Edge mounted components

Industry

CPC
H05K3/3405

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/3405Edge mounted components

Industries

Patents Grantslast 30 patents

Information Patent Grant
Dual-path high-speed interconnect PCB layout solution
- Patent number 12,068,554
- Issue date Aug 20, 2024
- Hewlett Packard Enterprise Development LP
- Paul Danna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit assembly
- Patent number 11,898,915
- Issue date Feb 13, 2024
- Autonetworks Technologies, Ltd.
- Akira Haraguchi
- G01 - MEASURING TESTING
Information Patent Grant
Lead frame, packaged integrated circuit board, power chip, and circ...
- Patent number 11,887,918
- Issue date Jan 30, 2024
- Huawei Technologies Co., Ltd.
- Xuanwei Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering aid for connecting a cable to a printed circuit board
- Patent number 11,729,916
- Issue date Aug 15, 2023
- MD Elektronik GmbH
- Gerd Mittermaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED assembly with omnidirectional light field
- Patent number 11,543,081
- Issue date Jan 3, 2023
- Epistar Corporation
- Hong-Zhi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Touch sensor module and image display device comprising same
- Patent number 11,445,615
- Issue date Sep 13, 2022
- Dongwoo Fine-Chem Co., Ltd.
- Jun-Ha Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic package and method of forming an electronic package
- Patent number 11,399,434
- Issue date Jul 26, 2022
- Intel Corporation
- Florence Pon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging module and method of manufacturing the same
- Patent number 11,337,597
- Issue date May 24, 2022
- Fujikura Ltd.
- Takeshi Ishizuka
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Panel molded electronic assemblies with integral terminals
- Patent number 11,304,297
- Issue date Apr 12, 2022
- Vicor Corporation
- Patrizio Vinciarelli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Overmolded electronic module with an integrated electromagnetic shi...
- Patent number 11,166,399
- Issue date Nov 2, 2021
- Skyworks Solutions, Inc.
- Philip H. Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with wall-side capacitors
- Patent number 11,158,568
- Issue date Oct 26, 2021
- Intel Corporation
- Jenny Shio Yin Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixing apparatus
- Patent number 11,160,173
- Issue date Oct 26, 2021
- Tyco Electronics (Shanghai) Co. Ltd.
- Yingcong Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-cost superior performance coinless RF power amplifier
- Patent number 10,912,185
- Issue date Feb 2, 2021
- Telefonaktiebolaget LM Ericsson (publ)
- Reginald Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting a power amplifier (AP) assembly
- Patent number 10,842,028
- Issue date Nov 17, 2020
- Telefonaktiebolaget LM Ericsson (publ)
- Ronald Nehring
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Trace/via hybrid structure multichip carrier
- Patent number 10,791,628
- Issue date Sep 29, 2020
- International Business Machines Corporation
- Chad M. Albertson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Panel molded electronic assemblies with integral terminals
- Patent number 10,785,871
- Issue date Sep 22, 2020
- VLT, Inc.
- Patrizio Vinciarelli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, electronic component and display apparatus
- Patent number 10,779,410
- Issue date Sep 15, 2020
- Beijing BOE Optoelectronics Technology Co., Ltd
- Lingguo Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical subassembly and optical module
- Patent number 10,761,278
- Issue date Sep 1, 2020
- Hisense Broadband Multimedia Technologies Co., Ltd
- Tao Jiang
- G02 - OPTICS
Information Patent Grant
Method to form a stacked electronic structure
- Patent number 10,741,531
- Issue date Aug 11, 2020
- Cyntec Co., Ltd.
- Chi-Feng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses, systems, and methods for integrating hardware accelera...
- Patent number 10,729,030
- Issue date Jul 28, 2020
- Facebook, Inc.
- Austin Joel Cousineau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedding discrete components having variable dimensions in a subst...
- Patent number 10,701,797
- Issue date Jun 30, 2020
- International Business Machines Corporation
- Lei Shan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual-sided FPC assembly and related systems and methods for hotbar...
- Patent number 10,687,422
- Issue date Jun 16, 2020
- Google LLC
- Jordan Andrew Kestler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tiered circuit board for interfacing cables and connectors
- Patent number 10,658,772
- Issue date May 19, 2020
- Adtran, Inc.
- Jared D. Cress
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package module
- Patent number 10,638,614
- Issue date Apr 28, 2020
- Samsung Electronics Co., Ltd.
- Hyuk-jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, electronic apparatus, method for attaching sheet meta...
- Patent number 10,624,216
- Issue date Apr 14, 2020
- Fujitsu Limited
- Nobuo Taketomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface-mount connector, surface-mount circuit board, and method of...
- Patent number 10,615,526
- Issue date Apr 7, 2020
- Fujitsu Limited
- Yasushi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board, a terminal and a method of assembling a prin...
- Patent number 10,617,007
- Issue date Apr 7, 2020
- Telefonaktiebolaget LM Ericsson (publ)
- Igor Perez-Uria
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for pressing pre-tin shaping
- Patent number 10,512,172
- Issue date Dec 17, 2019
- Tyco Electronics (Dongguan) Co., Ltd.
- Hongzhou Shen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and shield thereof
- Patent number 10,462,943
- Issue date Oct 29, 2019
- Wistron NeWeb Corp.
- Jen-Yung Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Image pickup apparatus
- Patent number 10,440,243
- Issue date Oct 8, 2019
- Olympus Corporation
- Noriyuki Fujimori
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240243086
- Publication date Jul 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Sheng-Hsiang HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR, CONNECTOR PREPARATION METHOD, INTERCONNECTION SYSTEM, AN...
- Publication number 20240222888
- Publication date Jul 4, 2024
- Huawei Technologies Co., Ltd
- Shuzhao Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD GROUNDING
- Publication number 20240196516
- Publication date Jun 13, 2024
- AES Global Holdings PTE Ltd.
- Yihong Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE WIRING BOARD AND LIGHT CONTROL UNIT
- Publication number 20240155762
- Publication date May 9, 2024
- TOPPAN INC.
- Masaki TSUJI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
A CIRCUIT
- Publication number 20240098906
- Publication date Mar 21, 2024
- NXP B.V.
- Xin Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEV...
- Publication number 20230413453
- Publication date Dec 21, 2023
- STEMCO CO., LTD.
- Sung Jin LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL-PATH HIGH-SPEED INTERCONNECT PCB LAYOUT SOLUTION
- Publication number 20230246353
- Publication date Aug 3, 2023
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Paul Danna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD EDGE ELECTRICAL CONTACT STRUCTURES
- Publication number 20230232533
- Publication date Jul 20, 2023
- Nokia Solutions and Networks Oy
- David NORTH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE GEOMETRIES TO ENABLE VISUAL INSPECTION OF SOLDER FILLETS
- Publication number 20230098907
- Publication date Mar 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- LongTing LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transmission Line Capacitor and Circuit Board Including the Same Em...
- Publication number 20220346222
- Publication date Oct 27, 2022
- KYOCRA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD FRAME, PACKAGED INTEGRATED CIRCUIT BOARD, POWER CHIP, AND CIRC...
- Publication number 20220223506
- Publication date Jul 14, 2022
- Huawei Technologies Co., Ltd
- Xuanwei FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING AID FOR CONNECTING A CABLE TO A PRINTED CIRCUIT BOARD
- Publication number 20220030722
- Publication date Jan 27, 2022
- MD ELEKTRONIK GmbH
- Gerd Mittermaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC COMPONENT OF AN INTERVENTIONAL MEDICAL DEVICE
- Publication number 20210386376
- Publication date Dec 16, 2021
- Koninklijke Philips N.V.
- Johannes Wilhelmus WEEKAMP
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
CIRCUIT ASSEMBLY
- Publication number 20210293629
- Publication date Sep 23, 2021
- AUTONETWORKS TECHNOLOGIES, LTD.
- Akira Haraguchi
- G01 - MEASURING TESTING
Information Patent Application
Touch Sensor Module and Image Display Device Comprising Same
- Publication number 20210289635
- Publication date Sep 16, 2021
- DONGWOO FINE-CHEM CO., LTD.
- Jun-Ha Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210195751
- Publication date Jun 24, 2021
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Mathijs Rien DE SCHIPPER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD-LEVEL ARCHITECTURE, METHOD FOR MANUFACTURING BOARD-LEVEL ARCH...
- Publication number 20200120810
- Publication date Apr 16, 2020
- Huawei Technologies Co., Ltd
- Dapeng He
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR END ASSEMBLIES
- Publication number 20200120800
- Publication date Apr 16, 2020
- Intel Corporation
- Florence PON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OVERMOLDED ELECTRONIC MODULE WITH AN INTEGRATED ELECTROMAGNETIC SHI...
- Publication number 20190394912
- Publication date Dec 26, 2019
- SKYWORKS SOLUTIONS, INC.
- Philip H. Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual-Sided FPC Assembly and Related Systems and Methods for Hotbar...
- Publication number 20190357356
- Publication date Nov 21, 2019
- Google LLC
- Jordan Andrew Kestler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL SUBASSEMBLY AND OPTICAL MODULE
- Publication number 20190285816
- Publication date Sep 19, 2019
- HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD
- Tao JIANG
- G02 - OPTICS
Information Patent Application
CABLE TERMINATION FOR CONNECTORS
- Publication number 20190260165
- Publication date Aug 22, 2019
- THE SIEMON COMPANY
- Randy J. Below
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE MODULE
- Publication number 20190246505
- Publication date Aug 8, 2019
- Samsung Electronics Co., Ltd.
- Hyuk-jin LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, ELECTRONIC COMPONENT AND DISPLAY APPARATUS
- Publication number 20190208635
- Publication date Jul 4, 2019
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Lingguo WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE-MOUNT CONNECTOR, SURFACE-MOUNT CIRCUIT BOARD, AND METHOD OF...
- Publication number 20190199022
- Publication date Jun 27, 2019
- Fujitsu Limited
- Yasushi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD, A TERMINAL AND A METHOD OF ASSEMBLING A PRIN...
- Publication number 20190090349
- Publication date Mar 21, 2019
- Telefonaktiebolaget LM Ericsson (publ)
- Igor PEREZ-URIA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTING CABLE ASSEMBLY, ELECTRICAL CONNECTOR ASSEMBLY AND PADDLE...
- Publication number 20180366852
- Publication date Dec 20, 2018
- CviLux Corporation
- CHAO-CHUN YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Electronic Structure
- Publication number 20180308829
- Publication date Oct 25, 2018
- CYNTEC CO., LTD.
- Chi-Feng Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SLIDE AND MOUNT MANUFACTURING FOR COINLESS RF POWER AMPLIFIER
- Publication number 20180310416
- Publication date Oct 25, 2018
- Telefonaktiebolaget LM Ericsson (publ)
- Ronald NEHRING
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND SHIELD THEREOF
- Publication number 20180263143
- Publication date Sep 13, 2018
- WISTRON NEWEB CORP.
- Jen-Yung Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Edge mounted components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Dual-path high-speed interconnect PCB layout solution

Circuit assembly

Lead frame, packaged integrated circuit board, power chip, and circ...

Soldering aid for connecting a cable to a printed circuit board

LED assembly with omnidirectional light field

Touch sensor module and image display device comprising same

Electronic package and method of forming an electronic package

Imaging module and method of manufacturing the same

Panel molded electronic assemblies with integral terminals

Overmolded electronic module with an integrated electromagnetic shi...

Package with wall-side capacitors

Fixing apparatus

Low-cost superior performance coinless RF power amplifier

Method for mounting a power amplifier (AP) assembly

Trace/via hybrid structure multichip carrier

Panel molded electronic assemblies with integral terminals

Circuit board, electronic component and display apparatus

Optical subassembly and optical module

Method to form a stacked electronic structure

Apparatuses, systems, and methods for integrating hardware accelera...

Embedding discrete components having variable dimensions in a subst...

Dual-sided FPC assembly and related systems and methods for hotbar...

Tiered circuit board for interfacing cables and connectors

Semiconductor package module

Wiring board, electronic apparatus, method for attaching sheet meta...

Surface-mount connector, surface-mount circuit board, and method of...

Printed circuit board, a terminal and a method of assembling a prin...

System for pressing pre-tin shaping

Electronic device and shield thereof

Image pickup apparatus

Patents Applicationslast 30 patents

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

CONNECTOR, CONNECTOR PREPARATION METHOD, INTERCONNECTION SYSTEM, AN...

PRINTED CIRCUIT BOARD GROUNDING

FLEXIBLE WIRING BOARD AND LIGHT CONTROL UNIT

A CIRCUIT

CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEV...

DUAL-PATH HIGH-SPEED INTERCONNECT PCB LAYOUT SOLUTION

BOARD EDGE ELECTRICAL CONTACT STRUCTURES

PACKAGE GEOMETRIES TO ENABLE VISUAL INSPECTION OF SOLDER FILLETS

Transmission Line Capacitor and Circuit Board Including the Same Em...

LEAD FRAME, PACKAGED INTEGRATED CIRCUIT BOARD, POWER CHIP, AND CIRC...

SOLDERING AID FOR CONNECTING A CABLE TO A PRINTED CIRCUIT BOARD

ELECTRIC COMPONENT OF AN INTERVENTIONAL MEDICAL DEVICE

CIRCUIT ASSEMBLY

Touch Sensor Module and Image Display Device Comprising Same

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

BOARD-LEVEL ARCHITECTURE, METHOD FOR MANUFACTURING BOARD-LEVEL ARCH...

CONNECTOR END ASSEMBLIES

OVERMOLDED ELECTRONIC MODULE WITH AN INTEGRATED ELECTROMAGNETIC SHI...

Dual-Sided FPC Assembly and Related Systems and Methods for Hotbar...

OPTICAL SUBASSEMBLY AND OPTICAL MODULE

CABLE TERMINATION FOR CONNECTORS

SEMICONDUCTOR PACKAGE MODULE

CIRCUIT BOARD, ELECTRONIC COMPONENT AND DISPLAY APPARATUS

SURFACE-MOUNT CONNECTOR, SURFACE-MOUNT CIRCUIT BOARD, AND METHOD OF...

PRINTED CIRCUIT BOARD, A TERMINAL AND A METHOD OF ASSEMBLING A PRIN...

CONNECTING CABLE ASSEMBLY, ELECTRICAL CONNECTOR ASSEMBLY AND PADDLE...

Stacked Electronic Structure

SLIDE AND MOUNT MANUFACTURING FOR COINLESS RF POWER AMPLIFIER

ELECTRONIC DEVICE AND SHIELD THEREOF