLING CRACKS ON A SUBSTRATE VIA
- Publication number 20240155767
- Publication date May 9, 2024
- Micron Technology, Inc.
- Quang Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20240138076
- Publication date Apr 25, 2024
- IBIDEN CO., LTD.
- Ikuya TERAUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240114619
- Publication date Apr 4, 2024
- InnoLux Corporation
- Cheng-Chi WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER VIA RESONANCE SUPPRESSION
- Publication number 20240098898
- Publication date Mar 21, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Melvin Kent Benedict
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAMERA MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20240089571
- Publication date Mar 14, 2024
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
- KUEI-FENG PENG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SYSTEM AND METHOD TO ELIMINATE VIA STRIPING
- Publication number 20240080978
- Publication date Mar 7, 2024
- Dell Products L.P.
- Sandor FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATES WITH CONTINUOUS SLOT VIAS
- Publication number 20240074055
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20240057267
- Publication date Feb 15, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Soo Yun KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD MANUFACTURING SYSTEM AND METHOD
- Publication number 20240057260
- Publication date Feb 15, 2024
- UFab Corporation
- Tyler Richards
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS
- Publication number 20240049388
- Publication date Feb 8, 2024
- Dexcom, Inc.
- Sean Frick
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Probe Card and Method of Manufacturing Thereof
- Publication number 20240044941
- Publication date Feb 8, 2024
- Nippon Telegraph and Telephone Corporation
- Ai Yanagihara
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
- Publication number 20240040699
- Publication date Feb 1, 2024
- Murata Manufacturing Co., Ltd.
- Hiromitsu ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Battery Management System
- Publication number 20240014678
- Publication date Jan 11, 2024
- Holding Zero, LLC
- Derek Simkowiak
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD
- Publication number 20240014047
- Publication date Jan 11, 2024
- TOPPAN INC.
- Yuki UMEMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL INTERCONNECT DESIGN FOR IMPROVED ELECTRICAL PERFORMANCE
- Publication number 20240008177
- Publication date Jan 4, 2024
- Intel Corporation
- Jackson Chung Peng KONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULAR POWER ELECTRONICS CONVERTERS WITH ENHANCED CONNECTIVITY REL...
- Publication number 20240008182
- Publication date Jan 4, 2024
- University of Maryland, College Park
- YONGWAN PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20240006401
- Publication date Jan 4, 2024
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS
- Publication number 20240006285
- Publication date Jan 4, 2024
- The Intel Corporation
- Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230413438
- Publication date Dec 21, 2023
- Samsung Electronics Co., Ltd.
- Peiyu CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20230413425
- Publication date Dec 21, 2023
- LG Innotek Co., Ltd.
- Myung Jae KWON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE COMPRISING SEALING MEMBER
- Publication number 20230413427
- Publication date Dec 21, 2023
- Samsung Electronics Co., Ltd.
- Seongki JEONG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE WIRING CIRCUIT BOARD
- Publication number 20230413431
- Publication date Dec 21, 2023
- Nitto Denko Corporation
- Takahiro IKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE WITH THROUGH-MOLD CONNECTIONS AND RELATED ELECTR...
- Publication number 20230402338
- Publication date Dec 14, 2023
- Skyworks Solutions, Inc.
- Anthony James LoBianco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE OF PRINTED CIRCUIT BOARD, MANUFACTURING...
- Publication number 20230371166
- Publication date Nov 16, 2023
- HL KLEMOVE CORP.
- Jihoon HAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC...
- Publication number 20230354503
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun-Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIAL VIA DESIGN ON A PRINTED CIRCUIT BOARD
- Publication number 20230345634
- Publication date Oct 26, 2023
- Dell Products L.P.
- Chang-Kai Chu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HARD DISK DRIVE SUSPENSION PAD PRE-SOLDER SIDEWALLS
- Publication number 20230317105
- Publication date Oct 5, 2023
- Western Digital Technologies, Inc.
- Irizo Naniwa
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC DEVICE CAPABLE OF SUPPRESSING HIGH GROUND IMPEDANCE, AND...
- Publication number 20230309214
- Publication date Sep 28, 2023
- Canon Kabushiki Kaisha
- SHUICHI NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD
- Publication number 20230309244
- Publication date Sep 28, 2023
- IBIDEN CO., LTD.
- Atsushi ISHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE HAVING MULTILAYERED SUBSTRATE AND MANUFACTURING M...
- Publication number 20230300984
- Publication date Sep 21, 2023
- Samsung Electronics Co., Ltd.
- Seungjin LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Offset interposers for large-bottom packages and large-die package-...

Systems and methods for manufacturing electrical components using e...

Method for manufacturing transparent circuit board

Vertically spaced intra-level interconnect line metallization for i...

Sensor interposer employing castellated through-vias

Mating backplane for high speed, high density electrical connector

Structure for circuit interconnects

Multilayer substrate and a manufacturing method of the multilayer s...

Electronic device housings with patterned electrolytic plating layers

Hard disk drive suspension pad pre-solder sidewalls

Manufacturing method of package structure

Flexible connectors for expansion board

Flexible circuit mother board and detection method thereof

Creating inductors, resistors, capacitors and other structures in p...

Sn—Bi and copper powder conductive paste in through hole of insulat...

Rogowski coil integrated in glass substrate

Field device of process measurement technology, measuring sensor an...

Offset interposers for large-bottom packages and large-die package-...

Right angle sidewall and button interconnects for molded SiPs

Sealed package and method of forming same

Interconnect structure having conductor extending along dielectric...

Resistive PCB traces for improved stability

Circuit carrier, package, and method for manufacturing a package

Embedded module

Manufacturing method of carrier structure

Methods and systems for detecting defects in devices using X-rays

Inspection method of printed wiring board

Acousto-optic modulator system and device with connections and rela...

Methods and systems for printed circuit board design based on autom...

Circuit board structure and manufacturing method thereof

Patents Applicationslast 30 patents

FILLING CRACKS ON A SUBSTRATE VIA

METHOD FOR MANUFACTURING WIRING SUBSTRATE

ELECTRONIC DEVICE

POWER VIA RESONANCE SUPPRESSION

CAMERA MODULE AND MANUFACTURING METHOD THEREOF

SYSTEM AND METHOD TO ELIMINATE VIA STRIPING

SUBSTRATES WITH CONTINUOUS SLOT VIAS

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME

CIRCUIT BOARD MANUFACTURING SYSTEM AND METHOD

SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS

Probe Card and Method of Manufacturing Thereof

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

Battery Management System

METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

VERTICAL INTERCONNECT DESIGN FOR IMPROVED ELECTRICAL PERFORMANCE

MODULAR POWER ELECTRONICS CONVERTERS WITH ENHANCED CONNECTIVITY REL...

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS

ELECTRONIC DEVICE

CIRCUIT BOARD

ELECTRONIC DEVICE COMPRISING SEALING MEMBER

WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE WIRING CIRCUIT BOARD

ELECTRONIC PACKAGE WITH THROUGH-MOLD CONNECTIONS AND RELATED ELECTR...

HEAT DISSIPATION STRUCTURE OF PRINTED CIRCUIT BOARD, MANUFACTURING...

INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC...

DIFFERENTIAL VIA DESIGN ON A PRINTED CIRCUIT BOARD

HARD DISK DRIVE SUSPENSION PAD PRE-SOLDER SIDEWALLS

ELECTRONIC DEVICE CAPABLE OF SUPPRESSING HIGH GROUND IMPEDANCE, AND...

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD

ELECTRONIC DEVICE HAVING MULTILAYERED SUBSTRATE AND MANUFACTURING M...