Etching the insulating layers by chemical or physical means

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H01L21/311

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/311Etching the insulating layers by chemical or physical means

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Photoresist and method of formation and use
- Patent number 12,287,575
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Keng-Chu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film deposition apparatus for fine pattern forming
- Patent number 12,288,671
- Issue date Apr 29, 2025
- Tokyo Electron Limited
- Kazuhide Hasebe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etching solution, method for treating substrate with the etching so...
- Patent number 12,288,693
- Issue date Apr 29, 2025
- Tokuyama Corporation
- Manami Oshio
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing a semiconductor structure for detecting ve...
- Patent number 12,283,530
- Issue date Apr 22, 2025
- NANYA TECHNOLOGY CORPORATION
- Chun-Shun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching composition and method for selectively removing silicon nit...
- Patent number 12,281,251
- Issue date Apr 22, 2025
- VERSUM MATERIALS US, LLC
- Jhih Kuei Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method
- Patent number 12,283,479
- Issue date Apr 22, 2025
- ASM IP Holding B.V.
- JaeOk Ko
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Inner spacer for semiconductor device
- Patent number 12,283,618
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fu-Ting Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with contact structure
- Patent number 12,283,518
- Issue date Apr 22, 2025
- NANYA TECHNOLOGY CORPORATION
- Chih-Hsuan Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 12,283,476
- Issue date Apr 22, 2025
- Kokusai Electric Corporation
- Hiroshi Ashihara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etch selectivity control in atomic layer etching
- Patent number 12,280,091
- Issue date Apr 22, 2025
- Lam Research Corporation
- Andreas Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 12,279,431
- Issue date Apr 15, 2025
- Ramey M. Abdelrahaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate contact structure over active gate and method to fabricate same
- Patent number 12,278,144
- Issue date Apr 15, 2025
- Intel Corporation
- Abhijit Jayant Pethe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching method using pentafluoropropanol
- Patent number 12,278,093
- Issue date Apr 15, 2025
- Ajou University Industry-Academic Cooperation Foundation
- Chang-Koo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning electronic devices using reactive-ion etching of tin oxides
- Patent number 12,279,450
- Issue date Apr 15, 2025
- Cornell University
- Jisung Park
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Semiconductor structure and method for forming semiconductor structure
- Patent number 12,278,107
- Issue date Apr 15, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kai Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 12,278,141
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array
- Patent number 12,278,180
- Issue date Apr 15, 2025
- Harsh Narendrakumar Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 12,278,177
- Issue date Apr 15, 2025
- SK keyfoundry Inc.
- Jeong Geun Bak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preparation method of semiconductor device
- Patent number 12,278,106
- Issue date Apr 15, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jun Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bias voltage modulation approach for SiO/SiN layer alternating etch...
- Patent number 12,278,110
- Issue date Apr 15, 2025
- Applied Materials, Inc.
- Sean Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching method
- Patent number 12,278,111
- Issue date Apr 15, 2025
- Ajou University Industry-Academic Cooperation Foundation
- Chang-Koo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure
- Patent number 12,278,113
- Issue date Apr 15, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zhaohui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 12,278,114
- Issue date Apr 15, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Qiang Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Different via configurations for different via interface requirements
- Patent number 12,278,188
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Che Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with helmet structure between two semiconducto...
- Patent number 12,278,236
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Cheng Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having funnel-shaped gate structures
- Patent number 12,278,267
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor memory device and semiconduc...
- Patent number 12,279,432
- Issue date Apr 15, 2025
- Kioxia Corporation
- Hirotaka Tsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive coupling in a direct-bonded interface for microelectroni...
- Patent number 12,272,673
- Issue date Apr 8, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor devices
- Patent number 12,272,555
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Jinyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxygen and iodine-containing hydrofluorocarbon compound for etching...
- Patent number 12,272,562
- Issue date Apr 8, 2025
- L'Aire Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés G...
- Fabrizio Marchegiani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20250142820
- Publication date May 1, 2025
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A FIN AT A S/D REGION AND A SEMICONDUCT...
- Publication number 20250142954
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Cheng Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-STATE PULSING FOR ACHIEVING A BALANCE BETWEEN BOW CONTROL AND...
- Publication number 20250140565
- Publication date May 1, 2025
- LAM RESEARCH CORPORATION
- Nikhil Dole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVITY OF BORON HARD MASKS USING ION IMPLANT
- Publication number 20250140566
- Publication date May 1, 2025
- Applied Materials, Inc.
- Aykut Aydin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA SHAPING BETWEEN METAL LAYERS FOR CONTROLLED RESISTANCE
- Publication number 20250140604
- Publication date May 1, 2025
- Applied Materials, Inc.
- Sefa Dag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PUNCH THROUGH STOPPER IN BULK FINFET DEVICE
- Publication number 20250142855
- Publication date May 1, 2025
- Adeia Semiconductor Solutions LLC
- Veeraraghavan S. Basker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU BACK SIDE PLASMA TREATMENT FOR RESIDUE REMOVAL FROM SUBSTRATES
- Publication number 20250140530
- Publication date May 1, 2025
- LAM RESEARCH CORPORATION
- Tu HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20250140568
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- SangHyuk YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250142894
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Huije RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250142934
- Publication date May 1, 2025
- Mitsubishi Electric Corporation
- Asuka MATSUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CUT WITH INTEGRATED ETCH STOP LAYER
- Publication number 20250142949
- Publication date May 1, 2025
- TESSERA LLC
- Marc A. Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PATTERNS, SEMICONDUCTOR MEMORY DEVICE, AND METHOD...
- Publication number 20250140558
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Yeongsup SOHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PARAMETER IMPLANTATION FOR MANAGING WAFER DISTORTION
- Publication number 20250140567
- Publication date May 1, 2025
- Applied Materials, Inc.
- Stanislav S. TODOROV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED STRESS MODULATION BY IMPLANT TO BACK OF WAFER
- Publication number 20250140569
- Publication date May 1, 2025
- Applied Materials, Inc.
- Sony Varghese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION OF CARBON GAPFILL MATERIALS
- Publication number 20250137119
- Publication date May 1, 2025
- Applied Materials, Inc.
- Bhargav S. CITLA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Assemblies Having Conductive Structures Along Pillars of Semiconduc...
- Publication number 20250142875
- Publication date May 1, 2025
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING NANOSHEET TRANSISTOR USING SACRIFICIAL SPACER AND INNER SPA...
- Publication number 20250142921
- Publication date May 1, 2025
- Adeia Semiconductor Solutions LLC
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ETCHING SILICON-CONTAINING FILM AND METHOD OF MANUFACTURI...
- Publication number 20250140564
- Publication date May 1, 2025
- SK Specialty Co., Ltd.
- Byunghyang KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250142926
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Zhen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRU...
- Publication number 20250142939
- Publication date May 1, 2025
- Intel Corporation
- Jeffrey S. LEIB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSHEET CHANNEL-TO-SOURCE AND DRAIN ISOLATION
- Publication number 20250142856
- Publication date May 1, 2025
- Adeia Semiconductor Solutions LLC
- Marc A. Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHLORINE-FREE REMOVAL OF MOLYBDENUM OXIDES FROM SUBSTRATES
- Publication number 20250132165
- Publication date Apr 24, 2025
- Applied Materials, Inc.
- Jiajie Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE COMPOSITE AS ETCH STOP LAYER
- Publication number 20250132197
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Feng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR FORMING ORGANIC FILM, METHOD FOR FORMING ORGANIC FI...
- Publication number 20250129203
- Publication date Apr 24, 2025
- Shin-Etsu Chemical Co., Ltd.
- Daisuke KORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20250132203
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Song Yi BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HARDMASK INTEGRATION FOR HIGH ASPECT RATIO APPLICATIONS
- Publication number 20250132159
- Publication date Apr 24, 2025
- TOKYO ELECTRON LIMITED
- Joshua Baillargeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250132164
- Publication date Apr 24, 2025
- TOKYO ELECTRON LIMITED
- Koji Kagawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SELF-ALIGNED VIA FORMATION USING SPACERS
- Publication number 20250132204
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure Cutting Process and Structures Formed Thereby
- Publication number 20250126883
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250126870
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yong LIANG
- H01 - BASIC ELECTRIC ELEMENTS

Etching the insulating layers by chemical or physical means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Photoresist and method of formation and use

Film deposition apparatus for fine pattern forming

Etching solution, method for treating substrate with the etching so...

Method for manufacturing a semiconductor structure for detecting ve...

Etching composition and method for selectively removing silicon nit...

Substrate processing method

Inner spacer for semiconductor device

Method for fabricating semiconductor device with contact structure

Method of manufacturing semiconductor device, substrate processing...

Etch selectivity control in atomic layer etching

Integrated assemblies and methods of forming integrated assemblies

Gate contact structure over active gate and method to fabricate same

Plasma etching method using pentafluoropropanol

Patterning electronic devices using reactive-ion etching of tin oxides

Semiconductor structure and method for forming semiconductor structure

Semiconductor devices and methods of manufacture

Memory arrays and methods used in forming a memory array

Semiconductor device manufacturing method

Preparation method of semiconductor device

Bias voltage modulation approach for SiO/SiN layer alternating etch...

Plasma etching method

Method for manufacturing semiconductor structure

Manufacturing method of semiconductor structure

Different via configurations for different via interface requirements

Semiconductor device with helmet structure between two semiconducto...

Semiconductor devices having funnel-shaped gate structures

Method for manufacturing semiconductor memory device and semiconduc...

Capacitive coupling in a direct-bonded interface for microelectroni...

Methods of forming semiconductor devices

Oxygen and iodine-containing hydrofluorocarbon compound for etching...

Patents Applicationslast 30 patents

Integrated Assemblies and Methods of Forming Integrated Assemblies

SEMICONDUCTOR DEVICE HAVING A FIN AT A S/D REGION AND A SEMICONDUCT...

MULTI-STATE PULSING FOR ACHIEVING A BALANCE BETWEEN BOW CONTROL AND...

SELECTIVITY OF BORON HARD MASKS USING ION IMPLANT

VIA SHAPING BETWEEN METAL LAYERS FOR CONTROLLED RESISTANCE

PUNCH THROUGH STOPPER IN BULK FINFET DEVICE

IN-SITU BACK SIDE PLASMA TREATMENT FOR RESIDUE REMOVAL FROM SUBSTRATES

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

GATE CUT WITH INTEGRATED ETCH STOP LAYER

METHOD OF FORMING PATTERNS, SEMICONDUCTOR MEMORY DEVICE, AND METHOD...

MULTI-PARAMETER IMPLANTATION FOR MANAGING WAFER DISTORTION

LOCALIZED STRESS MODULATION BY IMPLANT TO BACK OF WAFER

DEPOSITION OF CARBON GAPFILL MATERIALS

Assemblies Having Conductive Structures Along Pillars of Semiconduc...

FORMING NANOSHEET TRANSISTOR USING SACRIFICIAL SPACER AND INNER SPA...

METHOD OF ETCHING SILICON-CONTAINING FILM AND METHOD OF MANUFACTURI...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRU...

NANOSHEET CHANNEL-TO-SOURCE AND DRAIN ISOLATION

CHLORINE-FREE REMOVAL OF MOLYBDENUM OXIDES FROM SUBSTRATES

METAL OXIDE COMPOSITE AS ETCH STOP LAYER

COMPOSITION FOR FORMING ORGANIC FILM, METHOD FOR FORMING ORGANIC FI...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES

HARDMASK INTEGRATION FOR HIGH ASPECT RATIO APPLICATIONS

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

SELF-ALIGNED VIA FORMATION USING SPACERS

Semiconductor Structure Cutting Process and Structures Formed Thereby

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME