The embodiments generally describe apparatus and methods for alignment and assembly of structures with micron and nanometer-level alignment accuracies.
Significant advances have been made in micro- and nano-scale science and engineering; nanostructure assemblies have recently been designed with unique properties including photonic, electronic, and biosensing devices. (See, Guo, L. J., Recent progress in nanoimprint technology and its applications. Journal of Physics-London, Part D: Applied Physics, 2004. 37: p. 123-141.) There currently exist a number of common processes for nano-scale fabrication that include photolithography, electron-beam lithography, atomic force microscopy, ion beam milling, imprint lithography, as well as many other patterning and fabrication techniques with resolutions approaching and below 10 nm.
One of the most significant barriers to widespread use and commercialization of nanofabrication relates to the interfacing of multiple components and features across multiple length scales. For example, the unaided human can readily interact with and assemble devices with dimensions ranging from mm to m, but is largely incapable of manipulating and/or assembling devices with smaller length scales. Robotic systems can be used to easily and reliably manipulate and assemble features and components down to about 10 μm in size. However, finer interfacing typically requires more costly and esoteric closed loop positioning systems such as mask aligners and scanning electron microscopes having vibration isolation mechanisms and in some cases complex laser interferometric position sensors. The bulk, cost, and time-consuming operation of these instruments often preclude their use in mass production and assembly techniques. Further, instruments that can manipulate objects at the micron and/or nanometer scale are often not adapted to handle objects at larger length scales.
Described herein are techniques for performing alignment and optional fastening of multiple components across multiple length scales. The inventors have recognized and appreciated that mating alignment features spanning multiple length scales may be incorporated onto selected surfaces of objects to aid in the alignment and assembly of the objects requiring micron-level and/or nanometer-level alignment accuracy. In some cases, the alignment features may guide alignment of the assembled objects down to the nanometer length scale, even when assembled by hand or using low-tech assembly instrumentation. In some embodiments, the alignment features may be embodied in a fractal pattern, though other patterns may be used. Further, the alignment features may provide a retaining force that can hold the assembled objects together. The simplicity of the alignment technique and diversity of its application will be appreciated by those skilled in the art of micro- and nano-scale fabrication.
One aspect of the inventive embodiments includes a first plurality of alignment features disposed at a first surface of a first object. The first plurality of alignment features may comprise at least one first alignment feature comprising a three-dimensional structure having a first length scale as measured parallel to the first surface. The first plurality of alignment features may further comprise at least one second alignment feature comprising a three-dimensional structure having a second length scale as measured parallel to the first surface. The second length scale may be less than one-half the first length scale. Additionally, the first plurality of alignment features may be configured to mate with a plurality of corresponding second alignment features at a second surface of a second object.
Another embodiment includes a first object comprising a plurality of alignment features disposed at a first surface of the first object. The plurality of alignment features may comprise at least one first alignment feature comprising a three-dimensional structure having a first length measured parallel to the first surface, and at least one second alignment feature comprising a three-dimensional structure having a second length measured parallel to the first surface. The plurality of alignment features may be configured to mate with a plurality of corresponding alignment features on a second surface of a second object, and the second length may be less than one-half the first length.
Also contemplated is a means for aligning a first object to a second object, wherein the means comprises mating a first plurality of alignment features to a second plurality of alignment features. The first and second plurality of alignment features may include mating alignment features of at least two different length scales.
A further aspect of the invention includes a method for aligning a first object to a second object. The method comprises an act of moving a first plurality of alignment features disposed at a first surface of the first object into mating contact with a second plurality of alignment features disposed at a second surface of the second object. In this method, the first plurality of alignment features comprises at least one first alignment feature comprising a three-dimensional structure having a first length measured parallel to the first surface, and at least one second alignment feature comprising a three-dimensional structure having a second length measured parallel to the first surface. The first plurality of alignment features may be configured to mate with the second plurality of alignment features, and the second length may be less than one-half the first length.
