Etching the insulating layers by chemical or physical means

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H01L21/311

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/311Etching the insulating layers by chemical or physical means

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods of forming metal nitride films
- Patent number 11,978,625
- Issue date May 7, 2024
- Applied Materials, Inc.
- Joseph AuBuchon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices including a via and methods of forming t...
- Patent number 11,978,668
- Issue date May 7, 2024
- Samsung Electronics Co., Ltd.
- Ming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 11,978,676
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bipolar transistor and radio-frequency power amplifier module
- Patent number 11,978,786
- Issue date May 7, 2024
- Murata Manufacturing Co., Ltd.
- Isao Obu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor devices
- Patent number 11,978,732
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming contact holes with controlled local critical dimension unif...
- Patent number 11,978,631
- Issue date May 7, 2024
- Tokyo Electron Limited
- Junling Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-color self-aligned double patterning (SADP) to yield static ran...
- Patent number 11,978,639
- Issue date May 7, 2024
- TESSERA LLC
- Fee Li Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for selectively manufacturing material layer and target pattern
- Patent number 11,976,364
- Issue date May 7, 2024
- Industry-University Cooperation Foundation Hanyang University Erica Campus
- Tae Joo Park
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of fabricating semiconductor device
- Patent number 11,978,673
- Issue date May 7, 2024
- Samsung Electronics Co., Ltd.
- Kyoungwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 11,978,640
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of original plate and semiconductor device
- Patent number 11,978,660
- Issue date May 7, 2024
- Kioxia Corporation
- Hirotaka Tsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned contact scheme
- Patent number 11,978,670
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition, its use and a process for selectively etching silicon-...
- Patent number 11,970,647
- Issue date Apr 30, 2024
- BASF SE
- Francisco Javier Lopez Villanueva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,972,953
- Issue date Apr 30, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zhen Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and plasma processing method
- Patent number 11,972,925
- Issue date Apr 30, 2024
- Tokyo Electron Limited
- Bong seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation structure and manufacturing method thereof
- Patent number 11,972,972
- Issue date Apr 30, 2024
- Winbond Electronics Corp.
- Che-Jui Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with inner spacer layer and method f...
- Patent number 11,973,129
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Han-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a three-dimensional memory device using composite...
- Patent number 11,972,954
- Issue date Apr 30, 2024
- SanDisk Technologies LLC
- Roshan Jayakhar Tirukkonda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,973,117
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method used in forming a memory array comprising strings of memory...
- Patent number 11,974,429
- Issue date Apr 30, 2024
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SRAM layout for double patterning
- Patent number 11,974,421
- Issue date Apr 30, 2024
- Texas Instruments Incorporated
- James Walter Blatchford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of a semiconductor de...
- Patent number 11,974,435
- Issue date Apr 30, 2024
- SK hynix Inc.
- In Su Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming asymmetric differential spacers for optimized MOS...
- Patent number 11,973,130
- Issue date Apr 30, 2024
- X-FAB France SAS
- Sébastien Daveau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,973,024
- Issue date Apr 30, 2024
- Kioxia Corporation
- Hisashi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical type semiconductor devices and methods of manufacturing th...
- Patent number 11,968,835
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Eun-Taek Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D NAND gate stack reinforcement
- Patent number 11,967,524
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Praket Prakash Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing thereof
- Patent number 11,967,533
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Uei Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized heating in laser annealing process
- Patent number 11,967,647
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Blandine Duriez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making high-voltage thick gate oxide
- Patent number 11,967,520
- Issue date Apr 23, 2024
- Hua Hong Semiconductor (Wuxi) Limited
- Junwen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and manufacturing method thereof
- Patent number 11,967,526
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PATTERNING UNDERLYING STRUCTURE
- Publication number 20240145244
- Publication date May 2, 2024
- Powerchip Semiconductor Manufacturing Corporation
- Yun-An Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20240145582
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ling-Yen YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fin Field-Effect Transistor Device Having Contact Plugs with Re-Ent...
- Publication number 20240145597
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE FORMATION IN THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20240145296
- Publication date May 2, 2024
- Yangtze Memory Technologies Co., Ltd.
- Yu Ting ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240145559
- Publication date May 2, 2024
- Industrial Technology Research Institute
- Chang-Yan HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM OXIDE CARBON HYBRID HARDMASKS AND METHODS FOR MAKING THE SAME
- Publication number 20240145245
- Publication date May 2, 2024
- Applied Materials, Inc.
- Yung-chen LIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Replacement Gate Methods That Include Treating Spacers to Widen Gate
- Publication number 20240145250
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A FINFET BY IMPLANTING A DIELECTRIC WITH A...
- Publication number 20240145596
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Su-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MEASURING OVERLAY OFFSET AND METHOD OF MANUFACTURING SEMI...
- Publication number 20240136234
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Mingyoo CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR DEVICE AND METHOD OF FABRICATING CONTACTS TO A SEMICONDU...
- Publication number 20240136411
- Publication date Apr 25, 2024
- Infineon Technologies Austria AG
- Seung Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR COMPONENT ON THE BASIS OF GALLIUM NITRIDE...
- Publication number 20240136407
- Publication date Apr 25, 2024
- ROBERT BOSCH GmbH
- Kevin Dannecker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING A SURFACE FOR DIRECT-BONDING
- Publication number 20240136196
- Publication date Apr 25, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING METHOD THEREOF
- Publication number 20240136199
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITING A CARBON HARDMASK BY HIGH POWER PULSED LOW FREQUENCY RF
- Publication number 20240136153
- Publication date Apr 25, 2024
- LAM RESEARCH CORPORATION
- Matthew Scott Weimer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FORMING AND USING MASK
- Publication number 20240136184
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFYING PATTERNED FEATURES USING A DIRECTIONAL ETCH
- Publication number 20240136197
- Publication date Apr 25, 2024
- Applied Materials, Inc.
- Tassie Andersen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-PROCESSING METHOD AND SUBSTRATE-PROCESSING APPARATUS
- Publication number 20240136198
- Publication date Apr 25, 2024
- TOKYO ELECTRON LIMITED
- Rui KANEMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS
- Publication number 20240136285
- Publication date Apr 25, 2024
- Lodestar Licensing Group LLC
- Shuangqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-STRESS PASSIVATION LAYER
- Publication number 20240136291
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Ku SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240128082
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Inoue NAOKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN INDIVIDUALIZATION ZONE OF AN INTEGRATED CIR...
- Publication number 20240128119
- Publication date Apr 18, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Stefan LANDIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY ETCHING WITH ETCH BYPRODUCT SELF-CLEANING
- Publication number 20240128091
- Publication date Apr 18, 2024
- Applied Materials, Inc.
- Zhonghua Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A CAPACITOR
- Publication number 20240128311
- Publication date Apr 18, 2024
- STMicroelectronics (Tours) SAS
- Mohamed Boufnichel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240128347
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Nam Gyu CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING LAYER STRUCTURE HAVING TARGET TOPOLOGICAL PR...
- Publication number 20240128090
- Publication date Apr 18, 2024
- ASM IP HOLDING B.V.
- Eiichiro Shiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING NANOSHEET TRANSISTOR USING SACRIFICIAL SPACER AND INNER SPA...
- Publication number 20240120408
- Publication date Apr 11, 2024
- TESSERA LLC
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR NON-RESIST NANOLITHOGRAPHY
- Publication number 20240120409
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Miin-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED ETCHING TECHNOLOGIES FOR STRAIGHT, TALL AND UNIFORM FINS A...
- Publication number 20240120206
- Publication date Apr 11, 2024
- Intel Corporation
- Muralidhar S. AMBATI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240120207
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lung-Kai Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING HIGH ASPECT RATIO FEATURES
- Publication number 20240120237
- Publication date Apr 11, 2024
- Lodestar Licensing Group LLC
- Ken Tokashiki
- H01 - BASIC ELECTRIC ELEMENTS

Etching the insulating layers by chemical or physical means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of forming metal nitride films

Integrated circuit devices including a via and methods of forming t...

Semiconductor structure and method of forming the same

Bipolar transistor and radio-frequency power amplifier module

Methods of manufacturing semiconductor devices

Forming contact holes with controlled local critical dimension unif...

Two-color self-aligned double patterning (SADP) to yield static ran...

Method for selectively manufacturing material layer and target pattern

Method of fabricating semiconductor device

Method of manufacturing semiconductor devices

Manufacturing method of original plate and semiconductor device

Self aligned contact scheme

Composition, its use and a process for selectively etching silicon-...

Semiconductor structure and manufacturing method thereof

Plasma processing apparatus and plasma processing method

Isolation structure and manufacturing method thereof

Semiconductor device structure with inner spacer layer and method f...

Method of making a three-dimensional memory device using composite...

Semiconductor device

Method used in forming a memory array comprising strings of memory...

SRAM layout for double patterning

Semiconductor device and manufacturing method of a semiconductor de...

Method of forming asymmetric differential spacers for optimized MOS...

Semiconductor memory device

Vertical type semiconductor devices and methods of manufacturing th...

3D NAND gate stack reinforcement

Semiconductor devices and methods of manufacturing thereof

Localized heating in laser annealing process

Method for making high-voltage thick gate oxide

Integrated circuit structure and manufacturing method thereof

Patents Applicationslast 30 patents

METHOD OF PATTERNING UNDERLYING STRUCTURE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Fin Field-Effect Transistor Device Having Contact Plugs with Re-Ent...

STAIRCASE FORMATION IN THREE-DIMENSIONAL MEMORY DEVICE

TRANSISTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME

ALUMINUM OXIDE CARBON HYBRID HARDMASKS AND METHODS FOR MAKING THE SAME

Replacement Gate Methods That Include Treating Spacers to Widen Gate

METHOD OF MANUFACTURING A FINFET BY IMPLANTING A DIELECTRIC WITH A...

METHOD OF MEASURING OVERLAY OFFSET AND METHOD OF MANUFACTURING SEMI...

TRANSISTOR DEVICE AND METHOD OF FABRICATING CONTACTS TO A SEMICONDU...

VERTICAL SEMICONDUCTOR COMPONENT ON THE BASIS OF GALLIUM NITRIDE...

METHOD FOR PREPARING A SURFACE FOR DIRECT-BONDING

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING METHOD THEREOF

DEPOSITING A CARBON HARDMASK BY HIGH POWER PULSED LOW FREQUENCY RF

METHOD FOR FORMING AND USING MASK

MODIFYING PATTERNED FEATURES USING A DIRECTIONAL ETCH

SUBSTRATE-PROCESSING METHOD AND SUBSTRATE-PROCESSING APPARATUS

MICROELECTRONIC DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS

LOW-STRESS PASSIVATION LAYER

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR PRODUCING AN INDIVIDUALIZATION ZONE OF AN INTEGRATED CIR...

DRY ETCHING WITH ETCH BYPRODUCT SELF-CLEANING

METHOD OF FABRICATING A CAPACITOR

SEMICONDUCTOR DEVICE

METHOD FOR FABRICATING LAYER STRUCTURE HAVING TARGET TOPOLOGICAL PR...

FORMING NANOSHEET TRANSISTOR USING SACRIFICIAL SPACER AND INNER SPA...

METHOD FOR NON-RESIST NANOLITHOGRAPHY

ADVANCED ETCHING TECHNOLOGIES FOR STRAIGHT, TALL AND UNIFORM FINS A...

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF

MICROELECTRONIC DEVICES INCLUDING HIGH ASPECT RATIO FEATURES