Electroless plating

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H01L2224/27464

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/27464Electroless plating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor element bonding structure, method for producing semic...
- Patent number 11,810,885
- Issue date Nov 7, 2023
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 11,450,642
- Issue date Sep 20, 2022
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interfacial tilt-resistant bonded assembly and methods for forming...
- Patent number 11,348,901
- Issue date May 31, 2022
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for flash stacking
- Patent number 10,991,676
- Issue date Apr 27, 2021
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 10,896,893
- Issue date Jan 19, 2021
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic electrically conductive film and connection structure
- Patent number 10,892,243
- Issue date Jan 12, 2021
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 10,892,247
- Issue date Jan 12, 2021
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layered composite bonding materials and power electronics ass...
- Patent number 10,886,251
- Issue date Jan 5, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic electrically conductive film and connection structure
- Patent number 10,847,487
- Issue date Nov 24, 2020
- Dexerials Corporation
- Seiichiro Shinohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for forming contacts on an integrated circuit...
- Patent number 10,685,931
- Issue date Jun 16, 2020
- CATLAM LLC
- Kenneth S. Bahl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 10,615,145
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for flash stacking
- Patent number 10,593,651
- Issue date Mar 17, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic electrically conductive film and connection structure
- Patent number 10,546,831
- Issue date Jan 28, 2020
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling bond layer and power electronics assemblies incorporating t...
- Patent number 10,388,590
- Issue date Aug 20, 2019
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for flash stacking
- Patent number 10,290,612
- Issue date May 14, 2019
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of manufacturing the electronic device
- Patent number 10,128,164
- Issue date Nov 13, 2018
- Hitachi Automotive Systems, Ltd.
- Hiroyuki Temmei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module comprising fluid cooling channel and method of ma...
- Patent number 10,037,972
- Issue date Jul 31, 2018
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strong, heat stable junction
- Patent number 10,026,708
- Issue date Jul 17, 2018
- The United States of America as represented by the Secretary of the Army
- Patrick J Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and connection structure
- Patent number 9,953,947
- Issue date Apr 24, 2018
- Dexerials Corporation
- Reiji Tsukao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit wafer integration with catalytic laminate or adh...
- Patent number 9,922,951
- Issue date Mar 20, 2018
- Sierra Circuits, Inc.
- Kenneth S. Bahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer stack protection seal
- Patent number 9,768,089
- Issue date Sep 19, 2017
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ranjan Rajoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with semiconductor die directly attached to l...
- Patent number 9,711,484
- Issue date Jul 18, 2017
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 9,673,176
- Issue date Jun 6, 2017
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 9,666,563
- Issue date May 30, 2017
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 9,653,431
- Issue date May 16, 2017
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 9,653,432
- Issue date May 16, 2017
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding metallic contact areas with solution of a sacrif...
- Patent number 9,640,510
- Issue date May 2, 2017
- EV Group E. Thallner GmbH
- Bernhard Rebhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer to wafer bonding process and structures
- Patent number 9,613,926
- Issue date Apr 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 9,515,051
- Issue date Dec 6, 2016
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE BACKSIDE METALLIZATION METHODS AND APPARATUS
- Publication number 20230326897
- Publication date Oct 12, 2023
- Wolfspeed, Inc.
- Daniel Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERFACIAL TILT-RESISTANT BONDED ASSEMBLY AND METHODS FOR FORMING...
- Publication number 20220173071
- Publication date Jun 2, 2022
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20220097166
- Publication date Mar 31, 2022
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR FLASH STACKING
- Publication number 20210225811
- Publication date Jul 22, 2021
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION
- Publication number 20200243480
- Publication date Jul 30, 2020
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR FLASH STACKING
- Publication number 20200212013
- Publication date Jul 2, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND CONNECTION STRUCTURE
- Publication number 20200161268
- Publication date May 21, 2020
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FLASH STACKING
- Publication number 20190371765
- Publication date Dec 5, 2019
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING BOND LAYER AND POWER ELECTRONICS ASSEMBLIES INCORPORATING T...
- Publication number 20190237389
- Publication date Aug 1, 2019
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION
- Publication number 20190035764
- Publication date Jan 31, 2019
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Anisotropic Electrically Conductive Film and Connection Structure
- Publication number 20180301432
- Publication date Oct 18, 2018
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for forming Contacts on an Integrated Circuit...
- Publication number 20180158793
- Publication date Jun 7, 2018
- SIERRA CIRCUITS, INC.
- Kenneth S. Bahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE ELECTRONIC DEVICE
- Publication number 20170309540
- Publication date Oct 26, 2017
- Hitachi Automotive Systems, Ltd.
- Hiroyuki TEMMEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND CONNECTION STRUCTURE
- Publication number 20170309590
- Publication date Oct 26, 2017
- DEXERIALS CORPORATION
- Reiji TSUKAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160240504
- Publication date Aug 18, 2016
- Fuji Electric Co., Ltd.
- Shoji SAKAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Assembly for Prognostics of Solder Joint
- Publication number 20160146878
- Publication date May 26, 2016
- Hitachi, Ltd
- Lina Jaya DIGUNA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR DIE DIRECTLY ATTACHED TO L...
- Publication number 20160141229
- Publication date May 19, 2016
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS
- Publication number 20160086925
- Publication date Mar 24, 2016
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SUBSTRATE ASSEMBLY AND METHOD
- Publication number 20150179599
- Publication date Jun 25, 2015
- NXP B.V.
- Johannes Wilhelmus van Rijckevorsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip with Electrically Conducting Layer
- Publication number 20150145107
- Publication date May 28, 2015
- INFINEON TECHNOLOGIES AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20150034374
- Publication date Feb 5, 2015
- IBIDEN CO., LTD.
- Keisuke SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20150014849
- Publication date Jan 15, 2015
- ZHEN DING TECHNOLOGY CO., LTD.
- YONG HA WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS
- Publication number 20140374903
- Publication date Dec 25, 2014
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES
- Publication number 20140346643
- Publication date Nov 27, 2014
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER STACK PROTECTION SEAL
- Publication number 20140264762
- Publication date Sep 18, 2014
- GLOBAL FOUNDRIES SINGAPORE PTE LTD.
- Ranjan RAJOO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FORMING A THIN SEMICONDUCTOR DEVICE
- Publication number 20140220742
- Publication date Aug 7, 2014
- INFINEON TECHNOLOGIES AG
- Kahlil HOSSEINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS
- Publication number 20140191418
- Publication date Jul 10, 2014
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES
- Publication number 20140193948
- Publication date Jul 10, 2014
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ADVANCED DEVICE ASSEMBLY STRUCTURES AND METHODS
- Publication number 20140153210
- Publication date Jun 5, 2014
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES
- Publication number 20140124899
- Publication date May 8, 2014
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Electroless plating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Advanced device assembly structures and methods

