Electromagnetic wavelength ranges [W]

Industry

CPC
H01L2924/202

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/202Electromagnetic wavelength ranges [W]

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Launch structures for radio frequency integrated device packages
- Patent number 11,894,322
- Issue date Feb 6, 2024
- Analog Devices, Inc.
- Bruce E. Wilcox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device by backgrinding semic...
- Patent number 11,482,441
- Issue date Oct 25, 2022
- Mitsui Chemicals Tohcello, Inc.
- Hiroyoshi Kurihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively cross-linked thermal interface materials
- Patent number 10,903,188
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Eric J. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implementing reworkable strain relief packaging structure for elect...
- Patent number 10,834,811
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively cross-linked thermal interface materials
- Patent number 10,381,324
- Issue date Aug 13, 2019
- International Business Machines Corporation
- Eric J. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implementing reworkable strain relief packaging structure for elect...
- Patent number 10,111,322
- Issue date Oct 23, 2018
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wireless communication device with joined semiconductors
- Patent number 10,090,586
- Issue date Oct 2, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively cross-linked thermal interface materials
- Patent number 10,050,010
- Issue date Aug 14, 2018
- International Business Machines Corporation
- Eric J. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film including oblique region having lower c...
- Patent number 9,997,486
- Issue date Jun 12, 2018
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device, and electronic device...
- Patent number 9,911,642
- Issue date Mar 6, 2018
- Fujitsu Limited
- Taiji Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wireless communication device with joined semiconductors
- Patent number 9,780,442
- Issue date Oct 3, 2017
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,741,674
- Issue date Aug 22, 2017
- Mitsubishi Electric Corporation
- Yoshihiro Tsukahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflow process and tool
- Patent number 9,373,603
- Issue date Jun 21, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ai-Tee Ang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Release Layer for IR Laser Lift-Off Process
- Publication number 20250054904
- Publication date Feb 13, 2025
- TOKYO ELECTRON LIMITED
- Panupong JAIPAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIDUCIALS WITH ASSOCIATED LOW-DENSITY METAL ZONES
- Publication number 20250006653
- Publication date Jan 2, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGES INCLUDING SUBSTRATE INTEGRATED WAVEGUIDES
- Publication number 20240396198
- Publication date Nov 28, 2024
- INFINEON TECHNOLOGIES AG
- Ernst SELER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH MOLDING CONTACT ENABLED EMI SHIELDING
- Publication number 20240203895
- Publication date Jun 20, 2024
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULE WITH TRANSISTOR DIES FOR MULTIPLE AMPLIFIER...
- Publication number 20240186212
- Publication date Jun 6, 2024
- NXP USA, Inc.
- Stephen Reza Hiemstra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240178082
- Publication date May 30, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240178083
- Publication date May 30, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOHERTY AMPLIFIERS
- Publication number 20240063756
- Publication date Feb 22, 2024
- NXP USA, Inc.
- Qi Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240038693
- Publication date Feb 1, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL ANTENNA MODULE AND SEM...
- Publication number 20240038691
- Publication date Feb 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Vijaylaxmi Gumaste Khanolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMALLER MODULE BY STACKING
- Publication number 20240038743
- Publication date Feb 1, 2024
- Dingyou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE
- Publication number 20240021563
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- Seokhyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230402398
- Publication date Dec 14, 2023
- Siliconware Precision Industries Co., Ltd.
- Che-Chi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI CAGE FOR MICROSTRIP ROUTING VIA DUAL LAYER UNDERFILL CONCEPT
- Publication number 20230395524
- Publication date Dec 7, 2023
- Intel Corporation
- Eng Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA SUBSTRATE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20230198165
- Publication date Jun 22, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Je Sang PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH INTEGRATED ANTENNA AND SHIELDING PILLARS
- Publication number 20230187377
- Publication date Jun 15, 2023
- MEDIATEK INC.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230107554
- Publication date Apr 6, 2023
- Korea Electronics Technology Institute
- Jong Min YOOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCEY PACKAGE, HIGH-FREQUENCY MODULE, AND RADIO WAVE ABSO...
- Publication number 20230103894
- Publication date Apr 6, 2023
- NEC Corporation
- Yuki YOSHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230084360
- Publication date Mar 16, 2023
- InnoLux Corporation
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20230056755
- Publication date Feb 23, 2023
- Tienchien Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220415831
- Publication date Dec 29, 2022
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAUNCH STRUCTURES FOR RADIO FREQUENCY INTEGRATED DEVICE PACKAGES
- Publication number 20190371747
- Publication date Dec 5, 2019
- Analog Devices, Inc.
- Bruce E. Wilcox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVELY CROSS-LINKED THERMAL INTERFACE MATERIALS
- Publication number 20190326253
- Publication date Oct 24, 2019
- International Business Machines Corporation
- ERIC J. CAMPBELL
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MESH STRUCTURE FOR HETEROJUNCTION BIPOLAR TRANSISTORS FOR RF APPLIC...
- Publication number 20190181251
- Publication date Jun 13, 2019
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190088528
- Publication date Mar 21, 2019
- MITSUI CHEMICALS TOHCELLO, INC.
- Hiroyoshi KURIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVELY CROSS-LINKED THERMAL INTERFACE MATERIALS
- Publication number 20180277510
- Publication date Sep 27, 2018
- International Business Machines Corporation
- ERIC J. CAMPBELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLEMENTING REWORKABLE STRAIN RELIEF PACKAGING STRUCTURE FOR ELECT...
- Publication number 20180228022
- Publication date Aug 9, 2018
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLEMENTING REWORKABLE STRAIN RELIEF PACKAGING STRUCTURE FOR ELECT...
- Publication number 20180168030
- Publication date Jun 14, 2018
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS COMMUNICATION DEVICE WITH JOINED SEMICONDUCTORS
- Publication number 20170309998
- Publication date Oct 26, 2017
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME
- Publication number 20170077056
- Publication date Mar 16, 2017
- DEXERIALS CORPORATION
- Reiji TSUKAO
- B32 - LAYERED PRODUCTS

Electromagnetic wavelength ranges [W]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Launch structures for radio frequency integrated device packages

Method for manufacturing semiconductor device by backgrinding semic...

Selectively cross-linked thermal interface materials

Implementing reworkable strain relief packaging structure for elect...

Selectively cross-linked thermal interface materials

Implementing reworkable strain relief packaging structure for elect...

Wireless communication device with joined semiconductors

Selectively cross-linked thermal interface materials

Anisotropic conductive film including oblique region having lower c...

Method of manufacturing an electronic device, and electronic device...

Wireless communication device with joined semiconductors

Semiconductor device

Reflow process and tool

Patents Applicationslast 30 patents

Release Layer for IR Laser Lift-Off Process

FIDUCIALS WITH ASSOCIATED LOW-DENSITY METAL ZONES

CHIP PACKAGES INCLUDING SUBSTRATE INTEGRATED WAVEGUIDES

THROUGH MOLDING CONTACT ENABLED EMI SHIELDING

POWER AMPLIFIER MODULE WITH TRANSISTOR DIES FOR MULTIPLE AMPLIFIER...

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

DOHERTY AMPLIFIERS

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL ANTENNA MODULE AND SEM...

SMALLER MODULE BY STACKING

METHOD OF MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

EMI CAGE FOR MICROSTRIP ROUTING VIA DUAL LAYER UNDERFILL CONCEPT

ANTENNA SUBSTRATE AND ELECTRONIC DEVICE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE WITH INTEGRATED ANTENNA AND SHIELDING PILLARS

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

HIGH-FREQUENCEY PACKAGE, HIGH-FREQUENCY MODULE, AND RADIO WAVE ABSO...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor package

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

LAUNCH STRUCTURES FOR RADIO FREQUENCY INTEGRATED DEVICE PACKAGES

SELECTIVELY CROSS-LINKED THERMAL INTERFACE MATERIALS

MESH STRUCTURE FOR HETEROJUNCTION BIPOLAR TRANSISTORS FOR RF APPLIC...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SELECTIVELY CROSS-LINKED THERMAL INTERFACE MATERIALS

IMPLEMENTING REWORKABLE STRAIN RELIEF PACKAGING STRUCTURE FOR ELECT...

IMPLEMENTING REWORKABLE STRAIN RELIEF PACKAGING STRUCTURE FOR ELECT...

WIRELESS COMMUNICATION DEVICE WITH JOINED SEMICONDUCTORS

ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME