Electrolysis: processes, compositions used therein, and methods of preparing the compositions

Industry

CPC
Y10S205/00

This industry / category may be too specific. Please go to a parent level for more data

Industries

Patents Grantslast 30 patents

Information Patent Grant
Production method and device of surface roughened copper plate, and...
- Patent number 9,758,890
- Issue date Sep 12, 2017
- Furukawa Electric Co., Ltd.
- Hajime Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Silver plating in electronics manufacture
- Patent number 9,730,321
- Issue date Aug 8, 2017
- Yung-Herng Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silver plating in electronics manufacture
- Patent number 8,986,434
- Issue date Mar 24, 2015
- Enthone Inc.
- Yung-Herng Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for producing a surface roughened copper plate
- Patent number 8,815,072
- Issue date Aug 26, 2014
- Furukawa Electric Co., Ltd.
- Hajime Watanabe
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Silver plating in electronics manufacture
- Patent number 8,349,393
- Issue date Jan 8, 2013
- Enthone Inc.
- Yung-Herng Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Formation of vertical devices by electroplating
- Patent number 8,247,905
- Issue date Aug 21, 2012
- International Business Machines Corporation
- Hariklia Deligianni
- G11 - INFORMATION STORAGE
Information Patent Grant
Electroplating cell with hydrodynamics facilitating more uniform de...
- Patent number 8,226,804
- Issue date Jul 24, 2012
- The United States of America as represented by the Secretary of the Air Force
- Lawrence E. Gebhart
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed circuit board
- Patent number 8,024,856
- Issue date Sep 27, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Jong-Jin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of operating an electroplating cell with hydrodynamics facil...
- Patent number 7,947,161
- Issue date May 24, 2011
- Faraday Technology, Inc.
- Lawrence E. Gebhart
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Formation of vertical devices by electroplating
- Patent number 7,608,538
- Issue date Oct 27, 2009
- International Business Machines Corporation
- Hariklia Deligianni
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor having a substantially uniform layer of electroplated...
- Patent number 7,405,007
- Issue date Jul 29, 2008
- Micron Technology, Inc.
- Dale W. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor package substrate with plated...
- Patent number 7,041,591
- Issue date May 9, 2006
- Phoenix Precision Technology Corporation
- Pei-Ching Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems for electroplating metal onto a layer of low conductivity m...
- Patent number 7,001,492
- Issue date Feb 21, 2006
- Micron Technology, Inc.
- Dale W. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the selectively electroplating a strip-shaped, metal sup...
- Patent number 6,972,082
- Issue date Dec 6, 2005
- IMO Ingo Müller e.K.
- Michail Kotsias
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of coloring magnesium material, and housing made of colored...
- Patent number 6,936,349
- Issue date Aug 30, 2005
- Fujitsu Limited
- Yasuo Naganuma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sequential electrodeposition of metals using modulated electric fie...
- Patent number 6,863,793
- Issue date Mar 8, 2005
- Faraday Technology Marketing Group, LLC
- E. Jennings Taylor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Seed layer deposition
- Patent number 6,824,665
- Issue date Nov 30, 2004
- Shipley Company, L.L.C.
- James G. Shelnut
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Platable engineered polyolefin alloys and articles containing same
- Patent number 6,824,889
- Issue date Nov 30, 2004
- Solvay Engineered Polymers, Inc.
- Scott Matteucci
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of fabricating damascene structures in mechanically weak int...
- Patent number 6,790,336
- Issue date Sep 14, 2004
- Intel Corporation
- Tatyana Andryushchenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated plating and planarization process and apparatus therefor
- Patent number 6,773,570
- Issue date Aug 10, 2004
- International Business Machines Corporation
- Laertis Economikos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of plating for filling via holes
- Patent number 6,755,957
- Issue date Jun 29, 2004
- Shinko Electric Industries Co., Ltd.
- Kenji Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of direct electroplating on a low conductivity material, and...
- Patent number 6,723,219
- Issue date Apr 20, 2004
- Micron Technology, Inc.
- Dale W. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-sensitive lithographic printing plate precursor
- Patent number 6,637,334
- Issue date Oct 28, 2003
- Fuji Photo Film Co., Ltd.
- Keiji Akiyama
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and apparatus for plating substrate with copper
- Patent number 6,638,411
- Issue date Oct 28, 2003
- Ebara Corporation
- Koji Mishima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support circuit with a tapered through-hole for a semiconductor chi...
- Patent number 6,627,824
- Issue date Sep 30, 2003
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming magnetic layer pattern and method of manufacturin...
- Patent number 6,605,196
- Issue date Aug 12, 2003
- TDK Corporation
- Yoshitaka Sasaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of electroplating a nickel-iron alloy film with a graduated...
- Patent number 6,599,411
- Issue date Jul 29, 2003
- Hitachi Global Storage Technologies Netherlands, B.V.
- Thomas Edward Dinan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Sequential build circuit board plating process
- Patent number 6,582,581
- Issue date Jun 24, 2003
- Shipley Company, L.L.C.
- Robert L. Goldberg
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroplating apparatus
- Patent number 6,554,976
- Issue date Apr 29, 2003
- TDK Corporation
