Etching the insulating layers by chemical or physical means

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H01L21/311

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/311Etching the insulating layers by chemical or physical means

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Substrate processing device and etching liquid
- Patent number 12,203,021
- Issue date Jan 21, 2025
- Tokyo Electron Limited
- Koukichi Hiroshiro
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Formulations for high selective silicon nitride etch
- Patent number 12,203,022
- Issue date Jan 21, 2025
- Entegris, Inc.
- Daniela White
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Interconnect structure for semiconductor devices
- Patent number 12,205,816
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing element chips
- Patent number 12,205,823
- Issue date Jan 21, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Toshiyuki Takasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning material including silicon-containing layer and method f...
- Patent number 12,205,824
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of preparing semiconductor structure having low dielectric c...
- Patent number 12,205,825
- Issue date Jan 21, 2025
- NANYA TECHNOLOGY CORPORATION
- Yu-Kai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial layer for semiconductor process
- Patent number 12,205,994
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsan-Chun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device having source/drain regions including a plurality of...
- Patent number 12,205,988
- Issue date Jan 21, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kazuyuki Tomida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor structure
- Patent number 12,206,010
- Issue date Jan 21, 2025
- Winbond Electronics Corp.
- Shu-Ming Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 12,207,470
- Issue date Jan 21, 2025
- Kioxia Corporation
- Shinya Arai
- G11 - INFORMATION STORAGE
Information Patent Grant
Deposition of organic films
- Patent number 12,205,820
- Issue date Jan 21, 2025
- ASM IP Holding B.V.
- Eva E. Tois
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Nanostructure and manufacturing method thereof
- Patent number 12,205,822
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Cheng Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoresist and method
- Patent number 12,197,128
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Liang-Yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seam free isolation structures and method for making the same
- Patent number 12,199,097
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Ruei Jhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion implantation method for reducing roughness of patterned resist...
- Patent number 12,198,931
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Defect free germanium oxide gap fill
- Patent number 12,198,936
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Huiyuan Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etching method and plasma processing apparatus
- Patent number 12,198,937
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Koki Chino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for semiconductor manufacturing
- Patent number 12,198,939
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Han-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate line plug structures for advanced integrated circuit structure...
- Patent number 12,199,167
- Issue date Jan 14, 2025
- Intel Corporation
- Byron Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structure
- Patent number 12,198,985
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Wenhui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method
- Patent number 12,198,938
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Takatoshi Orui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit comprising trenches formed in a substrate
- Patent number 12,198,973
- Issue date Jan 14, 2025
- STMicroelectronics (Rousset) SAS
- Franck Julien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon gap fill processes
- Patent number 12,198,928
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Abhijeet S. Bagal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,198,930
- Issue date Jan 14, 2025
- Institute of Microelectronics, Chinese Academy of Sciences
- Libin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plugs for interconnect lines for advanced integrated circuit struct...
- Patent number 12,199,168
- Issue date Jan 14, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual channel gate all around transistor device and fabrication meth...
- Patent number 12,198,986
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Sheng Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a wiring and method of manufacturing a semiconduc...
- Patent number 12,193,210
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- Hyunchul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch method for opening a source line in flash memory
- Patent number 12,193,227
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yong-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing semiconductor...
- Patent number 12,191,142
- Issue date Jan 7, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kang You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,191,158
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITION FOR ETCHING AND MANUFACTURING METHOD OF SEMICONDUCTOR D...
- Publication number 20250026962
- Publication date Jan 23, 2025
- SOULBRAIN CO., LTD
- Jae-Wan PARK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250031375
- Publication date Jan 23, 2025
- SK HYNIX INC.
- Sung-Lae OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20250031434
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHANT AND METHOD FOR SELECTIVELY ETCHING TITANIUM DIOXIDE
- Publication number 20250029842
- Publication date Jan 23, 2025
- Microsoft Technology Licensing, LLC
- Asbjørn Cennet Cliff Drachmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-PROCESSING METHOD AND SUBSTRATE-PROCESSING APPARATUS
- Publication number 20250029843
- Publication date Jan 23, 2025
- TOKYO ELECTRON LIMITED
- Hiroto FUJIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250029870
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Feng LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE STRUCTURE FOR MEMORY DEVICE
- Publication number 20250031366
- Publication date Jan 23, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20250024679
- Publication date Jan 16, 2025
- Yangtze Memory Technologies Co., Ltd.
- Yali SONG
- G11 - INFORMATION STORAGE
Information Patent Application
Assemblies Having Conductive Structures Along Pillars of Semiconduc...
- Publication number 20250022955
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTORESIST COMPOSITIONS AND METHODS OF MANUFACTURING INTEGRATED CI...
- Publication number 20250020998
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Kyungoh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS CLUSTER ASSISTED PLASMA PROCESSING
- Publication number 20250022689
- Publication date Jan 16, 2025
- TOKYO ELECTRON LIMITED
- Peter Ventzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20250022716
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Eun Jung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...
- Publication number 20250022939
- Publication date Jan 16, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES TO MEASURE ELECTRICAL SIGNALS OF MATERIAL DIS...
- Publication number 20250020629
- Publication date Jan 16, 2025
- Analog Devices, Inc.
- Phillip Michel Nadeau
- G01 - MEASURING TESTING
Information Patent Application
DIRECTIONAL SELECTIVE FILL OF SILICON OXIDE MATERIALS
- Publication number 20250022704
- Publication date Jan 16, 2025
- Applied Materials, Inc.
- Qiang Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HOT ION IMPLANTATION FOR CONDENSATION DEFECT REDUCTION
- Publication number 20250022712
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bau-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD FOR SEMICONDUCTOR STRUCTURE COMPRISING SUBSTRATE, FI...
- Publication number 20250022718
- Publication date Jan 16, 2025
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Huan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE TREATMENT METHOD
- Publication number 20250014905
- Publication date Jan 9, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Ludovic DUPRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROTECTING ACTIVE LAYERS OF ELECTRONIC CHIPS
- Publication number 20250014912
- Publication date Jan 9, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Emilie BOURJOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN-TYPE FIELD EFFECT TRANSISTOR DEVICE
- Publication number 20250015080
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR TOPOGRAPHY-SELECTIVE DEPOSITIONS
- Publication number 20250014908
- Publication date Jan 9, 2025
- ASM IP HOLDING, B.V.
- Timothee Blanquart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING MARK ON SEMICONDUCTOR DEVICE
- Publication number 20250015011
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- LIANG-SHIUAN PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PREVENTING PATTERN COLLAPSE
- Publication number 20250013153
- Publication date Jan 9, 2025
- TOKYO ELECTRON LIMITED
- Lior HULI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE WITH FEATURES A...
- Publication number 20250014900
- Publication date Jan 9, 2025
- NANYA TECHNOLOGY CORPORATION
- CHIH-TSUNG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR ETCHING SILICON OXIDE
- Publication number 20250014906
- Publication date Jan 9, 2025
- Central Glass Company, Limited
- Shoi SUZUKI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ETCHING METHOD
- Publication number 20250014907
- Publication date Jan 9, 2025
- HITACHI HIGH-TECH CORPORATION
- Takashi Hattori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20250015010
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wang Kuo LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composition For Forming Organic Film, Method For Forming Organic Fi...
- Publication number 20250011623
- Publication date Jan 9, 2025
- Shin-Etsu Chemical Co., Ltd.
- Daisuke KORI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE AND REWORKING PROCESS
- Publication number 20250014910
- Publication date Jan 9, 2025
- NANYA TECHNOLOGY CORPORATION
- WEI-CHEN PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-PRESSURE WAFER PROCESSING METHOD USING DUAL HIGH-PRESSURE WAFE...
- Publication number 20250014928
- Publication date Jan 9, 2025
- HPSP Co., Ltd.
- Sung Kil CHO
- H01 - BASIC ELECTRIC ELEMENTS

