Etching the insulating layers by chemical or physical means

Industry

CPC
H01L21/311

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/311Etching the insulating layers by chemical or physical means

Industries

Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional memory device with doped semiconductor bridge str...
- Patent number 12,178,040
- Issue date Dec 24, 2024
- SanDisk Technologies LLC
- Ryousuke Itou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bevel etching method
- Patent number 12,176,218
- Issue date Dec 24, 2024
- NANYA TECHNOLOGY CORPORATION
- Sheng-Hui Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide composite as etch stop layer
- Patent number 12,176,247
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for processing substrate using plasma
- Patent number 12,176,185
- Issue date Dec 24, 2024
- Semes Co., Ltd.
- Min Sung Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of three-dimensional structures using grey-scale photolit...
- Patent number 12,174,548
- Issue date Dec 24, 2024
- ams AG
- Gerhard Eilmsteiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor using slurry
- Patent number 12,176,217
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Hung Liao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor manufacturing apparatus and method for manufacturing...
- Patent number 12,176,236
- Issue date Dec 24, 2024
- Kioxia Corporation
- Wu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for forming silicon-containing resist underlayer film a...
- Patent number 12,174,541
- Issue date Dec 24, 2024
- Shin-Etsu Chemical Co., Ltd.
- Tsutomu Ogihara
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Cyclic spin-on coating process for forming dielectric material
- Patent number 12,170,199
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Je-Ming Kuo
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Methods for fabricating semiconductor structures
- Patent number 12,170,205
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around device with trimmed channel and dipoled dielectric...
- Patent number 12,170,231
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad fabrication process for a semiconductor product
- Patent number 12,170,256
- Issue date Dec 17, 2024
- Texas Instruments Incorporated
- Sudtida Lavangkul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective passivation and selective deposition
- Patent number 12,170,197
- Issue date Dec 17, 2024
- ASM IP Holding B.V.
- Eva E. Tois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for cleaning high aspect ratio structures
- Patent number 12,170,196
- Issue date Dec 17, 2024
- Applied Materials, Inc.
- Schubert S. Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,170,288
- Issue date Dec 17, 2024
- Japan Display Inc.
- Yohei Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for advanced ion control for etching processes
- Patent number 12,165,872
- Issue date Dec 10, 2024
- Lam Research Corporation
- Zhongkui Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor mask reshaping using a sacrificial layer
- Patent number 12,165,878
- Issue date Dec 10, 2024
- Lam Research Corporation
- Zhongkui Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with air gap and method sealing the air gap
- Patent number 12,165,912
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Chang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,165,929
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for continuous atomic layer deposition
- Patent number 12,163,221
- Issue date Dec 10, 2024
- UChicago Argonne, LLC
- Jeffrey W. Elam
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing method for manufacturing semiconductor structure
- Patent number 12,165,851
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lun Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming ultra-shallow junction
- Patent number 12,165,876
- Issue date Dec 10, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jian Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for rotating substrates
- Patent number 12,165,907
- Issue date Dec 10, 2024
- Applied Materials, Inc.
- Giridhar Kamesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain contact structure
- Patent number 12,166,088
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanosheet channel-to-source and drain isolation
- Patent number 12,166,110
- Issue date Dec 10, 2024
- Adeia Semiconductor Solutions LLC
- Marc A. Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing conductive lines in a circuit
- Patent number 12,165,972
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hui Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked nanosheet gate-all-around device structures
- Patent number 12,166,042
- Issue date Dec 10, 2024
- International Business Machines Corporation
- Nicolas Loubet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor structure
- Patent number 12,165,910
- Issue date Dec 10, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
End point control in etching processes
- Patent number 12,165,936
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jui Fu Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element
- Patent number 12,163,058
- Issue date Dec 10, 2024
- Jae-Wan Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING TERMINATED PO...
- Publication number 20240427246
- Publication date Dec 26, 2024
- NISSAN CHEMICAL CORPORATION
- Tomotada HIROHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING CRITICAL DIMENSION OF PATTERNS GENERATED USING...
