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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/4828Etching

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,334,420
- Issue date Jun 17, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Hyeong Il Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a packaged semiconductor device having enhanced w...
- Patent number 12,300,582
- Issue date May 13, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Side-solderable leadless package
- Patent number 12,293,960
- Issue date May 6, 2025
- Semtech Corporation
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip package assembly
- Patent number 12,266,631
- Issue date Apr 1, 2025
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and manufacturing method thereof
- Patent number 12,243,811
- Issue date Mar 4, 2025
- Dai Nippon Printing Co., Ltd.
- Masahiro Nagata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Packaged electronic device with film isolated power stack
- Patent number 12,243,809
- Issue date Mar 4, 2025
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with wettable flank and related methods
- Patent number 12,243,810
- Issue date Mar 4, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hui Min Ler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacture of semiconductor de...
- Patent number 12,237,248
- Issue date Feb 25, 2025
- AOI Electronics Co., Ltd.
- Katsuhiro Takao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead stabilization in semiconductor packages
- Patent number 12,211,774
- Issue date Jan 28, 2025
- STMicroelectronics, Inc.
- Ela Mia Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded leadframes in semiconductor devices
- Patent number 12,191,273
- Issue date Jan 7, 2025
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframes in semiconductor devices
- Patent number 12,183,703
- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with wettable flank
- Patent number 12,176,272
- Issue date Dec 24, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hui Min Ler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and corresponding sem...
- Patent number 12,165,880
- Issue date Dec 10, 2024
- STMicroelectronics S.r.l.
- Fulvio Vittorio Fontana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 12,148,622
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method forming the same
- Patent number 12,131,973
- Issue date Oct 29, 2024
- Vanguard International Semiconductor Corporation
- Hsiu-Mei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with roughened conductive components
- Patent number 12,119,289
- Issue date Oct 15, 2024
- Texas Instruments Incorporated
- Yee Gin Tea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded packaging for wide band gap semiconductor devices
- Patent number 12,087,677
- Issue date Sep 10, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Clemens Ypil Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and integrated circuit in hybrid row height st...
- Patent number 12,074,069
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jerry Chang-Jui Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package assemblies and processes for making
- Patent number 12,074,099
- Issue date Aug 27, 2024
- Materion Corporation
- Ramesh Kothandapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with wire bond and method for preparing the same
- Patent number 12,027,480
- Issue date Jul 2, 2024
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipating substrate for semiconductor and preparation method...
- Patent number 11,984,326
- Issue date May 14, 2024
- IMH INC.
- Jong Eun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a molded substrate electronic package and structure
- Patent number 11,961,794
- Issue date Apr 16, 2024
- Amikor Technology Singapore Holding Pte. Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component apparatus having a first lead frame and a seco...
- Patent number 11,955,410
- Issue date Apr 9, 2024
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact leadframe package
- Patent number 11,948,868
- Issue date Apr 2, 2024
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,948,869
- Issue date Apr 2, 2024
- Kabushiki Kaisha Toshiba
- Naoki Okawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die pad cavity
- Patent number 11,942,448
- Issue date Mar 26, 2024
- Texas Instruments Incorporated
- Bo-Hsun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures including a fin structure and a metal cap
- Patent number 11,929,314
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 11,923,273
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land structure for semiconductor package and method therefor
- Patent number 11,908,779
- Issue date Feb 20, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Kyoung Yeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a transmitting insulating element
- Patent number 11,894,321
- Issue date Feb 6, 2024
- Rohm Co., Ltd.
- Yoshizo Osumi
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING ROUNDED COMPONENTS AND RELATED MANU...
- Publication number 20250192005
- Publication date Jun 12, 2025
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layered Metal Frame Power Package
- Publication number 20250183130
- Publication date Jun 5, 2025
- Ferric Inc.
- Noah Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD STABILIZATION IN SEMICONDUCTOR PACKAGES
- Publication number 20250183135
- Publication date Jun 5, 2025
- STMICROELECTRONICS, INC.
- Ela Mia CADAG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD STABILIZATION IN SEMICONDUCTOR PACKAGES
- Publication number 20250183136
- Publication date Jun 5, 2025
- STMICROELECTRONICS, INC.
- Ela Mia CADAG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND MANUFACTURING METHOD THEREOF
- Publication number 20250174530
- Publication date May 29, 2025
- DAI NIPPON PRINTING CO., LTD.
- Masahiro NAGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...
- Publication number 20250167080
- Publication date May 22, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS O...
- Publication number 20250149412
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Darrell D. TRUHITTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20250125228
- Publication date Apr 17, 2025
- STMicroelectronics International N.V.
- Guendalina CATALANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK
- Publication number 20250118635
- Publication date Apr 10, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hui Min LER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20250105024
- Publication date Mar 27, 2025
- STMicroelectronics S.r.l
- Fulvio Vittorio FONTANA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20250062298
- Publication date Feb 20, 2025
- JCET Group Co., Ltd.
- Yaojian LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE WITH IMMERSION TIN ON FLANK
- Publication number 20250046621
- Publication date Feb 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250022766
- Publication date Jan 16, 2025
- Vanguard International Semiconductor Corporation
- Hsiu-Mei YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING PRE-MO...
- Publication number 20250014982
- Publication date Jan 9, 2025
- STMicroelectronics International N.V.
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LEAD FRAME
- Publication number 20250006508
- Publication date Jan 2, 2025
- HAESUNG DS CO., LTD.
- Gwang Ryeol PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH ROUGHENED CONDUCTIVE COMPONENTS
- Publication number 20240429134
- Publication date Dec 26, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yee Gin TEA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES
- Publication number 20240429136
- Publication date Dec 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Clemens Ypil QUINONES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
- Publication number 20240413030
- Publication date Dec 12, 2024
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND MANUFACTURING METHOD THEREOF
- Publication number 20240404928
- Publication date Dec 5, 2024
- DAI NIPPON PRINTING CO., LTD.
- Masahiro NAGATA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATED CIRCUIT IN HYBRID ROW HEIGHT STRUCTURE
- Publication number 20240395622
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jerry Chang-Jui KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A DIE PAD AND AN ENCAPSULATION WITH TR...
- Publication number 20240387305
- Publication date Nov 21, 2024
- INFINEON TECHNOLOGIES AG
- Meng How Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20240371645
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME SUBSTRATE HAVING CIRCUITRY ON DUAL DIELECTRIC LAYERS AND...
- Publication number 20240363499
- Publication date Oct 31, 2024
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTR...
- Publication number 20240355714
- Publication date Oct 24, 2024
- STMicroelectronics International N.V.
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240355639
- Publication date Oct 24, 2024
- Jentech Precision Industrial Co., LTD.
- Chin-Jui YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE IN HYBRID ROW HEIGHT STRUCTURE
- Publication number 20240332083
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jerry Chang-Jui KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND SEMICONDUCTOR DEVICE
- Publication number 20240332140
- Publication date Oct 3, 2024
- Shinko Electric Industries Co., Ltd.
- Kesayuki SONEHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FRAME CHIP EMBEDDED PACKAGING SUBSTRATE AND MANUFACTURING MET...
- Publication number 20240312879
- Publication date Sep 19, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- XIANMING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHOD
- Publication number 20240297101
- Publication date Sep 5, 2024
- RICHTEK TECHNOLOGY CORPORATION
- Yu-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-ON-FOIL WITH METAL PATTERNED COMPONENTS FORMED THEREIN AN...
- Publication number 20240290708
- Publication date Aug 29, 2024
- LUX SEMICONDUCTORS, INC.
- Chad B. MOORE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor devices and methods of manufacturing semiconductor de...

Method of forming a packaged semiconductor device having enhanced w...

Side-solderable leadless package

Flip-chip package assembly

Lead frame and manufacturing method thereof

Packaged electronic device with film isolated power stack

Semiconductor package with wettable flank and related methods

Semiconductor device and method for manufacture of semiconductor de...

Lead stabilization in semiconductor packages

Pre-molded leadframes in semiconductor devices

Leadframes in semiconductor devices

Semiconductor package with wettable flank

Method of manufacturing semiconductor devices and corresponding sem...

Semiconductor devices

Semiconductor device and method forming the same

Semiconductor packages with roughened conductive components

Molded packaging for wide band gap semiconductor devices

Semiconductor device and integrated circuit in hybrid row height st...

Microelectronics package assemblies and processes for making

Semiconductor device with wire bond and method for preparing the same

Heat dissipating substrate for semiconductor and preparation method...

Method of forming a molded substrate electronic package and structure

Electronic component apparatus having a first lead frame and a seco...

Compact leadframe package

Semiconductor device and method for manufacturing the same

Integrated circuit die pad cavity

Interconnect structures including a fin structure and a metal cap

Method of manufacturing a semiconductor device

Land structure for semiconductor package and method therefor

Semiconductor device with a transmitting insulating element

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES INCLUDING ROUNDED COMPONENTS AND RELATED MANU...

Multi-Layered Metal Frame Power Package

LEAD STABILIZATION IN SEMICONDUCTOR PACKAGES

LEAD STABILIZATION IN SEMICONDUCTOR PACKAGES

LEAD FRAME AND MANUFACTURING METHOD THEREOF

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS O...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

PACKAGE STRUCTURE AND METHOD FOR FORMING SAME

IC PACKAGE WITH IMMERSION TIN ON FLANK

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING PRE-MO...

METHOD OF MANUFACTURING LEAD FRAME

SEMICONDUCTOR PACKAGES WITH ROUGHENED CONDUCTIVE COMPONENTS

MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES

PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING

LEAD FRAME AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT IN HYBRID ROW HEIGHT STRUCTURE

SEMICONDUCTOR PACKAGE HAVING A DIE PAD AND AN ENCAPSULATION WITH TR...

SEMICONDUCTOR DEVICES

LEAD FRAME SUBSTRATE HAVING CIRCUITRY ON DUAL DIELECTRIC LAYERS AND...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTR...

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE IN HYBRID ROW HEIGHT STRUCTURE

LEAD FRAME AND SEMICONDUCTOR DEVICE

METAL FRAME CHIP EMBEDDED PACKAGING SUBSTRATE AND MANUFACTURING MET...

PACKAGING METHOD

SUBSTRATE-ON-FOIL WITH METAL PATTERNED COMPONENTS FORMED THEREIN AN...