Etching the insulating layers by chemical or physical means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate processing device and etching liquid

Formulations for high selective silicon nitride etch

Interconnect structure for semiconductor devices

Method for producing element chips

Patterning material including silicon-containing layer and method f...

Method of preparing semiconductor structure having low dielectric c...

Sacrificial layer for semiconductor process

FinFET device having source/drain regions including a plurality of...

Method for forming a semiconductor structure

Semiconductor device and method for manufacturing same

Deposition of organic films

Nanostructure and manufacturing method thereof

Photoresist and method

Seam free isolation structures and method for making the same

Ion implantation method for reducing roughness of patterned resist...

Defect free germanium oxide gap fill

Etching method and plasma processing apparatus

Technique for semiconductor manufacturing

Gate line plug structures for advanced integrated circuit structure...

Contact over active gate structure

Etching method

Integrated circuit comprising trenches formed in a substrate

Carbon gap fill processes

Method for manufacturing semiconductor device

Plugs for interconnect lines for advanced integrated circuit struct...

Dual channel gate all around transistor device and fabrication meth...

Method of forming a wiring and method of manufacturing a semiconduc...

Etch method for opening a source line in flash memory

Semiconductor structure and method for manufacturing semiconductor...

Semiconductor device and method

Patents Applicationslast 30 patents

COMPOSITION FOR ETCHING AND MANUFACTURING METHOD OF SEMICONDUCTOR D...

SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

ETCHANT AND METHOD FOR SELECTIVELY ETCHING TITANIUM DIOXIDE

SUBSTRATE-PROCESSING METHOD AND SUBSTRATE-PROCESSING APPARATUS

INTERCONNECTION STRUCTURE AND METHOD FOR FORMING THE SAME

STAIRCASE STRUCTURE FOR MEMORY DEVICE

3D NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME

Assemblies Having Conductive Structures Along Pillars of Semiconduc...

PHOTORESIST COMPOSITIONS AND METHODS OF MANUFACTURING INTEGRATED CI...

GAS CLUSTER ASSISTED PLASMA PROCESSING

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...

SEMICONDUCTOR DEVICES TO MEASURE ELECTRICAL SIGNALS OF MATERIAL DIS...

DIRECTIONAL SELECTIVE FILL OF SILICON OXIDE MATERIALS

HOT ION IMPLANTATION FOR CONDENSATION DEFECT REDUCTION

ETCHING METHOD FOR SEMICONDUCTOR STRUCTURE COMPRISING SUBSTRATE, FI...

SURFACE TREATMENT METHOD

METHOD FOR PROTECTING ACTIVE LAYERS OF ELECTRONIC CHIPS

FIN-TYPE FIELD EFFECT TRANSISTOR DEVICE

METHODS AND SYSTEMS FOR TOPOGRAPHY-SELECTIVE DEPOSITIONS

METHOD OF FORMING MARK ON SEMICONDUCTOR DEVICE

METHOD OF PREVENTING PATTERN COLLAPSE

METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE WITH FEATURES A...

METHOD AND DEVICE FOR ETCHING SILICON OXIDE

ETCHING METHOD

SEMICONDUCTOR STRUCTURE AND FABRICATING METHOD THEREOF

Composition For Forming Organic Film, Method For Forming Organic Fi...

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE AND REWORKING PROCESS

HIGH-PRESSURE WAFER PROCESSING METHOD USING DUAL HIGH-PRESSURE WAFE...