- Publication number 20240429053
- Publication date Dec 26, 2024
- Silicon Laboratories Inc.
- Jiye Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR IMPROVING RESIDUE FORMATION AFTER MANDREL REMOVAL
- Publication number 20240429059
- Publication date Dec 26, 2024
- Shanghai Huali Integrated Circuit Corporation
- Tianchen Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING DEVICE AND ETCHING METHOD THEREOF
- Publication number 20240429069
- Publication date Dec 26, 2024
- ZEUS CO., LTD.
- Seung Hoon LEE
- B08 - CLEANING
Information Patent Application
Contact Feature Through Heterogeneous Stacked Film and Methods of M...
- Publication number 20240429090
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jhen Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING PRECLEAN METHODS AND APPARATUS
- Publication number 20240429038
- Publication date Dec 26, 2024
- ASM IP HOLDING B.V.
- Chuang Wei
- B08 - CLEANING
Information Patent Application
SILICON ETCH WITH ORGANOCHLORIDE
- Publication number 20240429063
- Publication date Dec 26, 2024
- LAM RESEARCH CORPORATION
- Ilya PISKUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPRINT METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240427234
- Publication date Dec 26, 2024
- KIOXIA Corporation
- Kazuya FUKUHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, METHOD FOR SUBSTRATE PROCESSING, AN...
- Publication number 20240429075
- Publication date Dec 26, 2024
- KIOXIA Corporation
- Ryo ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INCREASED ETCH RATES OF SILICON-CONTAINING MATERIALS
- Publication number 20240429062
- Publication date Dec 26, 2024
- Applied Materials, Inc.
- Alok Ranjan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SILICON CARBIDE SUBSTRATE AND PREPARATION METHOD THEREFOR
- Publication number 20240426026
- Publication date Dec 26, 2024
- TJ INNOVATIVE SEMICONDUCTOR SUBSTRATE TECHNOLOGY CO., LTD.
- Fengwen MU
- C30 - CRYSTAL GROWTH
Information Patent Application
RESIST UNDERLAYER FILM-FORMING COMPOSITION
- Publication number 20240427238
- Publication date Dec 26, 2024
- NISSAN CHEMICAL CORPORATION
- Tetsuya KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING A PLANAR SEMICONDUCTOR SURFACE
- Publication number 20240429041
- Publication date Dec 26, 2024
- The Boeing Company
- Shanying Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240429052
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Sangjun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PATTERNS WITH DIFFERENT CRITICAL DIMENSIONS
- Publication number 20240429054
- Publication date Dec 26, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Patricia PIMENTA BARROS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO CREATE AIR GAPS
- Publication number 20240429091
- Publication date Dec 26, 2024
- LAM RESEARCH CORPORATION
- Patrick A. Van Cleemput
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF SELECTIVELY ETCHING SILICON NITRIDE
- Publication number 20240420962
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Doreen Wei Ying Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFICATION OF METAL-CONTAINING SURFACES IN HIGH ASPECT RATIO PLAS...
- Publication number 20240420963
- Publication date Dec 19, 2024
- LAM RESEARCH CORPORATION
- He Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITION IN HIGH ASPECT RATIO (HAR) FEATURES
- Publication number 20240420965
- Publication date Dec 19, 2024
- TOKYO ELECTRON LIMITED
- Shihsheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE SELF-ASSEMBLED MONOLAYER (SAM) REMOVAL
- Publication number 20240420996
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Jiajie Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240421213
- Publication date Dec 19, 2024
- UNITED MICROELECTRONICS CORP.
- Fu-Jung Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOW CELLS
- Publication number 20240418630
- Publication date Dec 19, 2024
- Illumina, Inc.
- Sahngki Hong
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240420961
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Seunghoon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRIP WITH BEVEL CLEANING
- Publication number 20240420964
- Publication date Dec 19, 2024
- LAM RESEARCH CORPORATION
- Leonid BELAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU ETCH AND INHIBITION IN PLASMA ENHANCED ATOMIC LAYER DEPOSITION
- Publication number 20240420934
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Bhaskar Soman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE PRECLEAN FOR BOTTOM-UP GAPFILL IN MEOL AND BEOL
- Publication number 20240420947
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Shiyu YUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICALLY SELECTIVE ADHESION AND STRENGTH PROMOTERS IN SEMICONDUCT...
- Publication number 20240419079
- Publication date Dec 19, 2024
- Geminatio, Inc.
- Brennan Peterson
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
ADDITIVE-CONTAINING SILICON-CONTAINING RESIST UNDERLAYER FILM FORMI...
- Publication number 20240419073
- Publication date Dec 19, 2024
- NISSAN CHEMICAL CORPORATION
- Shuhei SHIGAKI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
GAS TREATMENT METHOD AND GAS TREATMENT DEVICE
- Publication number 20240412978
- Publication date Dec 12, 2024
- Tokyo Electron Limited
- Kimihiko DEMICHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DRY ETCHING USING PLASMA
- Publication number 20240412979
- Publication date Dec 12, 2024
- Research & Business Foundation Sungkyunkwan University
- Geun Young YEOM
- H01 - BASIC ELECTRIC ELEMENTS

Etching the insulating layers by chemical or physical means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Three-dimensional memory device with doped semiconductor bridge str...

Bevel etching method

Metal oxide composite as etch stop layer

Apparatus and method for processing substrate using plasma

Formation of three-dimensional structures using grey-scale photolit...

Method for manufacturing a semiconductor using slurry

Semiconductor manufacturing apparatus and method for manufacturing...

Composition for forming silicon-containing resist underlayer film a...

Cyclic spin-on coating process for forming dielectric material

Methods for fabricating semiconductor structures

Gate-all-around device with trimmed channel and dipoled dielectric...

Contact pad fabrication process for a semiconductor product

Selective passivation and selective deposition

Methods and systems for cleaning high aspect ratio structures

Semiconductor device

Methods and systems for advanced ion control for etching processes

Semiconductor mask reshaping using a sacrificial layer

Semiconductor structure with air gap and method sealing the air gap

Semiconductor device and method

System for continuous atomic layer deposition

Plasma processing method for manufacturing semiconductor structure

Method for forming ultra-shallow junction

Apparatus for rotating substrates

Source/drain contact structure

Nanosheet channel-to-source and drain isolation

Method of manufacturing conductive lines in a circuit

Stacked nanosheet gate-all-around device structures

Manufacturing method for semiconductor structure

End point control in etching processes

Semiconductor element

Patents Applicationslast 30 patents

RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING TERMINATED PO...

METHOD FOR REDUCING CRITICAL DIMENSION OF PATTERNS GENERATED USING...

METHOD FOR IMPROVING RESIDUE FORMATION AFTER MANDREL REMOVAL

ETCHING DEVICE AND ETCHING METHOD THEREOF

Contact Feature Through Heterogeneous Stacked Film and Methods of M...

SEMICONDUCTOR PROCESSING PRECLEAN METHODS AND APPARATUS

SILICON ETCH WITH ORGANOCHLORIDE

IMPRINT METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SUBSTRATE PROCESSING APPARATUS, METHOD FOR SUBSTRATE PROCESSING, AN...

INCREASED ETCH RATES OF SILICON-CONTAINING MATERIALS

COMPOSITE SILICON CARBIDE SUBSTRATE AND PREPARATION METHOD THEREFOR

RESIST UNDERLAYER FILM-FORMING COMPOSITION

FORMING A PLANAR SEMICONDUCTOR SURFACE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR FORMING PATTERNS WITH DIFFERENT CRITICAL DIMENSIONS

METHOD TO CREATE AIR GAPS

METHODS OF SELECTIVELY ETCHING SILICON NITRIDE

MODIFICATION OF METAL-CONTAINING SURFACES IN HIGH ASPECT RATIO PLAS...

METHOD OF DEPOSITION IN HIGH ASPECT RATIO (HAR) FEATURES

SELECTIVE SELF-ASSEMBLED MONOLAYER (SAM) REMOVAL

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

FLOW CELLS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

STRIP WITH BEVEL CLEANING

IN-SITU ETCH AND INHIBITION IN PLASMA ENHANCED ATOMIC LAYER DEPOSITION

METAL OXIDE PRECLEAN FOR BOTTOM-UP GAPFILL IN MEOL AND BEOL

CHEMICALLY SELECTIVE ADHESION AND STRENGTH PROMOTERS IN SEMICONDUCT...

ADDITIVE-CONTAINING SILICON-CONTAINING RESIST UNDERLAYER FILM FORMI...

GAS TREATMENT METHOD AND GAS TREATMENT DEVICE

METHOD FOR DRY ETCHING USING PLASMA