Elastomer inlay

Industry

CPC
H01L2224/75315

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75315Elastomer inlay

Industries

Patents Grantslast 30 patents

Information Patent Grant
Pressure sintering device and method for manufacturing an electroni...
- Patent number 12,046,576
- Issue date Jul 23, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,776,932
- Issue date Oct 3, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,626,383
- Issue date Apr 11, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 11,472,171
- Issue date Oct 18, 2022
- X Display Company Technology Limited
- Christopher Bower
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Sintering tool and method for sintering an electronic subassembly
- Patent number 11,400,514
- Issue date Aug 2, 2022
- Danfoss Silicon Power GmbH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for producing an integral join and automatic placement machine
- Patent number 11,081,464
- Issue date Aug 3, 2021
- Infineon Technologies AG
- Nicolas Heuck
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Sintering tool and method for sintering an electronic subassembly
- Patent number 10,814,396
- Issue date Oct 27, 2020
- Danfoss Silicon Power GmbH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for producing a connecting medium on an assembly partner, me...
- Patent number 10,615,138
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Nicolas Heuck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for the material-bonded connection of connection partners...
- Patent number 10,603,741
- Issue date Mar 31, 2020
- Semikron Elektronik GmbH & Co., KG
- Ingo Bogen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 10,607,964
- Issue date Mar 31, 2020
- TOSHIBA MEMORY CORPORATION
- Shinya Fukayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering device
- Patent number 10,483,229
- Issue date Nov 19, 2019
- Danfoss Silicon Power GmbH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 10,252,514
- Issue date Apr 9, 2019
- X-CELEPRINT LIMITED
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Pressure-activated electrical interconnection by micro-transfer pri...
- Patent number 10,163,735
- Issue date Dec 25, 2018
- X-CELEPRINT LIMITED
- Christopher Andrew Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for simultaneously bonding multiple chips of different heigh...
- Patent number 10,147,702
- Issue date Dec 4, 2018
- Palo Alto Research Center Incorporated
- Brent S. Krusor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure-activated electrical interconnection by micro-transfer pri...
- Patent number 10,103,069
- Issue date Oct 16, 2018
- X-CELEPRINT LIMITED
- Christopher Andrew Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for semiconductor die removal rework
- Patent number 10,050,012
- Issue date Aug 14, 2018
- International Business Machines Corporation
- Stephen P. Ayotte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor device, heat insulating load...
- Patent number 10,020,282
- Issue date Jul 10, 2018
- Nissan Motor Co., Ltd.
- Satoshi Tanimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor bonding with compliant resin and utilizing hydrogen i...
- Patent number 9,991,149
- Issue date Jun 5, 2018
- Skorpios Technologies, Inc.
- Damien Lambert
- G02 - OPTICS
Information Patent Grant
Chip-stacking apparatus having a transport device configured to tra...
- Patent number 9,842,823
- Issue date Dec 12, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of attaching an electronic part to a copper plate having a s...
- Patent number 9,831,157
- Issue date Nov 28, 2017
- Dowa Metaltech Co., Ltd.
- Naoya Sunachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip attach frame
- Patent number 9,686,895
- Issue date Jun 20, 2017
- International Business Machines Corporation
- Martin Eckert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a material-bonding connection between a semico...
- Patent number 9,659,793
- Issue date May 23, 2017
- Infineon Technologies AG
- Nicolas Heuck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanism to attach a die to a substrate
- Patent number 9,630,269
- Issue date Apr 25, 2017
- GLOBALFOUNDRIES Inc.
- Vijayeshwar D. Khanna
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 9,550,353
- Issue date Jan 24, 2017
- X-CELEPRINT LIMITED
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Method for manufacturing liquid crystal display device
- Patent number 9,502,613
- Issue date Nov 22, 2016
- Sharp Kabushiki Kaisha
- Yasuhiko Sugihara
- G02 - OPTICS
Information Patent Grant
Vacuum thermal bonding apparatus
- Patent number 9,451,708
- Issue date Sep 20, 2016
- MIKADO TECHNOS CO., LTD.
- Takashi Ito
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 9,434,150
- Issue date Sep 6, 2016
- X-CELEPRINT LIMITED
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Semiconductor device with mechanical lock features between a semico...
- Patent number 9,425,161
- Issue date Aug 23, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Lakshminarayan Viswanathan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 9,358,775
- Issue date Jun 7, 2016
- X-CELEPRINT LIMITED
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Method of manufacturing connection structure
- Patent number 9,318,353
- Issue date Apr 19, 2016
- Dexerials Corporation
- Ryoji Kojima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
TRANSFER PRINTING STAMPS AND METHODS OF STAMP DELAMINATION
- Publication number 20240038570
- Publication date Feb 1, 2024
- X-CELEPRINT LIMITED
- Ken G. Purchase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE SINTERING DEVICE AND METHOD FOR MANUFACTURING AN ELECTRONI...
- Publication number 20220157773
- Publication date May 19, 2022
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING
- Publication number 20210104488
- Publication date Apr 8, 2021
- DANFOSS SILICON POWER GMBH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SINTERING TOOL AND METHOD FOR SINTERING AN ELECTRONIC SUBASSEMBLY
- Publication number 20210016353
- Publication date Jan 21, 2021
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD FOR SIMULTANEOUSLY BONDING MULTIPLE CHIPS OF DIFFERENT HEIGH...
- Publication number 20180114772
- Publication date Apr 26, 2018
- Palo Alto Research Center Incorporated
- Brent S. Krusor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING
- Publication number 20180001614
- Publication date Jan 4, 2018
- X-Celeprint Limited
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
APPARATUS FOR ESPECIALLY THERMALLY JOINING MICRO-ELECTROMECHANICAL...
- Publication number 20170243851
- Publication date Aug 24, 2017
- ATV TECHNOLOGIE GMBH
- Ventzeslav RANGELOV
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING
- Publication number 20170207193
- Publication date Jul 20, 2017
- X-Celeprint Limited
- Christopher Bower
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING
- Publication number 20170103964
- Publication date Apr 13, 2017
- X-Celeprint Limited
- Christopher Andrew Bower
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
CONNECTION DEVICE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, M...
- Publication number 20140302643
- Publication date Oct 9, 2014
- Takayuki Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT BONDING METHOD
- Publication number 20140263581
- Publication date Sep 18, 2014
- ALPHA DESIGN CO., LTD.
- Toshiyuki SHIRATORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUFFER FILM FOR MULTI-CHIP PACKAGING
- Publication number 20140248477
- Publication date Sep 4, 2014
- DEXERIALS CORPORATION
- Akira Ishigami
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF MANUFACTURING CONNECTION STRUCTURE
- Publication number 20140226297
- Publication date Aug 14, 2014
- DEXERIALS CORPORATION
- Ryoji Kojima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
APPARATUS AND METHODS FOR MULTI-SCALE ALIGNMENT AND FASTENING
- Publication number 20140090234
- Publication date Apr 3, 2014
- University of Massachusetts
- David Kazmer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM THERMAL BONDING APPARATUS AND VACUUM THERMAL BONDING METHOD
- Publication number 20140033518
- Publication date Feb 6, 2014
- MIKADO TECHNOS CO., LTD.
- Takashi Ito
- B32 - LAYERED PRODUCTS
Information Patent Application
METHODS FOR PRODUCING A BOND AND A SEMICONDUCTOR MODULE
- Publication number 20140013595
- Publication date Jan 16, 2014
- Tao Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY AND PRODUCTION OF AN ASSEMBLY
- Publication number 20140001244
- Publication date Jan 2, 2014
- ROBERT BOSCH GmbH
- Daniel WOLDE-GIORGIS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE DIMENSIONAL FLIP CHIP SYSTEM AND METHOD
- Publication number 20130330880
- Publication date Dec 12, 2013
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL FLIP CHIP SYSTEM AND METHOD
- Publication number 20130327811
- Publication date Dec 12, 2013
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR THIN DIE-TO-WAFER BONDING
- Publication number 20130273691
- Publication date Oct 17, 2013
- THE RESEARCH FOUNDATION OF STATE UNIVERSITY OF NEW YORK
- Daniel PASCUAL
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR REDUCING PACKAGE WARPAGE
- Publication number 20130260535
- Publication date Oct 3, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse CHEN
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CHIP ATTACH FRAME
- Publication number 20130207250
- Publication date Aug 15, 2013
- International Business Machines Corporation
- Martin Eckert
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR FORMING LAMINATE AND LAMINATING DEVICE
- Publication number 20130126074
- Publication date May 23, 2013
- Kabushiki Kaisha Meiki Seisakusho
- Tomoaki HIROSE
- B32 - LAYERED PRODUCTS
Information Patent Application
BUFFER FILM FOR MULTI-CHIP PACKAGING
- Publication number 20130092310
- Publication date Apr 18, 2013
- DEXERIALS CORPORATION
- Akira Ishigami
- B32 - LAYERED PRODUCTS
Information Patent Application
Fixing Semiconductor Die in Dry and Pressure Supported Assembly Pro...
- Publication number 20130040424
- Publication date Feb 14, 2013
- INFINEON TECHNOLOGIES AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS OF MANUFACTURING SEMICONDUCTOR PACKAGES AND METHODS OF MA...
- Publication number 20120313332
- Publication date Dec 13, 2012
- Chang-Seong Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR BONDING APPARATUS
- Publication number 20120312863
- Publication date Dec 13, 2012
- International Business Machines Corporation
- Kuniaki Sueoka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE INCLUDING A SINTERED JOINT BONDING A SEMICONDUCTOR CHIP TO A...
- Publication number 20120312864
- Publication date Dec 13, 2012
- INFINEON TECHNOLOGIES AG
- Karsten Guth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD...
- Publication number 20120298310
- Publication date Nov 29, 2012
- Teppei Iwase
- B30 - PRESSES
Information Patent Application
EPOXY RESIN COMPOSITION, METHOD FOR PRODUCING COMPOSITE UNIT USING...
- Publication number 20120281376
- Publication date Nov 8, 2012
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Taichi Koyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Elastomer inlay

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Pressure sintering device and method for manufacturing an electroni...

Process and device for low-temperature pressure sintering

Process and device for low-temperature pressure sintering

Apparatus and methods for micro-transfer-printing

Sintering tool and method for sintering an electronic subassembly

Method for producing an integral join and automatic placement machine

Sintering tool and method for sintering an electronic subassembly

Method for producing a connecting medium on an assembly partner, me...

Apparatus for the material-bonded connection of connection partners...

Semiconductor device

Sintering device

Apparatus and methods for micro-transfer-printing

Pressure-activated electrical interconnection by micro-transfer pri...

Method for simultaneously bonding multiple chips of different heigh...

Pressure-activated electrical interconnection by micro-transfer pri...

Method for semiconductor die removal rework

Method for manufacturing semiconductor device, heat insulating load...

Semiconductor bonding with compliant resin and utilizing hydrogen i...

Chip-stacking apparatus having a transport device configured to tra...

Method of attaching an electronic part to a copper plate having a s...

Chip attach frame

Method for producing a material-bonding connection between a semico...

Mechanism to attach a die to a substrate

Apparatus and methods for micro-transfer-printing

Method for manufacturing liquid crystal display device

Vacuum thermal bonding apparatus

Apparatus and methods for micro-transfer-printing

Semiconductor device with mechanical lock features between a semico...

Apparatus and methods for micro-transfer-printing

Method of manufacturing connection structure

Patents Applicationslast 30 patents

TRANSFER PRINTING STAMPS AND METHODS OF STAMP DELAMINATION

PRESSURE SINTERING DEVICE AND METHOD FOR MANUFACTURING AN ELECTRONI...

PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING

SINTERING TOOL AND METHOD FOR SINTERING AN ELECTRONIC SUBASSEMBLY

METHOD FOR SIMULTANEOUSLY BONDING MULTIPLE CHIPS OF DIFFERENT HEIGH...

APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING

APPARATUS FOR ESPECIALLY THERMALLY JOINING MICRO-ELECTROMECHANICAL...

APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING

APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING

CONNECTION DEVICE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, M...

ELECTRONIC COMPONENT BONDING METHOD

BUFFER FILM FOR MULTI-CHIP PACKAGING

METHOD OF MANUFACTURING CONNECTION STRUCTURE

APPARATUS AND METHODS FOR MULTI-SCALE ALIGNMENT AND FASTENING

VACUUM THERMAL BONDING APPARATUS AND VACUUM THERMAL BONDING METHOD

METHODS FOR PRODUCING A BOND AND A SEMICONDUCTOR MODULE

ASSEMBLY AND PRODUCTION OF AN ASSEMBLY

THREE DIMENSIONAL FLIP CHIP SYSTEM AND METHOD

THREE DIMENSIONAL FLIP CHIP SYSTEM AND METHOD

APPARATUS AND METHOD FOR THIN DIE-TO-WAFER BONDING

METHOD AND APPARATUS FOR REDUCING PACKAGE WARPAGE

CHIP ATTACH FRAME

METHOD FOR FORMING LAMINATE AND LAMINATING DEVICE

BUFFER FILM FOR MULTI-CHIP PACKAGING

Fixing Semiconductor Die in Dry and Pressure Supported Assembly Pro...

APPARATUS OF MANUFACTURING SEMICONDUCTOR PACKAGES AND METHODS OF MA...

SEMICONDUCTOR BONDING APPARATUS

MODULE INCLUDING A SINTERED JOINT BONDING A SEMICONDUCTOR CHIP TO A...

SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD...

EPOXY RESIN COMPOSITION, METHOD FOR PRODUCING COMPOSITE UNIT USING...