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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/4828
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Patents Grants
last 30 patents
Information
Patent Grant
Method of forming a molded substrate electronic package and structure
Patent number
11,961,794
Issue date
Apr 16, 2024
Amikor Technology Singapore Holding Pte. Ltd.
Won Bae Bang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic component apparatus having a first lead frame and a seco...
Patent number
11,955,410
Issue date
Apr 9, 2024
Shinko Electric Industries Co., Ltd.
Yukinori Hatori
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Compact leadframe package
Patent number
11,948,868
Issue date
Apr 2, 2024
STMicroelectronics, Inc.
Jefferson Talledo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
11,948,869
Issue date
Apr 2, 2024
Kabushiki Kaisha Toshiba
Naoki Okawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit die pad cavity
Patent number
11,942,448
Issue date
Mar 26, 2024
Texas Instruments Incorporated
Bo-Hsun Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect structures including a fin structure and a metal cap
Patent number
11,929,314
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chun-Hsien Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a semiconductor device
Patent number
11,923,273
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Shih-Wei Peng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Land structure for semiconductor package and method therefor
Patent number
11,908,779
Issue date
Feb 20, 2024
Amkor Technology Singapore Holding Pte Ltd.
Kyoung Yeon Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with a transmitting insulating element
Patent number
11,894,321
Issue date
Feb 6, 2024
Rohm Co., Ltd.
Yoshizo Osumi
B60 - VEHICLES IN GENERAL
Information
Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
Patent number
11,887,916
Issue date
Jan 30, 2024
Amkor Technology Singapore Holding Pte Ltd.
Hyeong Il Jeon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High voltage semiconductor device lead frame and method of fabrication
Patent number
11,881,445
Issue date
Jan 23, 2024
Texas Instruments Incorporated
Enis Tuncer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and clip with a die attach
Patent number
11,869,830
Issue date
Jan 9, 2024
Infineon Technologies AG
Michael Stadler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package with elevated lead and structure extending vertically from...
Patent number
11,862,582
Issue date
Jan 2, 2024
Infineon Technologies AG
Thorsten Meyer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a packaged semiconductor device having enhanced w...
Patent number
11,862,539
Issue date
Jan 2, 2024
Amkor Technology Singapore Holding Pte Ltd.
Pedro Joel Rivera-Marty
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method
Patent number
11,854,814
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Lien Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing circuit board
Patent number
11,854,830
Issue date
Dec 26, 2023
HAESUNG DS CO., LTD.
Dong Jin Yoon
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Etch profile control of interconnect structures
Patent number
11,854,873
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Yu Lun Ke
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadless leadframe and semiconductor device package therefrom
Patent number
11,855,001
Issue date
Dec 26, 2023
Texas Instruments Incorporated
Mohammad Waseem Hussain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having die pad with cooling fins
Patent number
11,848,256
Issue date
Dec 19, 2023
STMicroelectronics, Inc.
Jefferson Talledo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframe with delamination resistant feature
Patent number
11,837,532
Issue date
Dec 5, 2023
Texas Instruments Incorporated
Amirul Afiq Bin Hud
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with wire bond and method for preparing the same
Patent number
11,830,836
Issue date
Nov 28, 2023
NANYA TECHNOLOGY CORPORATION
Tse-Yao Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High I/O density flip-chip QFN
Patent number
11,817,375
Issue date
Nov 14, 2023
Texas Instruments Incorporated
Osvaldo Jorge Lopez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Side-solderable leadless package
Patent number
11,810,842
Issue date
Nov 7, 2023
Semtech Corporation
Henry Descalzo Bathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit in hybrid row height structure
Patent number
11,791,213
Issue date
Oct 17, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Jerry Chang-Jui Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frame and semiconductor device
Patent number
11,756,866
Issue date
Sep 12, 2023
Shinko Electric Industries Co., Ltd.
Kentaro Kaneko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Tube lamp with leadframe
Patent number
11,757,081
Issue date
Sep 12, 2023
LEDVANCE GmbH
Bernhard Rieder
F21 - LIGHTING
Information
Patent Grant
Laser devices using a semipolar plane
Patent number
11,749,969
Issue date
Sep 5, 2023
KYOCERA SLD Laser, Inc.
James W. Raring
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Roughened conductive components
Patent number
11,715,678
Issue date
Aug 1, 2023
Texas Instruments Incorporated
Yee Gin Tea
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframe with pad anchoring members and method of forming the same
Patent number
11,699,667
Issue date
Jul 11, 2023
STMicroelectronics, Inc.
Jefferson Talledo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip chip curved sidewall self-alignment features for substrate and...
Patent number
11,658,099
Issue date
May 23, 2023
Amkor Technology Singapore Holding Pte Ltd.
Marc Alan Mangrum
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
COMMON LEAD FRAME, SEMICONDUCTOR DEVICE, METHOD FOR FORMING A COMMO...
Publication number
20240136258
Publication date
Apr 25, 2024
RENESAS ELECTRONICS CORPORATION
Junichi NITA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20240120262
Publication date
Apr 11, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Hyeong Il JEON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ISOLATED METAL CLIPS WITH STRUCTURAL BRIDGE
Publication number
20240096775
Publication date
Mar 21, 2024
Analog Devices, Inc.
Hien Minh Pham
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20240096766
Publication date
Mar 21, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Hyeong Il JEON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGING METHOD
Publication number
20240087912
Publication date
Mar 14, 2024
SiPLP Microelectronics (Chongqing) Limited
Weiyuan YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20240063096
Publication date
Feb 22, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Shigeki TANAKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH WIRE BOND AND METHOD FOR PREPARING THE SAME
Publication number
20240047391
Publication date
Feb 8, 2024
NANYA TECHNOLOGY CORPORATION
TSE-YAO HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT IN HYBRID ROW HEIGHT STRUCTURE
Publication number
20240030069
Publication date
Jan 25, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Jerry Chang-Jui KAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEAD FRAME AND MANUFACTURING METHOD THEREOF
Publication number
20240030114
Publication date
Jan 25, 2024
DAI NIPPON PRINTING CO., LTD.
Masahiro NAGATA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Side-Solderable Leadless Package
Publication number
20240021504
Publication date
Jan 18, 2024
SEMTECH CORPORATION
Henry Descalzo Bathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEADFRAME WITH PAD ANCHORING MEMBERS AND METHOD OF FORMING THE SAME
Publication number
20230420390
Publication date
Dec 28, 2023
STMICROELECTRONICS, INC.
Jefferson Sismundo TALLEDO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FORMING THE SAME
Publication number
20230420328
Publication date
Dec 28, 2023
Vanguard International Semiconductor Corporation
Hsiu-Mei YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT HAVING A ROUTABLE LEADFRAME
Publication number
20230411170
Publication date
Dec 21, 2023
TEXAS INSTRUMENTS INCORPORATED
BRADLEY GLASSCOCK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ETCH PROFILE CONTROL OF INTERCONNECT STRUCTURES
Publication number
20230377963
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu Lun KE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT IN HYBRID ROW HEIGHT STRUCTURE
Publication number
20230377976
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Jerry Chang-Jui KAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP CHIP SELF-ALIGNMENT FEATURES FOR SUBSTRATE AND LEADFRAME APPLI...
Publication number
20230369182
Publication date
Nov 16, 2023
Amkor Technology Singapore Holding Pte. Ltd.
Marc Alan Mangrum
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...
Publication number
20230360927
Publication date
Nov 9, 2023
STMicroelectronics S.r.l
Fulvio Vittorio Fontana
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Devices
Publication number
20230352308
Publication date
Nov 2, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Lien Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE SUBSTRATE MANUFACTURING METHOD
Publication number
20230326765
Publication date
Oct 12, 2023
Zhuhai ACCESS Semiconductor Co., Ltd
Xianming CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ROUGHENED CONDUCTIVE COMPONENTS
Publication number
20230317569
Publication date
Oct 5, 2023
TEXAS INSTRUMENTS INCORPORATED
Yee Gin TEA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE,...
Publication number
20230290710
Publication date
Sep 14, 2023
Sony Semiconductor Solutions Corporation
KOHYOH HOSOKAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Packaged Electronic Device With Film Isolated Power Stack
Publication number
20230268253
Publication date
Aug 24, 2023
TEXAS INSTRUMENTS INCORPORATED
Tianyi Luo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Flip-Chip Package Assembly
Publication number
20230260958
Publication date
Aug 17, 2023
TEXAS INSTRUMENTS INCORPORATED
Rafael Jose Lizares Guevara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-Layered Metal Frame Power Package
Publication number
20230215615
Publication date
Jul 6, 2023
Ferric Inc.
Michael Lekas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE ATTACH ADHESIVE-READY LEAD FRAME DESIGN
Publication number
20230197575
Publication date
Jun 22, 2023
TEXAS INSTRUMENTS INCORPORATED
John Carlo Molina
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEAD FRAME, METHOD OF MAKING LEAD FRAME, SEMICONDUCTOR APPARATUS, A...
Publication number
20230197580
Publication date
Jun 22, 2023
Shinko Electric Industries Co., Ltd.
Shintaro HAYASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT FOR IC PACKAGE
Publication number
20230170285
Publication date
Jun 1, 2023
TEXAS INSTRUMENTS INCORPORATED
Ruby Ann Merto Camenforte
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR MANUFACTURING THEREOF
Publication number
20230117806
Publication date
Apr 20, 2023
INFINEON TECHNOLOGIES AG
Thorsten MEYER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE QFN PACKAGE AND METHOD OF MAKING THEREOF
Publication number
20230115182
Publication date
Apr 13, 2023
NXP USA, Inc.
Meng Kong Lye
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH WIRE BOND AND METHOD FOR PREPARING THE SAME
Publication number
20230106386
Publication date
Apr 6, 2023
NANYA TECHNOLOGY CORPORATION
TSE-YAO HUANG
H01 - BASIC ELECTRIC ELEMENTS