Etchants

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H05K3/067

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

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H05K3/067Etchants

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Circuit board and preparation method thereof
- Patent number 12,114,424
- Issue date Oct 8, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Mei Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 12,063,750
- Issue date Aug 13, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Ying-Qiu Zheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 11,991,836
- Issue date May 21, 2024
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible laminated board and multilayer circuit board
- Patent number 11,985,762
- Issue date May 14, 2024
- UBE EXSYMO CO., LTD.
- Eisuke Tachibana
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Transparent conductive circuit
- Patent number 11,943,865
- Issue date Mar 26, 2024
- Chasm Advanced Materials, Inc.
- Richard P. Heroux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic etching using photosensitive compound
- Patent number 11,937,379
- Issue date Mar 19, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Jolanta Klocek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Etch chemistry for metallic materials
- Patent number 11,873,564
- Issue date Jan 16, 2024
- Hutchinson Technology Incorporated
- Douglas P. Riemer
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Patterning paste
- Patent number 11,753,561
- Issue date Sep 12, 2023
- PPG Industries Ohio, Inc.
- Paul F. Cheetham
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Embedded-type transparent electrode substrate and method for manufa...
- Patent number 11,716,818
- Issue date Aug 1, 2023
- LG Chem, Ltd.
- Yong Goo Son
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for etching of metals
- Patent number 11,647,590
- Issue date May 9, 2023
- D-Wave Systems Inc.
- Jeffrey P. Burress
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 11,596,072
- Issue date Feb 28, 2023
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin copper foil, ultra-thin copper foil with carrier, and me...
- Patent number 11,576,267
- Issue date Feb 7, 2023
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Touch sensor with auxiliary conductive unit on transparent electrode
- Patent number 11,561,658
- Issue date Jan 24, 2023
- Young Fast Optoelectronics Co., Ltd.
- Chih-Chiang Pai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 11,523,517
- Issue date Dec 6, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Ying-Qiu Zheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for connecting stacked circuit boards
- Patent number 11,483,938
- Issue date Oct 25, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Rui-Wu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and manufacturing method therefor
- Patent number 11,464,117
- Issue date Oct 4, 2022
- LG Innotek Co., Ltd
- Hee Young Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing transfer film including seed layer, method...
- Patent number 11,453,823
- Issue date Sep 27, 2022
- InkTee Co., Ltd.
- Kwang-Choon Chung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etchant composition and forming method of wiring using etchant comp...
- Patent number 11,384,437
- Issue date Jul 12, 2022
- Samsung Display Co., Ltd.
- Jong Hee Park
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fluororesin base material, printed wiring board, and circuit module
- Patent number 11,364,714
- Issue date Jun 21, 2022
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Satoshi Kiya
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for forming circuits using seed layer and etchant compositio...
- Patent number 11,317,514
- Issue date Apr 26, 2022
- Inktec Co., Ltd.
- Kwang-Choon Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic substrate and manufacturing method therefor
- Patent number 11,291,113
- Issue date Mar 29, 2022
- AMOSENSE CO. LTD.
- Ji-Hyung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with different surface finishes and method for ma...
- Patent number 11,284,511
- Issue date Mar 22, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Giordano Di Gregorio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic etching using photopolymerizable compound
- Patent number 11,266,022
- Issue date Mar 1, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jolanta Klocek
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Embedded-type transparent electrode substrate and method for manufa...
- Patent number 11,259,417
- Issue date Feb 22, 2022
- LG Chem, Ltd.
- Yong Goo Son
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming auxiliary conductive unit on transparent electro...
- Patent number 11,169,645
- Issue date Nov 9, 2021
- Young Fast Optoelectronics Co., Ltd.
- Chih-Chiang Pai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit forming method using selective etching of electrically cond...
- Patent number 11,160,171
- Issue date Oct 26, 2021
- InkTee Co., Ltd.
- Kwang-Choon Chung
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing ceramic circuit board
- Patent number 11,129,282
- Issue date Sep 21, 2021
- Kabushiki Kaisha Toshiba
- Hiromasa Kato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Microcircuit forming method and etching fluid composition
- Patent number 11,089,691
- Issue date Aug 10, 2021
- Inktec Co., Ltd.
- Su Han Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic etching using highly branched polymers
- Patent number 11,071,210
- Issue date Jul 20, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jolanta Klocek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulated circuit board
