Electrophoretic deposition of insulating material

Industry

CPC
H05K2203/135

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/135Electrophoretic deposition of insulating material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Printed wiring board, multilayer printed wiring board and method fo...
- Patent number 11,445,605
- Issue date Sep 13, 2022
- TDK Corporation
- Takaaki Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and processes for forming electrical circuitries on three-d...
- Patent number 11,304,303
- Issue date Apr 12, 2022
- DUJUD LLC
- Reza Abbaspour
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Method of manufacturing treated sheet and method of manufacturing r...
- Patent number 11,001,042
- Issue date May 11, 2021
- Murata Manufacturing Co., Ltd.
- Ryosuke Takada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Insulation systems and methods of depositing insulation systems
- Patent number 10,968,529
- Issue date Apr 6, 2021
- General Electric Company
- Weijun Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light source module, fabrication method therefor, and lighting devi...
- Patent number 10,401,015
- Issue date Sep 3, 2019
- LG Electronics Inc.
- Jaepyo Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light source module
- Patent number 10,317,068
- Issue date Jun 11, 2019
- LG Electronics Inc.
- Jaepyo Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light source module
- Patent number 10,228,119
- Issue date Mar 12, 2019
- LG Electronics Inc.
- Jaepyo Hong
- F21 - LIGHTING
Information Patent Grant
Electrically isolated assembly and method for the electrical isolat...
- Patent number 10,117,337
- Issue date Oct 30, 2018
- Vacuumschmelze GmbH & Co. KG
- Harald Hundt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded thin films
- Patent number 10,064,283
- Issue date Aug 28, 2018
- The Research Foundation for the State University of New York
- Junghyun Cho
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Light source module, fabrication method therefor, and lighting devi...
- Patent number 9,970,648
- Issue date May 15, 2018
- LG Electronics Inc.
- Jaepyo Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrophoretically depositing a film on an electronic a...
- Patent number 9,313,897
- Issue date Apr 12, 2016
- Infineon Technologies AG
- Joachim Mahler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal dissipation techniques for multi-sensory electromechanical...
- Patent number 9,185,822
- Issue date Nov 10, 2015
- Honeywell International, Inc.
- Shridhara Shanbhogue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing an anisotropic conductive film
- Patent number 9,155,207
- Issue date Oct 6, 2015
- Dexerials Corporation
- Masahiko Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded thin films
- Patent number 8,882,983
- Issue date Nov 11, 2014
- The Research Foundation for the State University of New York
- Junghyun Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Passivated metal core substrate and process for preparing the same
- Patent number 8,828,152
- Issue date Sep 9, 2014
- PPG Industries Ohio, Inc.
- Michael J. Pawlik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and device for producing a plastic coating
- Patent number 8,715,780
- Issue date May 6, 2014
- Atotech Deutschland GmbH
- Alex Bruderer
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method for manufacturing a circuit board
- Patent number 8,671,562
- Issue date Mar 18, 2014
- Advanced Semiconductor Engineering Inc.
- Chien Hao Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive interconnects
- Patent number 8,604,604
- Issue date Dec 10, 2013
- Hewlett-Packard Development Company, L.P.
- John Christopher Rudin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer circuit assembly and process for preparing the same
- Patent number 8,598,467
- Issue date Dec 3, 2013
- PPG Industries Chio, Inc.
- Kevin C. Olson
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of forming solid blind vias through the dielectric coating o...
- Patent number 8,409,982
- Issue date Apr 2, 2013
- PPG Industries Ohio, Inc.
- Kevin C. Olson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for inhibiting tin whisker growth using abrasive powder coa...
- Patent number 8,329,248
- Issue date Dec 11, 2012
- Honeywell International Inc.
- Merrill M. Jackson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Embedded capacitor, embedded capacitor sheet using the same and met...
- Patent number 8,274,779
- Issue date Sep 25, 2012
- Samhwa Capacitor Co., Ltd.
- Jung Rag Yoon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with improved via design
- Patent number 8,258,411
- Issue date Sep 4, 2012
- PPG Industries Ohio, Inc.
- Alan E. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board and method of manufacturing multil...
- Patent number 8,217,276
- Issue date Jul 10, 2012
- Sony Corporation
- Kentaro Fujii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate including conductive core substrate, and manufactu...
- Patent number 8,178,791
- Issue date May 15, 2012
- Fujitsu Limited
- Tomoyuki Abe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing substrate
- Patent number 8,151,456
- Issue date Apr 10, 2012
- Fujitsu Limited
- Yasutomo Maehara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a circuit board with improved via design
- Patent number 8,141,245
- Issue date Mar 27, 2012
- PPG Industries Ohio, Inc.
- Kevin C. Olson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer circuit assembly and process for preparing the same
- Patent number 8,065,795
- Issue date Nov 29, 2011
- PPG Industries Ohio, Inc.
- Kevin C. Olson
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of forming solid blind vias through the dielectric coating o...
- Patent number 8,008,188
- Issue date Aug 30, 2011
- PPG Industries Ohio, Inc.
- Kevin C. Olson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enamel substrate for mounting light emitting elements, light emitti...
- Patent number 7,997,760
- Issue date Aug 16, 2011
- Fujikura Ltd.
- Ryuji Suzuki
- F21 - LIGHTING

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD, MULTILAYER PRINTED WIRING BOARD AND METHOD FO...
- Publication number 20210014966
- Publication date Jan 14, 2021
- TDK Corporation
- Takaaki MORITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATION SYSTEMS AND METHODS OF DEPOSITING INSULATION SYSTEMS
- Publication number 20200347509
- Publication date Nov 5, 2020
- GENERAL ELECTRIC COMPANY
- Weijun Yin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRICALLY ISOLATED ASSEMBLY AND METHOD FOR THE ELECTRICAL ISOLAT...
- Publication number 20180213652
- Publication date Jul 26, 2018
- Vacuumschmelze GMBH & Co. KG
- Harald HUNDT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED THIN FILMS
- Publication number 20170013721
- Publication date Jan 12, 2017
- The Research Foundation for The State University of New York
- Junghyun Cho
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
EMBEDDED THIN FILMS
- Publication number 20160135303
- Publication date May 12, 2016
- The Research Foundation for The State University of New York
- Junghyun Cho
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of Electrophoretic Depositing (EPD) a Film on a System and S...
- Publication number 20140076613
- Publication date Mar 20, 2014
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
THERMAL DISSIPATION TECHNIQUES FOR MULTI-SENSORY ELECTROMECHANICAL...
- Publication number 20130329356
- Publication date Dec 12, 2013
- Honeywell International Inc.
- Shridhara Shanbhogue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Anisotropic Conductive Film, Method for Producing the Same, and Joi...
- Publication number 20120328794
- Publication date Dec 27, 2012
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Masahiko Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE COMPOSED OF CERAMIC INSULATING LAYER AND METAL LAYER, AND...
- Publication number 20120141777
- Publication date Jun 7, 2012
- Mitsui Mining and Smelting Co., Ltd.
- Yasushi Idemoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
STACKED STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120085573
- Publication date Apr 12, 2012
- SANYO ELECTRIC CO., LTD.
- Hitoshi Noguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-Layer Circuit Assembly And Process For Preparing The Same
- Publication number 20120031655
- Publication date Feb 9, 2012
- PPG INDUSTRIES OHIO, INC.
- Kevin C. Olson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND DEVICE FOR PRODUCING A PLASTIC COATING
- Publication number 20110293823
- Publication date Dec 1, 2011
- Atotech Deutschland GmbH
- Alex Bruderer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING SOLID BLIND VIAS THROUGH THE DIELECTRIC COATING O...
- Publication number 20110266156
- Publication date Nov 3, 2011
- PPG INDUSTRIES OHIO, INC.
- Kevin C. Olson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Embedded capacitor, embedded capacitor sheet using the same and met...
- Publication number 20100271748
- Publication date Oct 28, 2010
- Jung Rag Yoon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT LAYER COMPRISING CNTS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100230146
- Publication date Sep 16, 2010
- Eung Suek LEE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING THE SAME, AND JOI...
- Publication number 20100188829
- Publication date Jul 29, 2010
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Masahiko Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PASSIVATED METAL CORE SUBSTRATE AND PROCESS FOR PREPARING THE SAME
- Publication number 20100028708
- Publication date Feb 4, 2010
- PPG INDUSTRIES OHIO, INC.
- Michael J. Pawlik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Printed Circuit Board With Improved Via Design
- Publication number 20100012357
- Publication date Jan 21, 2010
- Alan E. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ABRASIVE POWDER COATINGS AND METHODS FOR INHIBITING TIN WHISKER GROWTH
- Publication number 20100003398
- Publication date Jan 7, 2010
- Honeywell International Inc.
- Merrill Jackson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WIRING SUBSTRATE INCLUDING CONDUCTIVE CORE SUBSTRATE, AND MANUFACTU...
- Publication number 20090308651
- Publication date Dec 17, 2009
- FUJITSU LIMITED
- Tomoyuki ABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED THIN FILMS
- Publication number 20090301770
- Publication date Dec 10, 2009
- Junghyun Cho
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ENAMEL SUBSTRATE FOR MOUNTING LIGHT EMITTING ELEMENTS, LIGHT EMITTI...
- Publication number 20090225544
- Publication date Sep 10, 2009
- FUJIKURA LTD.
- Ryuji Suzuki
- F21 - LIGHTING
Information Patent Application
CIRCUIT BOARD HAVING AN ELECTRODEPOSITED COATING ON A CONDUCTIVE CO...
- Publication number 20090178838
- Publication date Jul 16, 2009
- PPG INDUSTRIES OHIO, INC.
- Alan E. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive Interconnects
- Publication number 20090146193
- Publication date Jun 11, 2009
- Hewlett-Packard Development Company, L.P.
- John Christopher Rudin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Single or Multi-Layer Printed Circuit Board With Improved Via Design
- Publication number 20090101274
- Publication date Apr 23, 2009
- Kevin C. Olson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PRODUCING SUBSTRATE
- Publication number 20090094825
- Publication date Apr 16, 2009
- FUJITSU LIMITED
- Yasutomo Maehara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING SOLID BLIND VIAS THROUGH THE DIELECTRIC COATING O...
- Publication number 20080305626
- Publication date Dec 11, 2008
- PPG INDUSTRIES OHIO, INC.
- Kevin C. Olson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT ASSEMBLY INCLUDING A METAL CORE SUBSTRATE AND PROCESS FOR P...
- Publication number 20080302564
- Publication date Dec 11, 2008
- PPG INDUSTRIES OHIO, INC.
- Kevin C. Olson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MAKING A CIRCUIT BOARD AND MULTI-LAYER SUBSTRATE WITH PL...
- Publication number 20080271915
- Publication date Nov 6, 2008
- Advanced Semiconductor Engineering, Inc.
- Chien-Hao Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for the Transfer of Powders and Powder Coatings to Substrates
- Publication number 20080268166
- Publication date Oct 30, 2008
- Atotech Deutschland GmbH
- Christoph Rickert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Electrophoretic deposition of insulating material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed wiring board, multilayer printed wiring board and method fo...

Methods and processes for forming electrical circuitries on three-d...

Method of manufacturing treated sheet and method of manufacturing r...

Insulation systems and methods of depositing insulation systems

Light source module, fabrication method therefor, and lighting devi...

Light source module

Light source module

Electrically isolated assembly and method for the electrical isolat...

Embedded thin films

Light source module, fabrication method therefor, and lighting devi...

Method for electrophoretically depositing a film on an electronic a...

Thermal dissipation techniques for multi-sensory electromechanical...

Method for producing an anisotropic conductive film

Embedded thin films

Passivated metal core substrate and process for preparing the same

Method and device for producing a plastic coating

Method for manufacturing a circuit board

Conductive interconnects

Multi-layer circuit assembly and process for preparing the same

Method of forming solid blind vias through the dielectric coating o...

Methods for inhibiting tin whisker growth using abrasive powder coa...

Embedded capacitor, embedded capacitor sheet using the same and met...

Printed circuit board with improved via design

Multilayer printed circuit board and method of manufacturing multil...

Wiring substrate including conductive core substrate, and manufactu...

Method of producing substrate

Method of forming a circuit board with improved via design

Multi-layer circuit assembly and process for preparing the same

Method of forming solid blind vias through the dielectric coating o...

Enamel substrate for mounting light emitting elements, light emitti...

Patents Applicationslast 30 patents

PRINTED WIRING BOARD, MULTILAYER PRINTED WIRING BOARD AND METHOD FO...

INSULATION SYSTEMS AND METHODS OF DEPOSITING INSULATION SYSTEMS

ELECTRICALLY ISOLATED ASSEMBLY AND METHOD FOR THE ELECTRICAL ISOLAT...

EMBEDDED THIN FILMS

EMBEDDED THIN FILMS

Method of Electrophoretic Depositing (EPD) a Film on a System and S...

THERMAL DISSIPATION TECHNIQUES FOR MULTI-SENSORY ELECTROMECHANICAL...

Anisotropic Conductive Film, Method for Producing the Same, and Joi...

LAMINATE COMPOSED OF CERAMIC INSULATING LAYER AND METAL LAYER, AND...

STACKED STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Multi-Layer Circuit Assembly And Process For Preparing The Same

METHOD AND DEVICE FOR PRODUCING A PLASTIC COATING

METHOD OF FORMING SOLID BLIND VIAS THROUGH THE DIELECTRIC COATING O...

Embedded capacitor, embedded capacitor sheet using the same and met...

CIRCUIT LAYER COMPRISING CNTS AND METHOD OF MANUFACTURING THE SAME

ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING THE SAME, AND JOI...

PASSIVATED METAL CORE SUBSTRATE AND PROCESS FOR PREPARING THE SAME

Printed Circuit Board With Improved Via Design

ABRASIVE POWDER COATINGS AND METHODS FOR INHIBITING TIN WHISKER GROWTH

WIRING SUBSTRATE INCLUDING CONDUCTIVE CORE SUBSTRATE, AND MANUFACTU...

EMBEDDED THIN FILMS

ENAMEL SUBSTRATE FOR MOUNTING LIGHT EMITTING ELEMENTS, LIGHT EMITTI...

CIRCUIT BOARD HAVING AN ELECTRODEPOSITED COATING ON A CONDUCTIVE CO...

Conductive Interconnects

Single or Multi-Layer Printed Circuit Board With Improved Via Design

METHOD OF PRODUCING SUBSTRATE

METHOD OF FORMING SOLID BLIND VIAS THROUGH THE DIELECTRIC COATING O...

CIRCUIT ASSEMBLY INCLUDING A METAL CORE SUBSTRATE AND PROCESS FOR P...

METHOD FOR MAKING A CIRCUIT BOARD AND MULTI-LAYER SUBSTRATE WITH PL...

Process for the Transfer of Powders and Powder Coatings to Substrates