Semiconductor element bonding structure, method for producing semic...

Soldering a conductor to an aluminum metallization

Interfacial tilt-resistant bonded assembly and methods for forming...

Systems and methods for flash stacking

Soldering a conductor to an aluminum metallization

Anisotropic electrically conductive film and connection structure

Soldering a conductor to an aluminum metallization

Multi-layered composite bonding materials and power electronics ass...

Anisotropic electrically conductive film and connection structure

Method and apparatus for forming contacts on an integrated circuit...

Soldering a conductor to an aluminum metallization

Systems and methods for flash stacking

Anisotropic electrically conductive film and connection structure

Cooling bond layer and power electronics assemblies incorporating t...

Systems and methods for flash stacking

Electronic device and method of manufacturing the electronic device

Electronic module comprising fluid cooling channel and method of ma...

Strong, heat stable junction

Anisotropic conductive film and connection structure

Integrated circuit wafer integration with catalytic laminate or adh...

Wafer stack protection seal

Semiconductor package with semiconductor die directly attached to l...

Metal to metal bonding for stacked (3D) integrated circuits

Metal to metal bonding for stacked (3D) integrated circuits

Metal to metal bonding for stacked (3D) integrated circuits

Metal to metal bonding for stacked (3D) integrated circuits

Method for bonding metallic contact areas with solution of a sacrif...

Wafer to wafer bonding process and structures

Metal to metal bonding for stacked (3D) integrated circuits

Patents Applicationslast 30 patents

DIE BACKSIDE METALLIZATION METHODS AND APPARATUS

INTERFACIAL TILT-RESISTANT BONDED ASSEMBLY AND METHODS FOR FORMING...

Advanced Device Assembly Structures And Methods

SYSTEMS AND METHODS FOR FLASH STACKING

SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION

SYSTEMS AND METHODS FOR FLASH STACKING

ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND CONNECTION STRUCTURE

SYSTEMS AND METHODS FOR FLASH STACKING

COOLING BOND LAYER AND POWER ELECTRONICS ASSEMBLIES INCORPORATING T...

SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION

Anisotropic Electrically Conductive Film and Connection Structure

Method and Apparatus for forming Contacts on an Integrated Circuit...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE ELECTRONIC DEVICE

ANISOTROPIC CONDUCTIVE FILM AND CONNECTION STRUCTURE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Electronic Assembly for Prognostics of Solder Joint

SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR DIE DIRECTLY ATTACHED TO L...

METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS

DIE SUBSTRATE ASSEMBLY AND METHOD

Semiconductor Chip with Electrically Conducting Layer

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

CORELESS PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME

METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS

INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES

WAFER STACK PROTECTION SEAL

METHOD FOR FORMING A THIN SEMICONDUCTOR DEVICE

METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS

INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES

ADVANCED DEVICE ASSEMBLY STRUCTURES AND METHODS

INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES