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CPC
H05K2201/09145

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09145Edge details

Industries

Patents Grantslast 30 patents

Information Patent Grant
Wiring circuit board, producing method thereof, and wiring circuit...
- Patent number 12,167,544
- Issue date Dec 10, 2024
- Nitto Denko Corporation
- Ryosuke Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board
- Patent number 12,137,521
- Issue date Nov 5, 2024
- 3M Innovative Properties Company
- YunLong Qiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic printed circuit board
- Patent number 11,945,500
- Issue date Apr 2, 2024
- ThyssenKrupp Presta AG
- Robert Galehr
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Grant
Edge connector, circuit board, and connector component
- Patent number 11,909,134
- Issue date Feb 20, 2024
- Huawei Technologies Co., Ltd.
- Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component
- Patent number 11,647,581
- Issue date May 9, 2023
- Murata Manufacturing Co., Ltd.
- Yuki Takemori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor substrate
- Patent number 11,644,702
- Issue date May 9, 2023
- Japan Display Inc.
- Ikuo Matsunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component
- Patent number 11,641,712
- Issue date May 2, 2023
- Murata Manufacturing Co., Ltd.
- Yuki Takemori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Edge connector, circuit board, and connector component
- Patent number 11,626,673
- Issue date Apr 11, 2023
- Huawei Technologies Co., Ltd.
- Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 11,602,049
- Issue date Mar 7, 2023
- Tyco Electronics Japan G.K.
- Makiya Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a substrate having depressions formed the...
- Patent number 11,521,941
- Issue date Dec 6, 2022
- Fuji Electric Co., Ltd.
- Yoshinori Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging photon building blocks with top side connections and inte...
- Patent number 11,411,152
- Issue date Aug 9, 2022
- Bridgelux, Inc.
- R. Scott West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having bent portion
- Patent number 11,353,734
- Issue date Jun 7, 2022
- Japan Display Inc.
- Ikuo Matsunaga
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor device
- Patent number 11,337,306
- Issue date May 17, 2022
- Fuji Electric Co., Ltd.
- Kenshi Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board assembly
- Patent number 11,172,574
- Issue date Nov 9, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae-Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Peripheral end face attachment of exposed copper layers of a first...
- Patent number 11,026,326
- Issue date Jun 1, 2021
- International Business Machines Corporation
- Todd E. Takken
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Edge connector, circuit board, and connector component
- Patent number 10,998,653
- Issue date May 4, 2021
- Huawei Technologies Co., Ltd.
- Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board with embedded lateral connector
- Patent number 10,971,836
- Issue date Apr 6, 2021
- Amazon Technologies, Inc.
- William Mische
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having bent portion
- Patent number 10,928,661
- Issue date Feb 23, 2021
- Japan Display Inc.
- Ikuo Matsunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging photon building blocks with top side connections and inte...
- Patent number 10,840,424
- Issue date Nov 17, 2020
- Bridgelux, Inc.
- R. Scott West
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Control boxes and system-on-module circuit boards for unmanned vehi...
- Patent number 10,827,629
- Issue date Nov 3, 2020
- GE Aviation Systems LLC
- Randall Lee Neuman
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Grant
Multilayer LED substrate
- Patent number 10,818,642
- Issue date Oct 27, 2020
- 3M Innovative Properties Company
- Alejandro Aldrin Il A. Narag
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection module for an automotive vehicle
- Patent number 10,811,795
- Issue date Oct 20, 2020
- Valeo Iluminacion
- Jose-David Roldan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cable connector for coaxial cable on thick printed-circuit board
- Patent number 10,797,414
- Issue date Oct 6, 2020
- Hirschmann Car Communication GmbH
- Ingo Heilemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 10,721,820
- Issue date Jul 21, 2020
- Samsung Display Co., Ltd.
- Sangwoon Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board
- Patent number 10,709,016
- Issue date Jul 7, 2020
- Sumitomo Electric Industries, Ltd.
- Yoshio Oka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 10,701,799
- Issue date Jun 30, 2020
- Hewlett-Packard Development Company, L.P.
- Stewart R. Wyatt
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Conductive driver board for light bulb
- Patent number 10,655,795
- Issue date May 19, 2020
- Technical Consumer Products, Inc.
- George J. Uhler
- F21 - LIGHTING
Information Patent Grant
Terminal connection structure and electromagnetic relay using same
- Patent number 10,643,811
- Issue date May 5, 2020
- Omron Corporation
- Seiki Shimoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device
- Patent number 10,620,464
- Issue date Apr 14, 2020
- Japan Display Inc.
- Ikuo Matsunaga
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Wiring board, electronic apparatus, method for attaching sheet meta...
- Patent number 10,624,216
- Issue date Apr 14, 2020
- Fujitsu Limited
- Nobuo Taketomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HEAT SPREADER FOR MODIFIED EDGE COOLING
- Publication number 20240334616
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Keiji Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT STRUCTURE
- Publication number 20240306295
- Publication date Sep 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20240276656
- Publication date Aug 15, 2024
- ACTRON TECHNOLOGY CORPORATION
- Hsin-Chang Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT AND CONNECTOR ELEMENT ALIGNMENT, CIRCUIT BOARD ASSEMBLIES
- Publication number 20240107674
- Publication date Mar 28, 2024
- Infineon Technologies Austria AG
- Eung San Cho
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SYSTEM AND METHOD FOR REVERSIBLE CONNECTION OF INTERCHANGABLE COMPO...
- Publication number 20240032194
- Publication date Jan 25, 2024
- Dell Products L.P.
- EDUARDO ESCAMILLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CIRCUIT BOARD
- Publication number 20230100232
- Publication date Mar 30, 2023
- 3M Innovative Properties Company
- YunLong Qiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD, PRODUCING METHOD THEREOF, AND WIRING CIRCUIT...
- Publication number 20220386463
- Publication date Dec 1, 2022
- Nitto Denko Corporation
- Ryosuke SASAOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE WITH CASTELLATED BOARD
- Publication number 20220377901
- Publication date Nov 24, 2022
- INFINEON TECHNOLOGIES AG
- Tomasz NAEVE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB AND CABLE ASSEMBLY FOR BALANCED HIGH FREQUENCY CONNECTORS
- Publication number 20220159836
- Publication date May 19, 2022
- 3M Innovative Properties Company
- Steven A. Neu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USER INTERFACE CONSOLE FOR AN APPLIANCE PROVIDING CLEARANCE FOR AN...
- Publication number 20220151457
- Publication date May 19, 2022
- Haier US Appliance Solutions, Inc.
- Michelle Diana Gross
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Application
CIRCUIT BOARD
- Publication number 20220053642
- Publication date Feb 17, 2022
- Tyco Electronics Japan G.K.
- Makiya Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210251075
- Publication date Aug 12, 2021
- Fuji Electric Co., Ltd.
- Kenshi KAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210118822
- Publication date Apr 22, 2021
- Fuji Electric Co., Ltd.
- Yoshinori ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20200305282
- Publication date Sep 24, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Jae-Ho SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONNECTOR
- Publication number 20190379165
- Publication date Dec 12, 2019
- Feng ZHU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER LED SUBSTRATE
- Publication number 20190269016
- Publication date Aug 29, 2019
- 3M Innovative Properties Company
- Alejandro Aldrin II A. Narag
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical Terminal Having a Cage Clamp for Wire Termination
- Publication number 20190123461
- Publication date Apr 25, 2019
- FISHER CONTROLS INTERNATIONAL LLC
- Stephen George Seberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED BOARD, DISPLAY DEVICE, AND METHOD OF MANUFACTURING THE DISP...
- Publication number 20190124769
- Publication date Apr 25, 2019
- JOLED INC.
- Hirofumi MIYASHITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE DRIVER BOARD FOR LIGHT BULB
- Publication number 20190101247
- Publication date Apr 4, 2019
- TECHNICAL CONSUMER PRODUCTS, INC.
- George J. UHLER
- F21 - LIGHTING
Information Patent Application
Edge Connector, Circuit Board, and Connector Component
- Publication number 20180366847
- Publication date Dec 20, 2018
- Huawei Technologies Co., Ltd
- Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION MODULE FOR AN AUTOMOTIVE VEHICLE
- Publication number 20180241141
- Publication date Aug 23, 2018
- Valeo Iluminacion
- Jose-David ROLDAN
- F21 - LIGHTING
Information Patent Application
FLEXIBLE DEVICE MODULE FOR FABRIC LAYER ASSEMBLY AND METHOD FOR PRO...
- Publication number 20180020541
- Publication date Jan 18, 2018
- Nederlandes Organisastie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Margaretha Maria de Kok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUID CONTROL APPARATUS
- Publication number 20170285666
- Publication date Oct 5, 2017
- HORIBA STEC, CO., LTD.
- Katsuya Ohtani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FRAME AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USI...
- Publication number 20160120032
- Publication date Apr 28, 2016
- SOOJAE PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND WIRING BOARD PRODUCTION METHOD
- Publication number 20150282313
- Publication date Oct 1, 2015
- KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
- Kiminori Ozaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Devices And Methods For Cooling Components On A PCB
- Publication number 20140355211
- Publication date Dec 4, 2014
- Control Techniques Limited
- Shashikant Dhondopant Patil
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible Printed Circuit Cables With Slits
- Publication number 20140354900
- Publication date Dec 4, 2014
- Amy Qian
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DEVICE FOR SUPPLYING ELECTRICAL ENERGY TO A LOAD, AND SYSTEM THEREFOR
- Publication number 20140349502
- Publication date Nov 27, 2014
- Alfons Meis
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Application
COMMUNICATIONS JACKS HAVING FLEXIBLE PRINTED CIRCUIT BOARDS WITH CO...
- Publication number 20140342610
- Publication date Nov 20, 2014
- Amid I. Hashim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140307382
- Publication date Oct 16, 2014
- KABUSHIKI KAISHA TOSHIBA
- Takakatsu Moriai
- G06 - COMPUTING CALCULATING COUNTING

Edge details

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring circuit board, producing method thereof, and wiring circuit...

Multilayer circuit board

Electronic printed circuit board

Edge connector, circuit board, and connector component

Ceramic electronic component

Semiconductor substrate

Ceramic electronic component

Edge connector, circuit board, and connector component

Circuit board

Semiconductor device with a substrate having depressions formed the...

Packaging photon building blocks with top side connections and inte...

Semiconductor device having bent portion

Semiconductor device

Printed circuit board assembly

Peripheral end face attachment of exposed copper layers of a first...

Edge connector, circuit board, and connector component

Printed circuit board with embedded lateral connector

Semiconductor device having bent portion

Packaging photon building blocks with top side connections and inte...

Control boxes and system-on-module circuit boards for unmanned vehi...

Multilayer LED substrate

Connection module for an automotive vehicle

Cable connector for coaxial cable on thick printed-circuit board

Display device

Flexible printed circuit board

Printed circuit board

Conductive driver board for light bulb

Terminal connection structure and electromagnetic relay using same

Display device

Wiring board, electronic apparatus, method for attaching sheet meta...

Patents Applicationslast 30 patents

HEAT SPREADER FOR MODIFIED EDGE COOLING

CIRCUIT STRUCTURE

CIRCUIT SUBSTRATE AND ELECTRONIC DEVICE

CIRCUIT AND CONNECTOR ELEMENT ALIGNMENT, CIRCUIT BOARD ASSEMBLIES

SYSTEM AND METHOD FOR REVERSIBLE CONNECTION OF INTERCHANGABLE COMPO...

MULTILAYER CIRCUIT BOARD

WIRING CIRCUIT BOARD, PRODUCING METHOD THEREOF, AND WIRING CIRCUIT...

ELECTRONIC DEVICE WITH CASTELLATED BOARD

PCB AND CABLE ASSEMBLY FOR BALANCED HIGH FREQUENCY CONNECTORS

USER INTERFACE CONSOLE FOR AN APPLIANCE PROVIDING CLEARANCE FOR AN...

CIRCUIT BOARD

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

PRINTED CIRCUIT BOARD ASSEMBLY

ELECTRICAL CONNECTOR

MULTILAYER LED SUBSTRATE

Electrical Terminal Having a Cage Clamp for Wire Termination

PRINTED BOARD, DISPLAY DEVICE, AND METHOD OF MANUFACTURING THE DISP...

CONDUCTIVE DRIVER BOARD FOR LIGHT BULB

Edge Connector, Circuit Board, and Connector Component

CONNECTION MODULE FOR AN AUTOMOTIVE VEHICLE

FLEXIBLE DEVICE MODULE FOR FABRIC LAYER ASSEMBLY AND METHOD FOR PRO...

FLUID CONTROL APPARATUS

PACKAGE FRAME AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USI...

WIRING BOARD AND WIRING BOARD PRODUCTION METHOD

Devices And Methods For Cooling Components On A PCB

Flexible Printed Circuit Cables With Slits

DEVICE FOR SUPPLYING ELECTRICAL ENERGY TO A LOAD, AND SYSTEM THEREFOR

COMMUNICATIONS JACKS HAVING FLEXIBLE PRINTED CIRCUIT BOARDS WITH CO...

SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME