Etch stop layer

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CPC
H05K2203/0384

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0384Etch stop layer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Ultra-thin copper foil, ultra-thin copper foil with carrier, and me...
- Patent number 11,576,267
- Issue date Feb 7, 2023
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate
- Patent number 10,993,332
- Issue date Apr 27, 2021
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible conductive track arrangement and manufacturing method
- Patent number 10,492,701
- Issue date Dec 3, 2019
- Koninklijke Philips N.V.
- Franciscus Theodorus Agricola
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Inductor bridge and electronic device
- Patent number 10,424,432
- Issue date Sep 24, 2019
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier-attached copper foil, laminate, method for producing printe...
- Patent number 10,251,283
- Issue date Apr 2, 2019
- JX Nippon Mining & Metals Corporation
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing circuit board and circuit board
- Patent number 10,206,287
- Issue date Feb 12, 2019
- Toyo Aluminium Kabushiki Kaisha
- Kosuke Tsuji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Robust multi-layer wiring elements and assemblies with embedded mic...
- Patent number 10,032,646
- Issue date Jul 24, 2018
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of a rigid flex board module
- Patent number 9,900,997
- Issue date Feb 20, 2018
- Unimicron Technology Corp.
- Chi-Shiang Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit assembly and method therof
- Patent number 9,704,644
- Issue date Jul 11, 2017
- James Jen-Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor bridge and electronic device
- Patent number 9,672,970
- Issue date Jun 6, 2017
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board for an electronic device
- Patent number 9,521,755
- Issue date Dec 13, 2016
- Invensas Corporation
- Tomoo Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 9,510,447
- Issue date Nov 29, 2016
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 9,510,450
- Issue date Nov 29, 2016
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded architecture using resin coated copper
- Patent number 9,451,696
- Issue date Sep 20, 2016
- Intel Corporation
- Dilan Seneviratne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnection element with posts formed by plating
- Patent number 9,282,640
- Issue date Mar 8, 2016
- Tessera, Inc.
- Jinsu Kwon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rigid flex board module and the manufacturing method thereof
- Patent number 9,253,898
- Issue date Feb 2, 2016
- Unimicron Technology Corp.
- Chi-Shiang Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,247,644
- Issue date Jan 26, 2016
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer electronic structure with through thickness coaxial stru...
- Patent number 9,185,793
- Issue date Nov 10, 2015
- Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies C...
- Dror Hurwitz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging substrate, method for manufacturing same, and chip packag...
- Patent number 9,173,298
- Issue date Oct 27, 2015
- Zhen Ding Technology Co., Ltd.
- Yong Ha Woo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for fabricating wiring board
- Patent number 9,084,379
- Issue date Jul 14, 2015
- Unimicron Technology Corp.
- Tsung-Yuan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a chip support board structure
- Patent number 8,887,386
- Issue date Nov 18, 2014
- Kinsus Interconnect Technology Corp.
- Ting-Hao Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadframe interposer over semiconductor die and TSV substrate for v...
- Patent number 8,866,275
- Issue date Oct 21, 2014
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure and method of making interconnect element, and multilayer...
- Patent number 8,859,420
- Issue date Oct 14, 2014
- Invensas Corporation
- Kimitaka Endo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Chip support board structure
- Patent number 8,766,102
- Issue date Jul 1, 2014
- Kinsus Interconnect Technology Corp.
- Ting-Hao Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure and method of making interconnect element having metal tr...
- Patent number 8,736,064
- Issue date May 27, 2014
- Invensas Corporation
- Hideki Kotake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing coreless substrate
- Patent number 8,555,494
- Issue date Oct 15, 2013
- Intel Corporation
- Houssam Jomaa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer wiring substrate
- Patent number 8,535,546
- Issue date Sep 17, 2013
- NGK Spark Plug Co., Ltd.
- Shinnosuke Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating an interconnection element having conductive...
- Patent number 8,505,199
- Issue date Aug 13, 2013
- Tessera, Inc.
- Jinsu Kwon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a package substrate
- Patent number 8,499,444
- Issue date Aug 6, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Jin-Yong An
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and process for fabricating the same
- Patent number 8,450,621
- Issue date May 28, 2013
- Unimicron Technology Corp.
- Tsung-Yuan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTI-HUNDRED OR THOUSAND CHANNEL ELECTRODE ELECTROPHYSIOLOGICAL AR...
- Publication number 20240226565
- Publication date Jul 11, 2024
- The Regents of the University of California
- Shadi A. Dayeh
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
ULTRA-THIN COPPER FOIL WITH CARRIER FOIL AND METHOD FOR MANUFACTURI...
- Publication number 20240206062
- Publication date Jun 20, 2024
- Lotte Energy Materials Corporation
- Chang Yol YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-HUNDRED OR THOUSAND CHANNEL ELECTRODE ELECTROPHYSIOLOGICAL AR...
- Publication number 20240131339
- Publication date Apr 25, 2024
- The Regents of the University of California
- Shadi A. Dayeh
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
ULTRA-THIN COPPER FOIL, ULTRA-THIN COPPER FOIL WITH CARRIER, AND ME...
- Publication number 20210127503
- Publication date Apr 29, 2021
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori Matsuura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE
- Publication number 20200154578
- Publication date May 14, 2020
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRODUCTION METHOD FOR MULTILAYER WIRING BOARD
- Publication number 20200045830
- Publication date Feb 6, 2020
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRODUCTION METHOD FOR MULTILAYER WIRING BOARD
- Publication number 20200045829
- Publication date Feb 6, 2020
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160021759
- Publication date Jan 21, 2016
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160021758
- Publication date Jan 21, 2016
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SYSTEM FOR FORMING A MICROVIA IN A PRINTED CIRCUIT BOARD
- Publication number 20140268610
- Publication date Sep 18, 2014
- Gregory HALVORSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD FOR AN ELECTRONIC DEVICE
- Publication number 20140240934
- Publication date Aug 28, 2014
- Invensas Corporation
- Tomoo Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD MATERIAL
- Publication number 20140205854
- Publication date Jul 24, 2014
- Ohmega Technologies, Inc.
- Daniel BRANDLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAG...
- Publication number 20140185259
- Publication date Jul 3, 2014
- ZHEN DING TECHNOLOGY CO., LTD.
- YONG HA WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED DISCRETE COMPONENT MOUNTING ON ORGANIC SUBSTRATE
- Publication number 20140158414
- Publication date Jun 12, 2014
- CHRIS BALDWIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A CHIP SUPPORT BOARD STRUCTURE
- Publication number 20140115888
- Publication date May 1, 2014
- KINSUS INTERCONNECT TECHNOLOGY CORP.
- Ting-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SUPPORT BOARD STRUCTURE
- Publication number 20140116757
- Publication date May 1, 2014
- KINSUS INTERCONNECT TECHNOLOGY CORP.
- Ting-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED ARCHITECTURE USING RESIN COATED COPPER
- Publication number 20140090879
- Publication date Apr 3, 2014
- Dilan SENEVIRATNE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC STRUCTURE WITH THROUGH THICKNESS COAXIAL STRU...
- Publication number 20130319738
- Publication date Dec 5, 2013
- DROR HURWITZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE
- Publication number 20130313004
- Publication date Nov 28, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Jin-Yong An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION ELEMENT WITH POSTS FORMED BY PLATING
- Publication number 20130286619
- Publication date Oct 31, 2013
- Jinsu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING BOARD FOR AN ELECTRONIC DEVICE
- Publication number 20130247372
- Publication date Sep 26, 2013
- Invensas Corporation
- Tomoo Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Leadframe Interposer Ove...
- Publication number 20130154076
- Publication date Jun 20, 2013
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION ELEMENT FOR ELECTRIC CIRCUITS
- Publication number 20130119012
- Publication date May 16, 2013
- Tessera Interconnect Materials, Inc.
- Kimitaka Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20120312588
- Publication date Dec 13, 2012
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR FABRICATING WIRING BOARD
- Publication number 20120174391
- Publication date Jul 12, 2012
- Unimicron Technology Corp.
- Tsung-Yuan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20120155038
- Publication date Jun 21, 2012
- Sharp Kabushiki Kaisha
- Yasumori Fukushima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING MULTILAYER WIRING SUBSTRATE
- Publication number 20120145666
- Publication date Jun 14, 2012
- NGK SPARK PLUG CO., LTD.
- Shinnosuke MAEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR FABRICATING CIRCUIT BOARD
- Publication number 20120124830
- Publication date May 24, 2012
- Unimicron Technology Corp.
- David C. H. Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20120088334
- Publication date Apr 12, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Mi Sun HWANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Forming Leadframe Interposer Ove...
- Publication number 20120061814
- Publication date Mar 15, 2012
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Etch stop layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Ultra-thin copper foil, ultra-thin copper foil with carrier, and me...

Circuit substrate

Flexible conductive track arrangement and manufacturing method

Inductor bridge and electronic device

Carrier-attached copper foil, laminate, method for producing printe...

Method for manufacturing circuit board and circuit board

Robust multi-layer wiring elements and assemblies with embedded mic...

Manufacturing method of a rigid flex board module

Flexible circuit assembly and method therof

Inductor bridge and electronic device

Multilayer wiring board for an electronic device

Printed wiring board and method for manufacturing the same

Printed wiring board and method for manufacturing the same

Embedded architecture using resin coated copper

Interconnection element with posts formed by plating

Rigid flex board module and the manufacturing method thereof

Wiring board and method for manufacturing the same

Multilayer electronic structure with through thickness coaxial stru...

Packaging substrate, method for manufacturing same, and chip packag...

Process for fabricating wiring board

Method of manufacturing a chip support board structure

Leadframe interposer over semiconductor die and TSV substrate for v...

Structure and method of making interconnect element, and multilayer...

Chip support board structure

Structure and method of making interconnect element having metal tr...

Method of manufacturing coreless substrate

Method of manufacturing multilayer wiring substrate

Method of fabricating an interconnection element having conductive...

Method of manufacturing a package substrate

Wiring board and process for fabricating the same

Patents Applicationslast 30 patents

MULTI-HUNDRED OR THOUSAND CHANNEL ELECTRODE ELECTROPHYSIOLOGICAL AR...

ULTRA-THIN COPPER FOIL WITH CARRIER FOIL AND METHOD FOR MANUFACTURI...

MULTI-HUNDRED OR THOUSAND CHANNEL ELECTRODE ELECTROPHYSIOLOGICAL AR...

ULTRA-THIN COPPER FOIL, ULTRA-THIN COPPER FOIL WITH CARRIER, AND ME...

CIRCUIT SUBSTRATE

PRODUCTION METHOD FOR MULTILAYER WIRING BOARD

PRODUCTION METHOD FOR MULTILAYER WIRING BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

METHOD AND SYSTEM FOR FORMING A MICROVIA IN A PRINTED CIRCUIT BOARD

MULTILAYER WIRING BOARD FOR AN ELECTRONIC DEVICE

CIRCUIT BOARD MATERIAL

PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAG...

RECESSED DISCRETE COMPONENT MOUNTING ON ORGANIC SUBSTRATE

METHOD OF MANUFACTURING A CHIP SUPPORT BOARD STRUCTURE

CHIP SUPPORT BOARD STRUCTURE

EMBEDDED ARCHITECTURE USING RESIN COATED COPPER

MULTILAYER ELECTRONIC STRUCTURE WITH THROUGH THICKNESS COAXIAL STRU...

PACKAGE SUBSTRATE

INTERCONNECTION ELEMENT WITH POSTS FORMED BY PLATING

MULTILAYER WIRING BOARD FOR AN ELECTRONIC DEVICE

Semiconductor Device and Method of Forming Leadframe Interposer Ove...

INTERCONNECTION ELEMENT FOR ELECTRIC CIRCUITS

CIRCUIT BOARD

PROCESS FOR FABRICATING WIRING BOARD

FLEXIBLE CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING MULTILAYER WIRING SUBSTRATE

PROCESS FOR FABRICATING CIRCUIT BOARD

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

Semiconductor Device and Method of Forming Leadframe Interposer Ove...