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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/4828
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Patents Grants
last 30 patents
Information
Patent Grant
Method of forming a packaged semiconductor device having enhanced w...
Patent number
12,300,582
Issue date
May 13, 2025
Amkor Technology Singapore Holding Pte Ltd.
Pedro Joel Rivera-Marty
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Side-solderable leadless package
Patent number
12,293,960
Issue date
May 6, 2025
Semtech Corporation
Henry Descalzo Bathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip-chip package assembly
Patent number
12,266,631
Issue date
Apr 1, 2025
Texas Instruments Incorporated
Rafael Jose Lizares Guevara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frame and manufacturing method thereof
Patent number
12,243,811
Issue date
Mar 4, 2025
Dai Nippon Printing Co., Ltd.
Masahiro Nagata
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Packaged electronic device with film isolated power stack
Patent number
12,243,809
Issue date
Mar 4, 2025
Texas Instruments Incorporated
Tianyi Luo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with wettable flank and related methods
Patent number
12,243,810
Issue date
Mar 4, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Hui Min Ler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacture of semiconductor de...
Patent number
12,237,248
Issue date
Feb 25, 2025
AOI Electronics Co., Ltd.
Katsuhiro Takao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead stabilization in semiconductor packages
Patent number
12,211,774
Issue date
Jan 28, 2025
STMicroelectronics, Inc.
Ela Mia Cadag
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pre-molded leadframes in semiconductor devices
Patent number
12,191,273
Issue date
Jan 7, 2025
Texas Instruments Incorporated
Sreenivasan K. Koduri
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframes in semiconductor devices
Patent number
12,183,703
Issue date
Dec 31, 2024
Texas Instruments Incorporated
Sreenivasan K. Koduri
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with wettable flank
Patent number
12,176,272
Issue date
Dec 24, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Hui Min Ler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor devices and corresponding sem...
Patent number
12,165,880
Issue date
Dec 10, 2024
STMicroelectronics S.r.l.
Fulvio Vittorio Fontana
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices
Patent number
12,148,622
Issue date
Nov 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Lien Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method forming the same
Patent number
12,131,973
Issue date
Oct 29, 2024
Vanguard International Semiconductor Corporation
Hsiu-Mei Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages with roughened conductive components
Patent number
12,119,289
Issue date
Oct 15, 2024
Texas Instruments Incorporated
Yee Gin Tea
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Molded packaging for wide band gap semiconductor devices
Patent number
12,087,677
Issue date
Sep 10, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Maria Clemens Ypil Quinones
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and integrated circuit in hybrid row height st...
Patent number
12,074,069
Issue date
Aug 27, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Jerry Chang-Jui Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronics package assemblies and processes for making
Patent number
12,074,099
Issue date
Aug 27, 2024
Materion Corporation
Ramesh Kothandapani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with wire bond and method for preparing the same
Patent number
12,027,480
Issue date
Jul 2, 2024
NANYA TECHNOLOGY CORPORATION
Tse-Yao Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heat dissipating substrate for semiconductor and preparation method...
Patent number
11,984,326
Issue date
May 14, 2024
IMH INC.
Jong Eun Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a molded substrate electronic package and structure
Patent number
11,961,794
Issue date
Apr 16, 2024
Amikor Technology Singapore Holding Pte. Ltd.
Won Bae Bang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic component apparatus having a first lead frame and a seco...
Patent number
11,955,410
Issue date
Apr 9, 2024
Shinko Electric Industries Co., Ltd.
Yukinori Hatori
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Compact leadframe package
Patent number
11,948,868
Issue date
Apr 2, 2024
STMicroelectronics, Inc.
Jefferson Talledo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
11,948,869
Issue date
Apr 2, 2024
Kabushiki Kaisha Toshiba
Naoki Okawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit die pad cavity
Patent number
11,942,448
Issue date
Mar 26, 2024
Texas Instruments Incorporated
Bo-Hsun Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect structures including a fin structure and a metal cap
Patent number
11,929,314
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chun-Hsien Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a semiconductor device
Patent number
11,923,273
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Shih-Wei Peng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Land structure for semiconductor package and method therefor
Patent number
11,908,779
Issue date
Feb 20, 2024
Amkor Technology Singapore Holding Pte Ltd.
Kyoung Yeon Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with a transmitting insulating element
Patent number
11,894,321
Issue date
Feb 6, 2024
Rohm Co., Ltd.
Yoshizo Osumi
B60 - VEHICLES IN GENERAL
Information
Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
Patent number
11,887,916
Issue date
Jan 30, 2024
Amkor Technology Singapore Holding Pte Ltd.
Hyeong Il Jeon
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Multi-Layered Metal Frame Power Package
Publication number
20250183130
Publication date
Jun 5, 2025
Ferric Inc.
Noah Sturcken
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEAD STABILIZATION IN SEMICONDUCTOR PACKAGES
Publication number
20250183135
Publication date
Jun 5, 2025
STMICROELECTRONICS, INC.
Ela Mia CADAG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEAD STABILIZATION IN SEMICONDUCTOR PACKAGES
Publication number
20250183136
Publication date
Jun 5, 2025
STMICROELECTRONICS, INC.
Ela Mia CADAG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEAD FRAME AND MANUFACTURING METHOD THEREOF
Publication number
20250174530
Publication date
May 29, 2025
DAI NIPPON PRINTING CO., LTD.
Masahiro NAGATA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...
Publication number
20250167080
Publication date
May 22, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Pedro Joel Rivera-Marty
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS O...
Publication number
20250149412
Publication date
May 8, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Darrell D. TRUHITTE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
Publication number
20250125228
Publication date
Apr 17, 2025
STMicroelectronics International N.V.
Guendalina CATALANO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK
Publication number
20250118635
Publication date
Apr 10, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Hui Min LER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
Publication number
20250105024
Publication date
Mar 27, 2025
STMicroelectronics S.r.l
Fulvio Vittorio FONTANA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
Publication number
20250062298
Publication date
Feb 20, 2025
JCET Group Co., Ltd.
Yaojian LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IC PACKAGE WITH IMMERSION TIN ON FLANK
Publication number
20250046621
Publication date
Feb 6, 2025
TEXAS INSTRUMENTS INCORPORATED
Nazila Dadvand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20250022766
Publication date
Jan 16, 2025
Vanguard International Semiconductor Corporation
Hsiu-Mei YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING PRE-MO...
Publication number
20250014982
Publication date
Jan 9, 2025
STMicroelectronics International N.V.
Mauro MAZZOLA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING LEAD FRAME
Publication number
20250006508
Publication date
Jan 2, 2025
HAESUNG DS CO., LTD.
Gwang Ryeol PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES WITH ROUGHENED CONDUCTIVE COMPONENTS
Publication number
20240429134
Publication date
Dec 26, 2024
TEXAS INSTRUMENTS INCORPORATED
Yee Gin TEA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES
Publication number
20240429136
Publication date
Dec 26, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Maria Clemens Ypil QUINONES
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
Publication number
20240413030
Publication date
Dec 12, 2024
NXP USA, Inc.
You Ge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEAD FRAME AND MANUFACTURING METHOD THEREOF
Publication number
20240404928
Publication date
Dec 5, 2024
DAI NIPPON PRINTING CO., LTD.
Masahiro NAGATA
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
INTEGRATED CIRCUIT IN HYBRID ROW HEIGHT STRUCTURE
Publication number
20240395622
Publication date
Nov 28, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Jerry Chang-Jui KAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING A DIE PAD AND AN ENCAPSULATION WITH TR...
Publication number
20240387305
Publication date
Nov 21, 2024
INFINEON TECHNOLOGIES AG
Meng How Chong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES
Publication number
20240371645
Publication date
Nov 7, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Lien Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEAD FRAME SUBSTRATE HAVING CIRCUITRY ON DUAL DIELECTRIC LAYERS AND...
Publication number
20240363499
Publication date
Oct 31, 2024
BRIDGE SEMICONDUCTOR CORP.
Charles W. C. LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTR...
Publication number
20240355714
Publication date
Oct 24, 2024
STMicroelectronics International N.V.
Mauro MAZZOLA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240355639
Publication date
Oct 24, 2024
Jentech Precision Industrial Co., LTD.
Chin-Jui YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE IN HYBRID ROW HEIGHT STRUCTURE
Publication number
20240332083
Publication date
Oct 3, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Jerry Chang-Jui KAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEAD FRAME AND SEMICONDUCTOR DEVICE
Publication number
20240332140
Publication date
Oct 3, 2024
Shinko Electric Industries Co., Ltd.
Kesayuki SONEHARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL FRAME CHIP EMBEDDED PACKAGING SUBSTRATE AND MANUFACTURING MET...
Publication number
20240312879
Publication date
Sep 19, 2024
Zhuhai ACCESS Semiconductor Co., Ltd
XIANMING CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING METHOD
Publication number
20240297101
Publication date
Sep 5, 2024
RICHTEK TECHNOLOGY CORPORATION
Yu-Lin Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE-ON-FOIL WITH METAL PATTERNED COMPONENTS FORMED THEREIN AN...
Publication number
20240290708
Publication date
Aug 29, 2024
LUX SEMICONDUCTORS, INC.
Chad B. MOORE
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Application
INTEGRATED CIRCUIT DIE PAD CAVITY
Publication number
20240274569
Publication date
Aug 15, 2024
TEXAS INSTRUMENTS INCORPORATED
Bo-Hsun Pan
H01 - BASIC ELECTRIC ELEMENTS