- Satoshi Inoue
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electrodeposition of metals in small recesses using modulated elect...
- Patent number 6,524,461
- Issue date Feb 25, 2003
- Faraday Technology Marketing Group, LLC
- E. Jennings Taylor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRODUCTION METHOD AND DEVICE OF SURFACE ROUGHENED COPPER PLATE, AND...
- Publication number 20140339094
- Publication date Nov 20, 2014
- Hajime WATANABE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SILVER PLATING IN ELECTRONICS MANUFACTURE
- Publication number 20130180768
- Publication date Jul 18, 2013
- Enthone Inc.
- Yung-Herng Yau
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING CELL WITH HYDRODYNAMICS FACILITATING MORE UNIFORM DE...
- Publication number 20110209991
- Publication date Sep 1, 2011
- Lawrence E. Gebhart
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRODUCTION METHOD AND DEVICE OF SURFACE ROUGHENED COPPER PLATE, AND...
- Publication number 20100304176
- Publication date Dec 2, 2010
- Hajime Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FORMATION OF VERTICAL DEVICES BY ELECTROPLATING
- Publication number 20090294989
- Publication date Dec 3, 2009
- International Business Machines Corporation
- Hariklia Deligianni
- G11 - INFORMATION STORAGE
Information Patent Application
Method for manufacturing printed circuit board
- Publication number 20090083976
- Publication date Apr 2, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Jong-Jin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMATION OF VERTICAL DEVICES BY ELECTROPLATING
- Publication number 20080166874
- Publication date Jul 10, 2008
- International Business Machines Corporation
- Hariklia Deligianni
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTROPLATING CELL WITH HYDRODYNAMICS FACILITATING MORE UNIFORM DE...
- Publication number 20080035475
- Publication date Feb 14, 2008
- FARADAY TECHNOLOGY, INC.
- Lawrence E. Gebhart
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Silver plating in electronics manufacture
- Publication number 20060024430
- Publication date Feb 2, 2006
- Enthone Inc.
- Yung-Herng Yau
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for the selectively electroplating a strip-shaped, metal sup...
- Publication number 20040206629
- Publication date Oct 21, 2004
- Michail Kotsias
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INTEGRATED PLATING AND PLANARIZATION PROCESS AND APPARATUS THEREFOR
- Publication number 20040094427
- Publication date May 20, 2004
- International Business Machines Corporation
- Laertis Economikos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and apparatus for plating substrate with copper
- Publication number 20040050711
- Publication date Mar 18, 2004
- Koji Mishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Platable engineered polyolefin alloys and articles containing same
- Publication number 20040005473
- Publication date Jan 8, 2004
- Scott Matteucci
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method of fabricating damascene structures in mechanically weak int...
- Publication number 20030234182
- Publication date Dec 25, 2003
- Tatyana Andryushchenko
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of direct electroplating on a low conductivity material, and...
- Publication number 20030183527
- Publication date Oct 2, 2003
- Dale W. Collins
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of direct electroplating on a low conductivity material, and...
- Publication number 20030183528
- Publication date Oct 2, 2003
- Dale W. Collins
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of coloring magnesium material, and housing made of colored...
- Publication number 20030052012
- Publication date Mar 20, 2003
- FUJITSU LIMITED
- Yasuo Naganuma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of direct electroplating on a low conductivity material, and...
- Publication number 20030038036
- Publication date Feb 27, 2003
- Dale W. Collins
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Conductive resin, electronic module using conductive resin, and met...
- Publication number 20020185306
- Publication date Dec 12, 2002
- Tsutomu Mitani
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method of electroplating a nickel-iron alloy film with a graduated...
- Publication number 20020153255
- Publication date Oct 24, 2002
- Thomas Edward Dinan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Seed layer deposition
- Publication number 20020066671
- Publication date Jun 6, 2002
- Shipley Company, L.L.C.
- James G. Shelnut
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electrodeposition of metals in small recesses using modulated elect...
- Publication number 20020056645
- Publication date May 16, 2002
- E. Jennings Taylor
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Sequential electrodeposition of metals using modulated electric fie...
- Publication number 20020038764
- Publication date Apr 4, 2002
- E. Jennings Taylor
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Heat-sensitive lithographic printing plate precursor
- Publication number 20020033108
- Publication date Mar 21, 2002
- Keiji Akiyama
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Platable engineered polyolefin alloys
- Publication number 20020023845
- Publication date Feb 28, 2002
- Ruidong Ding
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of forming magnetic layer pattern and method of manufacturin...
- Publication number 20010035357
- Publication date Nov 1, 2001
- TDK CORPORATION
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat sensitive printing plate precursors
- Publication number 20010018877
- Publication date Sep 6, 2001
- Tu Vinh Chau
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Method of plating for filling via holes
- Publication number 20010013472
- Publication date Aug 16, 2001
- Kenji Nakamura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Electrolysis: processes, compositions used therein, and methods of preparing the compositions

Industry

Parent Industries

Current Industry

Sub Industries

Patents Grantslast 30 patents

Production method and device of surface roughened copper plate, and...

Silver plating in electronics manufacture

Silver plating in electronics manufacture

Method for producing a surface roughened copper plate

Silver plating in electronics manufacture

Formation of vertical devices by electroplating

Electroplating cell with hydrodynamics facilitating more uniform de...

Method for manufacturing printed circuit board

Method of operating an electroplating cell with hydrodynamics facil...

Formation of vertical devices by electroplating

Semiconductor having a substantially uniform layer of electroplated...

Method for fabricating semiconductor package substrate with plated...

Systems for electroplating metal onto a layer of low conductivity m...

Method for the selectively electroplating a strip-shaped, metal sup...

Method of coloring magnesium material, and housing made of colored...

Sequential electrodeposition of metals using modulated electric fie...

Seed layer deposition

Platable engineered polyolefin alloys and articles containing same

Method of fabricating damascene structures in mechanically weak int...

Integrated plating and planarization process and apparatus therefor

Method of plating for filling via holes

Method of direct electroplating on a low conductivity material, and...

Heat-sensitive lithographic printing plate precursor

Method and apparatus for plating substrate with copper

Support circuit with a tapered through-hole for a semiconductor chi...

Method of forming magnetic layer pattern and method of manufacturin...

Method of electroplating a nickel-iron alloy film with a graduated...

Sequential build circuit board plating process

Electroplating apparatus

Electrodeposition of metals in small recesses using modulated elect...

Patents Applicationslast 30 patents

PRODUCTION METHOD AND DEVICE OF SURFACE ROUGHENED COPPER PLATE, AND...

SILVER PLATING IN ELECTRONICS MANUFACTURE

ELECTROPLATING CELL WITH HYDRODYNAMICS FACILITATING MORE UNIFORM DE...

PRODUCTION METHOD AND DEVICE OF SURFACE ROUGHENED COPPER PLATE, AND...

FORMATION OF VERTICAL DEVICES BY ELECTROPLATING

Method for manufacturing printed circuit board

FORMATION OF VERTICAL DEVICES BY ELECTROPLATING

ELECTROPLATING CELL WITH HYDRODYNAMICS FACILITATING MORE UNIFORM DE...

Silver plating in electronics manufacture

Method for the selectively electroplating a strip-shaped, metal sup...

INTEGRATED PLATING AND PLANARIZATION PROCESS AND APPARATUS THEREFOR

Method and apparatus for plating substrate with copper

Platable engineered polyolefin alloys and articles containing same

Method of fabricating damascene structures in mechanically weak int...

Method of direct electroplating on a low conductivity material, and...

Method of direct electroplating on a low conductivity material, and...

Method of coloring magnesium material, and housing made of colored...

Method of direct electroplating on a low conductivity material, and...

Conductive resin, electronic module using conductive resin, and met...

Method of electroplating a nickel-iron alloy film with a graduated...

Seed layer deposition

Electrodeposition of metals in small recesses using modulated elect...

Sequential electrodeposition of metals using modulated electric fie...

Heat-sensitive lithographic printing plate precursor

Platable engineered polyolefin alloys

Method of forming magnetic layer pattern and method of manufacturin...

Heat sensitive printing plate precursors

Method of plating for filling via holes