According to another embodiment, a method for aligning a first object to a second object further includes holding the first and/or second object in at least one fixture that permits displacement and/or rotation of the first and/or second object with respect to the at least one fixture; moving the first object and/or second object so that the first surface moves toward the second surface; engaging the at least one first alignment feature to achieve a first alignment accuracy between the first and second objects; and engaging the at least one second alignment feature to achieve a second alignment accuracy between the first and second objects. In various embodiments, the second alignment accuracy is more accurate than the first alignment accuracy.
Yet another aspect of the invention includes a die for replicating alignment features. The die may comprise a plurality of first alignment features, each one of the first alignment features comprising a three-dimensional structure having a first length scale as measured parallel to a first surface of the die. The die further includes a plurality of second alignment features, each one of the second alignment features comprising a three-dimensional structure having a second length scale as measured parallel to the first surface. The second length scale may be less than one-half the first length scale. The first and second plurality of alignment features may be configured to pattern features at a second surface of a first object that mate with a plurality of corresponding alignment features on a third surface of a second object.
It should be appreciated that all combinations of the foregoing concepts and additional concepts discussed in greater detail below (provided such concepts are not mutually inconsistent) are contemplated as being part of the inventive subject matter disclosed herein. In particular, all combinations of claimed subject matter appearing at the end of this disclosure are contemplated as being part of the inventive subject matter disclosed herein. It should also be appreciated that terminology explicitly employed herein that also may appear in any disclosure incorporated by reference should be accorded a meaning most consistent with the particular concepts disclosed herein.
The foregoing and other aspects, embodiments, and features of the present teachings can be more fully understood from the following description in conjunction with the accompanying drawings.
The skilled artisan will understand that the figures, described herein, are for illustration purposes only. It is to be understood that in some instances various aspects of the invention may be shown exaggerated or enlarged to facilitate an understanding of the invention. In the drawings, like reference characters generally refer to like features, functionally similar and/or structurally similar elements throughout the various figures. The drawings are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the teachings. The drawings are not intended to limit the scope of the present teachings in any way.
The features and advantages of the present invention will become more apparent from the detailed description set forth below when taken in conjunction with the drawings.
Introduction
Apparatus and methods for accurately aligning and assembling objects are described. In overview, a plurality of alignment features may be disposed at a selected surface of each object to be assembled. The plurality of alignment features may include distinct structures having a first length scale and at least distinct structures having a second length scale. The second length scale may be significantly less than the first length scale, e.g., less than one-half or more. The plurality of alignment features on one surface of a first object may be configured to mate to, e.g., fit together with, a plurality of alignment features on one surface of a second object. The alignment features may physically and mechanically guide alignment of the first object with respect to the second object as the two objects are brought together. In some embodiments, the alignment features guide alignment of the objects to micron-level accuracies, and in some implementations to nanometer-level accuracies.
The inventor has recognized that incorporation of alignment features of multiple length scales at surfaces of objects to be assembled can provide a low-cost paradigm for achieving highly accurate alignment of assembled objects using simple assembly techniques. In some cases micron and/or nanometer-level alignment accuracy may be achieved via hand assembly. It will be appreciated by those skilled in the art of micro- and nano-fabrication that the embodiments described herein provide illustrative examples intended to teach various aspects of the invention. Additional variations and combinations that may be more complex have been considered, but are too numerous to include in this description.
The term “length scale” is used herein to refer to a characteristic size of an alignment feature. For example, an alignment feature having a length scale of 10 microns may have a maximum dimension, as measured in a direction parallel to the surface at which the structure is disposes, of about 10 microns.
The terms “about,” “substantially,” and “approximately” may be used to quantify a value or condition as being equal to or nearly equal to a target value within a factor of ±25%. In some embodiments the factor is ±20%. In some embodiments the factor is ±15%. In some embodiments the factor is ±10%. In some embodiments the factor is ±5%. In some embodiments the factor is ±2%. In some embodiments the factor is ±1%. In some embodiments the factor is ±0.5. In some embodiments the factor is ±0.2%. In some embodiments the factor is and ±0.1%.
The term “micron-level” is used herein to refer to a length scale between about 0.1 micron and about 100 microns.
The term “nanometer level” is used herein to refer to a length scale between about 0.1 nanometers and about 100 nanometers.
Apparatus for Micron and Nanometer-Level Alignment
Referring now to
Although
As shown in
It can be seen in
For illustrative purposes in the example depicted in
When aligning and assembling the two objects, the first object 110 may be brought into close proximity with the second object 120, and the two pieces approximately aligned so that the largest alignment features 212A, 212B can mate. At least one of the two pieces may then be moved toward the other so that the largest alignment features begin to engage. As the pieces are brought together, the largest alignment features may guide self-alignment of the two pieces to a first level of alignment accuracy. In some embodiments, the largest alignment features first engage and impart in-plane alignment forces that tend to re-align one piece with respect to the other.
As the two pieces are brought closer, the next largest alignment features 214A, 214B may engage and guide self-alignment of the two pieces to a second level of alignment accuracy. The second level of alignment accuracy may be more accurate than the first level of alignment accuracy. Similarly, each successive size of alignment feature may engage and guide self-alignment of the two pieces to better alignment accuracy. As one example, the first level of alignment accuracy may be at the micron level, and the second level of alignment accuracy may be at the micron level. A final level of alignment accuracy may be at the nanometer level in some embodiments.
In some embodiments, the alignment features may be arranged as a fractal pattern. For example, each region 310, 320 and its respective alignment feature shown in
In a fractal sense, it will be appreciated that the large scale features (5 units by 5 units) shown in
One advantage of the inventive alignment features and method may follow from the larger features serving to align the components or objects at larger scales and with large initial in-plane alignment forces before the smaller alignment features of the components are engaged. In this way, gross misalignments on larger scales are avoided which would otherwise cause the destruction of smaller features upon attempted mating. Furthermore, further iterations to smaller size scales can be used to provide even finer control as illustrated in
In some embodiments, the alignment features are configured such that the in-plane alignment forces totaling from a set of alignment features is less than the alignment forces totaling from the next smaller set of alignment features. For example, the total cross-sectional area of a set of alignment features may be less than the total cross-section area of the next smaller set of alignment features. For such a configuration, the alignment forces of a set of alignment features may dominate over the alignment forces of the next larger set of alignment features.
In some implementations, the alignment features are configured such that the alignment forces totaling for a set of alignment features is approximately equal to the alignment forces totaling from the next smaller set of alignment features.
In some embodiments, a die may be used to pattern the alignment marks. The die may be made from a rigid material, e.g., a metal, ceramic, or crystalline material. The die may be manufactured by ion milling, and may comprise, for example, a material selected from the following group: aluminum, copper, tungsten, molybdenum, silicon, diamond, silver, cobalt, carbon, chrome, ferrous metals, and their alloys. The die may include alignment features of both male and female type, and may be used to imprint the alignment features into a softer material, e.g., a soft metal or any type of polymer. In some embodiments, a first die may include alignment features to be patterned on a first object, and a second die may include corresponding mating alignment features to be patterned on a second object. In certain embodiments, a single die may be used to pattern mating alignment features on a first object and on a second object.
It will be appreciated that the inventive alignment features and methods may be used in many applications for alignment of multiple components in a process or product assembly. The components may include plastic or metal or ceramic parts, electrical circuits, microelectronics, optical components, integrated optical devices, compliant and non-compliant parts, workpieces and tooling, etc. For example, multiple components may be manufactured having the geometry shown in
Although the embodiments shown in
With regard to the feature section, a pyramidal section as shown in
In some embodiments, the protrusion and corresponding recess need not have the same section or profile. For example, the protrusion may have a flat or rounded front surface rather than coming to a point or leading edge. Such a design will tend to reduce potential for damage to the protrusion or other components prior to assembly.
Furthermore, the size of the protrusion and recess need not match. For example, it may be desirable to design the protrusion to have a slightly larger width than its matching recess. In such a case, the material around the recess will experience tensile stresses while the material in the protrusion will experience compressive stresses upon assembly. The resulting stress will tend to hold mating pieces together. Such a design is known as a press fit or interference fit and is readily amenable to traditional engineering analysis techniques.
Alternatively, the features may be designed to provide a snap fit type geometry in which an undercutting geometry is provided in the recess and/or protrusion to retain the protrusion in the recess after assembly.
In some embodiments, the alignment features may include a combination of structures, as depicted in
There is no requirement that the same feature generator or repeated pattern be used at every length scale for a plurality of alignment features. For example, in one embodiment snap-fit features as depicted in
There is also considerable flexibility with regard to the shape and pattern of the mating features. For example, one embodiment may use rectangular shaped mating features 610, 620 to provide for improved alignment in the direction normal to the longer edge of the mating features, as depicted in
When the pattern shown in
An embodiment is shown in
As will be appreciated by those skilled in the art of microfabrication, there exists a large variety of alignment features and distribution patterns that may be used for self-alignment and assembly of components according to various aspects of the invention. Self-alignment accuracies at the micron and nanometer level may be possible using the embodiments described herein. Although the figures and related descriptions primarily address planar surfaces of objects, the alignment features may be disposed at non-planar surfaces in some implementations. For example, the alignment features may be disposed at convex or concave surfaces that mate to concave and convex surface, respectively.
With increased interest in micro- and nano-scale applications, there is an increasing diversity and capability of production processes. In some implementations of the present invention, all size features may be produced in a single process with the required or selected positional accuracies. Any number of fabrication processes may be used including, but not limited to, focused ion beam lithography, scanning electron-beam lithography, electron-beam microscopy. Alternatively, multiple processes can be used at different lengths with intermittent alignment. Multiple processes may further include milling and micro-milling, patterning with photolithography or shadow masking, deposition with chemical or physical deposition, chemical or reactive ion etching, and focused ion beam deposition and ablation.
One of ordinary skill in the art may appreciate that a build process for tooling might begin with large scale processes, such as milling, then move to smaller processes such as micro-milling, etc. Materials for tooling will vary with the application requirements and processing compatibility. Materials for tooling or for fabricating a die having the inventive alignment features may include aluminum, tungsten, silicon, copper, diamond, silver, platinum, cobalt, carbon, chrome, ferrous metals, and many others.
The concepts presented herein may be suitable for tooling having non-planar surfaces such as roll to roll and other multi-station processes including, without being limited to: forming, embossing, printing, deposition, metrology, and other processes. In such processes, a workpiece or product may consist of a plastic, metal, or other stock that is conveyed across multiple rolls or tools each with its own mating features at multiple length scales.
By using the described techniques, a workpiece may have one set of operations performed at a given processing station, then be removed and relocated to one or more subsequent operations where it is re-registered and further processing conducted. In this manner, embodiments of the invention may be applied to not only product assemblies containing components with multiple length scales, but also monolithic products consisting of multiple materials processed at multiple length scales. Potential applications include, but are not limited to: 1) lab on chip, 2) mechatronics, 3) solar cells and displays, 4) batteries, 5) semiconductors, and 6) other products and systems incorporating micro- and nano-structures.
In some embodiments, the inventive alignment marks may be used to align and/or retain a workpiece into a tooling fixture. For example and in reference to
Theoretical Considerations
For teaching purposes and without being bound to any particular model or theory, a brief theoretical analysis of certain aspects of self alignment according to one embodiment has been carried out. This analysis considers effects of in-plane variations and resulting stresses at the alignment features.
For example, there might be different dimensional errors between the two mating parts. As depicted in Detail B, the in-plane variations may give rise to a position error, e, at one of the larger alignment features. This error may not prevent the larger feature from completing its alignment upon insertion. However, the same error imposed at a smaller alignment feature could cause a collision and incomplete insertion or failed mating.
Furthermore, there may be different in-plane variations or error rates across sub-regions of the part (e.g., a sub-region of length Li in
In some embodiments, the larger alignment features may correct an average error across a span of length L of a piece 820, so that the smaller alignment features can then correct the local errors in sub-regions denoted with a subscript i. For this analysis, it is assumed that piece 810 is perfectly rigid has no in-plane variations, i.e., all of its alignment features do not move and are precisely positioned at selected locations. In practice, both pieces 810, 820 may exhibit in-plane compliance.
Assuming that the position error e varies continuously across the length of a piece 820, an average error rate can be evaluated as:
ē=∫
0
L
e(l)dl/L (1)
where e(l) is the local error rate at various length positions, l, across the part. For an average error, ē, and n different locations, the standard deviation of the error can be evaluated as:
For example, consider an example in which the positional errors of alignment features are normally distributed with a mean of 0.2% and a standard deviation of 0.01%.
In certain embodiments, a state of stress is imposed in one or both of the pieces 810, 820 by the larger alignment features that serves to reduce the average error. The resulting local error rates may then be expressed as:
ē
i=∫i-1L
where the index i refers to different sub-regions across the piece 820. In some cases, the smaller alignment features need only correct the local error that has accumulated between their locations.
As shown in
ē
i=[−0.000216% 0.00096% 0.00151% −0.00114% 0.00081%]
One of ordinary skill in the art would appreciate that systematic errors at one length scale (corresponding to a non-zero average error, ē) can be reduced or substantially corrected upon engagement of the larger alignment features and provide substantially smaller errors, ēi, at smaller length scales.
The number and size of the alignment features selected for an application may be driven by the material properties, error distribution, and required tolerances of the application. For example, to compensate for an average error rate across a region of length L for piece 820, a strain ε must be induced in the piece for this region that is equal in magnitude to the average error. The nominal stress, σ, associated with this applied strain is:
σ=Eε=Eē (4)
where E is the elastic modulus of the material. For the example shown in
A lateral force, F, required to impart a compensating or error-reducing stress may be related to the cross-sectional area for the region L at which the stress is to be applied. With reference to the example shown in
F=σA=σHW (5)
Knowing this compensating force enables one to consider, in a first approximation, the shear stresses acting on an alignment feature 1010 within the region. The nominal shear stress, τ, in the alignment feature 1010 can be defined as the required force, F, divided by a cross-sectional area of the alignment feature. If this feature has width, wf, and length, lf, as shown, then the shear stress in the alignment feature can be approximated to first order as:
The relation for shear stress on an alignment feature may also be expressed in terms of an average error for the region and the elastic modulus E of the material.
If the maximum sustainable shear stress τmax, is known for piece 1020, then EQ. 7 can provide guidance in the design and distribution of alignment features for anticipated errors ē. In some embodiments, alignment features are designed and distributed such that τ is a fraction of τmax, wherein the fraction is in a range selected from the following list: between about ½ and about ⅓, between about ⅓ and about ¼, between about ¼ and about ⅛, between about ⅛ and about 1/16, between about 1/16 and about 1/32, between about 1/32 and about 1/64, and between about 1/64 and about 1/128. If τ approaches τmax, then the alignment features may permanently deform, break in an alignment process, or quickly fatigue and fail in repeated use of piece 1020.
When the geometry of the alignment features is determined, an areal yield ratio can be calculated. The areal yield ratio may be defined as the fraction of an object's surface area that is not consumed by mating alignment features. The yield Y of usable area remaining for non-alignment functions given multiple alignment stages can be computed as:
Y=(1−γ)n (8)
where γ represents the fraction of area in a unit region occupied by alignment features of a selected length scale for that region, and n represents the number of different length scales, alignment stages, or fractal pattern repetitions present. As one non-limiting example shown in
Y=(1−5%)4=81.5%.
Referring again to
where I is the moment of inertia of the larger alignment feature and z is the distance between the base of the beam and the application of the lateral force, F.