- Patent number 11,013,107
- Issue date May 18, 2021
- Mitsubishi Materials Corporation
- Takeshi Kitahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Transparent Conductive Circuit
- Publication number 20240276638
- Publication date Aug 15, 2024
- Chasm Advanced Materials, Inc.
- Richard P. Heroux
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME, FUNCTIONAL BAC...
- Publication number 20240260185
- Publication date Aug 1, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Jiaxiang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20240260187
- Publication date Aug 1, 2024
- Shinko Electric Industries Co., Ltd.
- Hiroshi YOKOTA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240251504
- Publication date Jul 25, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, METHOD FOR MANUFACTURING WIRING BOARD, LAMINATE FOR I...
- Publication number 20240235004
- Publication date Jul 11, 2024
- DAI NIPPON PRINTING CO., LTD.
- Kazuki KINOSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240206057
- Publication date Jun 20, 2024
- IBIDEN CO., LTD.
- Shunsuke SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...
- Publication number 20240188224
- Publication date Jun 6, 2024
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED SUBTRACTIVE ETCH ANISOTROPY USING ETCH RATE GRADIENT
- Publication number 20240114627
- Publication date Apr 4, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etch Chemistry For Metallic Materials
- Publication number 20240102174
- Publication date Mar 28, 2024
- Hutchinson Technology Incorporated
- Douglas P. Riemer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FORMING THROUGH-VIA METAL WIRING
- Publication number 20240080993
- Publication date Mar 7, 2024
- EXTOLCO.,LTD.
- Sung Woong KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20230337366
- Publication date Oct 19, 2023
- LG Innotek Co., Ltd.
- Ji Myoung LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE FOR ETCHING THE PERIPHERY EDGE OF A SUBSTRATE AND METHOD FOR...
- Publication number 20230269881
- Publication date Aug 24, 2023
- DEVICEENG CO., LTD
- Taek Youb LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...
- Publication number 20230180396
- Publication date Jun 8, 2023
- Board of Regents, The University of Texas System
- Romil Modi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230047768
- Publication date Feb 16, 2023
- Avary Holding (Shenzhen) Co., Limited.
- YING-QIU ZHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND PREPARATION METHOD THEREOF
- Publication number 20220322530
- Publication date Oct 6, 2022
- MEI YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20220256712
- Publication date Aug 11, 2022
- Nitto Denko Corporation
- Kenya TAKIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED-TYPE TRANSPARENT ELECTRODE SUBSTRATE AND METHOD FOR MANUFA...
- Publication number 20220132675
- Publication date Apr 28, 2022
- LG CHEM, LTD.
- Yong Goo SON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTINUOUS ETCHING SYSTEM
- Publication number 20220117092
- Publication date Apr 14, 2022
- Jainil SHAH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Transparent Conductive Circuit
- Publication number 20220095452
- Publication date Mar 24, 2022
- Richard P. Heroux
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220046802
- Publication date Feb 10, 2022
- Avary Holding (Shenzhen) Co., Limited.
- YING-QIU ZHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOUCH SENSOR WITH AUXILIARY CONDUCTIVE UNIT ON TRANSPARENT ELECTRODE
- Publication number 20210382581
- Publication date Dec 9, 2021
- Young Fast Optoelectronics Co., Ltd.
- Chih-Chiang Pai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Anisotropic Etching Using Photosensitive Compound
- Publication number 20210315104
- Publication date Oct 7, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jolanta Klocek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED-TYPE TRANSPARENT ELECTRODE SUBSTRATE AND METHOD FOR MANUFA...
- Publication number 20210195760
- Publication date Jun 24, 2021
- LG CHEM, LTD.
- Yong Goo SON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Forming Auxiliary Conductive Unit on Transparent Electro...
- Publication number 20210173519
- Publication date Jun 10, 2021
- Young Fast Optoelectronics Co., Ltd.
- Chih-Chiang Pai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLEXIBLE LAMINATED BOARD AND MULTILAYER CIRCUIT BOARD
- Publication number 20210153348
- Publication date May 20, 2021
- UBE EXSYMO CO., LTD.
- Eisuke TACHIBANA
- B32 - LAYERED PRODUCTS
Information Patent Application
ULTRA-THIN COPPER FOIL, ULTRA-THIN COPPER FOIL WITH CARRIER, AND ME...
- Publication number 20210127503
- Publication date Apr 29, 2021
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori Matsuura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Patterning Paste
- Publication number 20210032489
- Publication date Feb 4, 2021
- PPG INDUSTRIES OHIO, INC.
- Paul F. CHEETHAM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INSULATED CIRCUIT BOARD
- Publication number 20210007217
- Publication date Jan 7, 2021
- MITSUBISHI MATERIALS CORPORATION
- Takeshi Kitahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR ETCHING OF METALS
- Publication number 20200404792
- Publication date Dec 24, 2020
- D-WAVE SYSTEMS INC.
- Jeffrey P. Burress
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT FORMING METHOD USING SELECTIVE ETCHING OF ELECTRICALLY COND...
- Publication number 20200389979
- Publication date Dec 10, 2020
- INKTEC CO., LTD.
- Kwang-Choon CHUNG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board and preparation method thereof

Circuit board and method for manufacturing the same

Electrical devices with electrodes on softening polymers and method...

Flexible laminated board and multilayer circuit board

Transparent conductive circuit

Anisotropic etching using photosensitive compound

Etch chemistry for metallic materials

Patterning paste

Embedded-type transparent electrode substrate and method for manufa...

Systems and methods for etching of metals

Electrical devices with electrodes on softening polymers and method...

Ultra-thin copper foil, ultra-thin copper foil with carrier, and me...

Touch sensor with auxiliary conductive unit on transparent electrode

Circuit board and method for manufacturing the same

Method for connecting stacked circuit boards

Printed circuit board and manufacturing method therefor

Method for manufacturing transfer film including seed layer, method...

Etchant composition and forming method of wiring using etchant comp...

Fluororesin base material, printed wiring board, and circuit module

Method for forming circuits using seed layer and etchant compositio...

Ceramic substrate and manufacturing method therefor

Component carrier with different surface finishes and method for ma...

Anisotropic etching using photopolymerizable compound

Embedded-type transparent electrode substrate and method for manufa...

Method for forming auxiliary conductive unit on transparent electro...

Circuit forming method using selective etching of electrically cond...

Method for manufacturing ceramic circuit board

Microcircuit forming method and etching fluid composition

Anisotropic etching using highly branched polymers

Insulated circuit board

Patents Applicationslast 30 patents

Transparent Conductive Circuit

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME, FUNCTIONAL BAC...

WIRING BOARD

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

WIRING BOARD, METHOD FOR MANUFACTURING WIRING BOARD, LAMINATE FOR I...

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...

ENHANCED SUBTRACTIVE ETCH ANISOTROPY USING ETCH RATE GRADIENT

Etch Chemistry For Metallic Materials

METHOD FOR FORMING THROUGH-VIA METAL WIRING

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

DEVICE FOR ETCHING THE PERIPHERY EDGE OF A SUBSTRATE AND METHOD FOR...

ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT BOARD AND PREPARATION METHOD THEREOF

WIRING CIRCUIT BOARD

EMBEDDED-TYPE TRANSPARENT ELECTRODE SUBSTRATE AND METHOD FOR MANUFA...

CONTINUOUS ETCHING SYSTEM

Transparent Conductive Circuit

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

TOUCH SENSOR WITH AUXILIARY CONDUCTIVE UNIT ON TRANSPARENT ELECTRODE

Anisotropic Etching Using Photosensitive Compound

EMBEDDED-TYPE TRANSPARENT ELECTRODE SUBSTRATE AND METHOD FOR MANUFA...

Method for Forming Auxiliary Conductive Unit on Transparent Electro...

FLEXIBLE LAMINATED BOARD AND MULTILAYER CIRCUIT BOARD

ULTRA-THIN COPPER FOIL, ULTRA-THIN COPPER FOIL WITH CARRIER, AND ME...

Patterning Paste

INSULATED CIRCUIT BOARD

SYSTEMS AND METHODS FOR ETCHING OF METALS

CIRCUIT FORMING METHOD USING SELECTIVE ETCHING OF ELECTRICALLY COND...