In some embodiments, the global positional errors may be systematic, e.g., an effective slight magnification error between a first piece 810 and a second piece 820. In such cases, the accumulated stresses on large alignment features over large areas may require the width of the large alignment feature to approach a dimension that is approximately equivalent to or within an order of magnitude of the height H of the piece to be corrected.
The mechanics of the smaller alignment features in a sub-region are similar. However, the applied force and resulting deflection of the smaller alignment features are driven by the residual stresses required to correct the local sub-region errors ēi after the larger global error has been compensated. The corresponding stress σs and shear stress τs for alignment features in a sub-region may be expressed as:
where the subscript s is added to denote the respective quantities for the sub-region.
For the example depicted in
A large deformation structural simulation was conducted to demonstrate aspects of the theoretical analyses described above. For the example shown in
A second rigid piece 810 was modeled having female features with dimensional errors proscribed according to
ē
i=[−0.000216% 0.00096% 0.00151% −0.00114% 0.00081%]
The resulting lateral deformations are shown in
Related Methods
Various methods may be practiced in accordance with the foregoing teachings. For example, according to one embodiment a method may include acts for self-aligning a first object to a second object, wherein the first and second objects include mating alignment features at multiple length scales as described above.
Method 1200 may further include acts of approximately aligning 1220 the first object with respect to the second object so that the first surface is near the second surface, and moving 1230 the first object and/or second object so that the first surface moves toward the second surface.
Method 1200 may further comprise acts of engaging 1240 the at least one first alignment feature of the first length scale to achieve a first alignment accuracy between the first and second objects, and engaging 1250 the at least one second alignment feature of the second length scale to achieve a second alignment accuracy between the first and second objects. In various embodiments the second alignment accuracy is more accurate than the first alignment accuracy.
In some embodiments, method 1200 includes an act of contacting 1260 at least a portion of the first surface with at least a portion of the second surface. Method 1200 may further comprise an act of bonding 1270 the first surface to the second surface. For example, one or both pieces include a thin adhesive surface coating that may be activated after self-aligned assembly to permanently bond the pieces together. The adhesive may be heat activated or optically activated or activate after a length of time. In a different embodiment, the act of bonding 1270 may be replaced with an act of processing (not shown) (e.g., micromilling, micropatterning, inspecting, ion-beam milling) of one or both of the objects.
The section headings used herein are for organizational purposes only and are not to be construed as limiting the subject matter described in any way.
While the present teachings have been described in conjunction with various embodiments and examples, it is not intended that the present teachings be limited to such embodiments or examples. On the contrary, the present teachings encompass various alternatives, modifications, and equivalents, as will be appreciated by those of skill in the art.
While various inventive embodiments have been described and illustrated herein, those of ordinary skill in the art will readily envision a variety of other means and/or structures for performing the function and/or obtaining the results and/or one or more of the advantages described herein, and each of such variations and/or modifications is deemed to be within the scope of the inventive embodiments described herein. More generally, those skilled in the art will readily appreciate that all parameters, dimensions, materials, and configurations described herein are meant to be exemplary and that the actual parameters, dimensions, materials, and/or configurations will depend upon the specific application or applications for which the inventive teachings is/are used. Those skilled in the art will recognize, or be able to ascertain using no more than routine experimentation, many equivalents to the specific inventive embodiments described herein. It is, therefore, to be understood that the foregoing embodiments are presented by way of example only and that, within the scope of the appended claims and equivalents thereto, inventive embodiments may be practiced otherwise than as specifically described and claimed. Inventive embodiments of the present disclosure are directed to each individual feature, system, article, material, and/or method described herein. In addition, any combination of two or more such features, systems, articles, materials, and/or methods, if such features, systems, articles, materials, and/or methods are not mutually inconsistent, is included within the inventive scope of the present disclosure.
Also, the technology described herein may be embodied as a method, of which at least one example has been provided. The acts performed as part of the method may be ordered in any suitable way. Accordingly, embodiments may be constructed in which acts are performed in an order different than illustrated, which may include performing some acts simultaneously, even though shown as sequential acts in illustrative embodiments. Further, one or more of the method acts may be omitted in some embodiment, while in other embodiments additional acts may be added. In some implementations, one or more of the acts of a method may be replaced with one or more other acts.
All definitions, as defined and used herein, should be understood to control over dictionary definitions, definitions in documents incorporated by reference, and/or ordinary meanings of the defined terms.
The indefinite articles “a” and “an,” as used herein in the specification and in the claims, unless clearly indicated to the contrary, should be understood to mean “at least one.”
The phrase “and/or,” as used herein in the specification and in the claims, should be understood to mean “either or both” of the elements so conjoined, i.e., elements that are conjunctively present in some cases and disjunctively present in other cases. Multiple elements listed with “and/or” should be construed in the same fashion, i.e., “one or more” of the elements so conjoined. Other elements may optionally be present other than the elements specifically identified by the “and/or” clause, whether related or unrelated to those elements specifically identified. Thus, as a non-limiting example, a reference to “A and/or B”, when used in conjunction with open-ended language such as “comprising” can refer, in one embodiment, to A only (optionally including elements other than B); in another embodiment, to B only (optionally including elements other than A); in yet another embodiment, to both A and B (optionally including other elements); etc.
As used herein in the specification and in the claims, “or” should be understood to have the same meaning as “and/or” as defined above. For example, when separating items in a list, “or” or “and/or” shall be interpreted as being inclusive, i.e., the inclusion of at least one, but also including more than one, of a number or list of elements, and, optionally, additional unlisted items. Only terms clearly indicated to the contrary, such as “only one of” or “exactly one of,” or, when used in the claims, “consisting of,” will refer to the inclusion of exactly one element of a number or list of elements. In general, the term “or” as used herein shall only be interpreted as indicating exclusive alternatives (i.e. “one or the other but not both”) when preceded by terms of exclusivity, such as “either,” “one of,” “only one of,” or “exactly one of.” “Consisting essentially of,” when used in the claims, shall have its ordinary meaning as used in the field of patent law.
As used herein in the specification and in the claims, the phrase “at least one,” in reference to a list of one or more elements, should be understood to mean at least one element selected from any one or more of the elements in the list of elements, but not necessarily including at least one of each and every element specifically listed within the list of elements and not excluding any combinations of elements in the list of elements. This definition also allows that elements may optionally be present other than the elements specifically identified within the list of elements to which the phrase “at least one” refers, whether related or unrelated to those elements specifically identified. Thus, as a non-limiting example, “at least one of A and B” (or, equivalently, “at least one of A or B,” or, equivalently “at least one of A and/or B”) can refer, in one embodiment, to at least one, optionally including more than one, A, with no B present (and optionally including elements other than B); in another embodiment, to at least one, optionally including more than one, B, with no A present (and optionally including elements other than A); in yet another embodiment, to at least one, optionally including more than one, A, and at least one, optionally including more than one, B (and optionally including other elements); etc.
In the claims, as well as in the specification above, all transitional phrases such as “comprising,” “including,” “carrying,” “having,” “containing,” “involving,” “holding,” “composed of,” and the like are to be understood to be open-ended, i.e., to mean including but not limited to. Only the transitional phrases “consisting of” and “consisting essentially of” shall be closed or semi-closed transitional phrases, respectively, as set forth in the United States Patent Office Manual of Patent Examining Procedures, Section 2111.03.
The claims should not be read as limited to the described order or elements unless stated to that effect. It should be understood that various changes in form and detail may be made by one of ordinary skill in the art without departing from the spirit and scope of the appended claims All embodiments that come within the spirit and scope of the following claims and equivalents thereto are claimed.
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/US12/39101 | 5/23/2012 | WO | 00 | 11/22/2013 |
Number | Date | Country | |
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61489136 | May 2011 | US |