External configuration of printed circuit board adapted for heat dissipation

Industry

CPC
H05K1/0209

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0209External configuration of printed circuit board adapted for heat dissipation

Industries

Patents Grantslast 30 patents

Information Patent Grant
Printing apparatus
- Patent number 12,145,382
- Issue date Nov 19, 2024
- Seiko Epson Corporation
- Dai Nozawa
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Electronic device including shielding member and heat radiating str...
- Patent number 12,150,238
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Wansang Ryu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Composite phase change material, application method of composite ph...
- Patent number 12,134,727
- Issue date Nov 5, 2024
- DONGGUAN NVT TECHNOLOGY LIMITED
- Hao Wu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electronic equipment
- Patent number 12,127,332
- Issue date Oct 22, 2024
- Sony Interactive Entertainment Inc.
- Yuta Tamaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,114,417
- Issue date Oct 8, 2024
- Sumitomo Bakelite Co., Ltd.
- Nobuo Tagashira
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board using thermocouple to dissipate generated heat and me...
- Patent number 12,101,871
- Issue date Sep 24, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Huan-Yu He
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip heat dissipation structure, chip structure, circuit board and...
- Patent number 12,100,639
- Issue date Sep 24, 2024
- BITMAIN TECHNOLOGIES INC.
- Dan Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of insulated metal substrate
- Patent number 12,096,569
- Issue date Sep 17, 2024
- Jentech Precision Industrial Co., LTD.
- Chun-Ta Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of bimetals in a heat sink to benefit heat transfer from high t...
- Patent number 12,074,081
- Issue date Aug 27, 2024
- Cisco Technology, Inc.
- Madeline Marie Roemer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Covering film, and circuit board and manufacturing method
- Patent number 12,048,084
- Issue date Jul 23, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Hsiao-Ting Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power electronics cooling assemblies and methods for making the same
- Patent number 12,048,085
- Issue date Jul 23, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and cooling device with fan blade and related method
- Patent number 12,031,553
- Issue date Jul 9, 2024
- L3HARRIS TECHNOLOGIES, INC.
- Charles Weirick
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Display device having a display panel including a member for induci...
- Patent number 12,032,404
- Issue date Jul 9, 2024
- Samsung Display Co., Ltd.
- So Young Yeo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power tools with high-emissivity heat sinks
- Patent number 12,017,336
- Issue date Jun 25, 2024
- Milwaukee Electric Tool Corporation
- Steven L C B Hartig
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Power supply apparatus
- Patent number 12,022,606
- Issue date Jun 25, 2024
- TDK-Lambda UK Limited
- Alex Knill
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and electronic device system
- Patent number 12,022,174
- Issue date Jun 25, 2024
- Canon Kabushiki Kaisha
- Shinji Obana
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Display device
- Patent number 12,007,817
- Issue date Jun 11, 2024
- Samsung Display Co., Ltd.
- Yeon-Sun Na
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Angled faceplates for a network element
- Patent number 11,985,454
- Issue date May 14, 2024
- Ciena Corporation
- Simon J. E. Shearman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Indium-based interface structures, apparatus, and methods for formi...
- Patent number 11,985,758
- Issue date May 14, 2024
- L3 Technologies, Inc.
- Matthew J. Spitzner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assemblies having embedded passive heat pipes and associ...
- Patent number 11,985,759
- Issue date May 14, 2024
- Eagle Technology, LLC
- Jason Thompson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Monolithic Pstages and methods for voltage regulators
- Patent number 11,979,978
- Issue date May 7, 2024
- Dell Products L.P.
- Merle Wood
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including antenna
- Patent number 11,963,290
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Jongwoo Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector and method for manufacturing same
- Patent number 11,956,886
- Issue date Apr 9, 2024
- I-PEX Inc.
- Yoichi Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Internal architecture of a computing device
- Patent number 11,950,354
- Issue date Apr 2, 2024
- Apple Inc.
- Kristopher P. Laurent
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Battery management system circuit
- Patent number 11,950,353
- Issue date Apr 2, 2024
- LG ENERGY SOLUTION, LTD.
- Ki Young Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly heat-dissipating flexible printed circuit board (GFPCB), man...
- Patent number 11,937,364
- Issue date Mar 19, 2024
- SOLUETA
- Seong Hwan Jung
- B32 - LAYERED PRODUCTS
Information Patent Grant
Camera module, spacer component, and method for producing camera mo...
- Patent number 11,930,258
- Issue date Mar 12, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hirofumi Owaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, electronic device and electronic module
- Patent number 11,930,586
- Issue date Mar 12, 2024
- Kyocera Corporation
- Toshiyuki Hamachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low cost panel AESA with thermal management
- Patent number 11,917,746
- Issue date Feb 27, 2024
- Raytheon Company
- Miroslav Micovic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power device assemblies having embedded PCBS and enhanced cooling a...
- Patent number 11,910,521
- Issue date Feb 20, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
THIN FILM CIRCUIT BOARD
- Publication number 20240389224
- Publication date Nov 21, 2024
- Chipbond Technology Corporation
- Kung-Tzu Tu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLIES WITH ALUMINUM PCB SUBSTRATES IN HO...
- Publication number 20240373543
- Publication date Nov 7, 2024
- GUANGZHOU ON-BRIGHT ELECTRONICS CO., LTD.
- XIAOKUI CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL SOLUTIONS FOR COOLING ELECTRONIC DEVICES
- Publication number 20240314921
- Publication date Sep 19, 2024
- Intel Corporation
- Jeff Ku
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
Printed Circuit Board And Method For Soldering A Chip Housing In A...
- Publication number 20240292514
- Publication date Aug 29, 2024
- LISA DRAXLMAIER GMBH
- Andreas Brinkmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT-DISSIPATING CIRCUIT BOARD, HEAT-DISSIPATING MEMBER, AND PRODUC...
- Publication number 20240268022
- Publication date Aug 8, 2024
- NOF Corporation
- Toshinobu FUJIMURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTRONIC ASSEMBLIES HAVING EMBEDDED PASSIVE HEAT PIPES AND ASSOCI...
- Publication number 20240260169
- Publication date Aug 1, 2024
- Eagle Technology, LLC
- JASON THOMPSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BIOPOLYMER-BASED ELECTROMAGENTIC INTERFERRENCE SHIELDING MATERIALS
- Publication number 20240237319
- Publication date Jul 11, 2024
- Software Defined Technologies, Inc.
- Michael M. Salour
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME
- Publication number 20240237189
- Publication date Jul 11, 2024
- Meiko Electronics Co., Ltd.
- Tohru MATSUMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DRIVING CHIP ACCOMMODATING CIRCUIT BOARD AND DISPLAY DEVICE HAVING...
- Publication number 20240237222
- Publication date Jul 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- HYEONJI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR AND METHOD FOR MANUFACTURING SAME
- Publication number 20240215148
- Publication date Jun 27, 2024
- I-PEX Inc.
- Yoichi HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240215202
- Publication date Jun 27, 2024
- TMY Technology Inc.
- Pei-Hung Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING OF ULTRASOUND ENERGIZERS MOUNTED ON PRINTED CIRCUIT BOARDS
- Publication number 20240196514
- Publication date Jun 13, 2024
- Sofwave Medical Ltd.
- Ariel SVERDLIK
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
THERMALLY DISSIPATIVE ELECTROMAGNETIC INTERFERENCE SHIELD OR COVER...
- Publication number 20240196578
- Publication date Jun 13, 2024
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Sean P. Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD FOR PHASED ARRAY ANTENNA TRANSCEIVER ASSEMBLY...
- Publication number 20240179852
- Publication date May 30, 2024
- SHENNAN CIRCUITS CO.,LTD.
- Li CHEN
- G01 - MEASURING TESTING
Information Patent Application
Flexible Polytetrafluoroethylene Substrate With Electrical Circuit...
- Publication number 20240165644
- Publication date May 23, 2024
- Bahareh MARZBANRAD
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
MOLDED ELECTRONIC ASSEMBLY
- Publication number 20240164008
- Publication date May 16, 2024
- Industrial Technology Research Institute
- Li-Wei Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIOPOLYMER-BASED ELECTROMAGENTIC INTERFERRENCE SHIELDING MATERIALS
- Publication number 20240138132
- Publication date Apr 25, 2024
- Software Defined Technologies, Inc.
- Michael M. Salour
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME
- Publication number 20240138053
- Publication date Apr 25, 2024
- Meiko Electronics Co., Ltd.
- Tohru MATSUMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING CONDUIT FOR ELECTRICAL COMPONENTS ON A PCB
- Publication number 20240121883
- Publication date Apr 11, 2024
- BorgWarner Inc.
- Lathom Alexander Louco
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOPLASTIC INTERPOSER
- Publication number 20240121882
- Publication date Apr 11, 2024
- Meta Platforms Technologies, LLC
- Brian Toleno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING BONDED SUBSTRATE, METHOD OF MANUFACTURING C...
- Publication number 20240107678
- Publication date Mar 28, 2024
- NGK Electronics Devices, Inc.
- Kota KITAJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMORY SUB-SYSTEM ENCLOSURE
- Publication number 20240107657
- Publication date Mar 28, 2024
- Micron Technology, Inc.
- Suresh Reddy Yarragunta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Carrier Substrate
- Publication number 20240107658
- Publication date Mar 28, 2024
- Solid-tech Co., Ltd.
- Tzu Chien Hung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL MODULE AND PRINTED CIRCUIT BOARD ASSEMBLY COMPRISING AN...
- Publication number 20240098899
- Publication date Mar 21, 2024
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Subhashini BHARATH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PIN-FIN COOLING FOR PRINTED CIRCUIT BOARDS (PCBS)
- Publication number 20240098878
- Publication date Mar 21, 2024
- Raytheon Technologies Corporation
- Yongduk Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER ADAPTER AND ELECTRONIC DEVICE SYSTEM
- Publication number 20240098879
- Publication date Mar 21, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Chunxia Xu
- B60 - VEHICLES IN GENERAL
Information Patent Application
CONTROL DEVICE
- Publication number 20240090174
- Publication date Mar 14, 2024
- BEIJING TUSEN ZHITU TECHNOLOGY CO., LTD.
- Weiwei HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND PRODUCT
- Publication number 20240090175
- Publication date Mar 14, 2024
- Beji SASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH DENSITY INTERPOSERS WITH MODULAR MEMORY UNITS
- Publication number 20240080988
- Publication date Mar 7, 2024
- Intel Corporation
- Todd A. HINCK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Exerting-Pressure Device and Electronic Apparatus Comprising the Same
- Publication number 20240064905
- Publication date Feb 22, 2024
- TE Connectivity Solutions GMBH
- Wei (David) Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

External configuration of printed circuit board adapted for heat dissipation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printing apparatus

Electronic device including shielding member and heat radiating str...

Composite phase change material, application method of composite ph...

Electronic equipment

Circuit board

Circuit board using thermocouple to dissipate generated heat and me...

Chip heat dissipation structure, chip structure, circuit board and...

Manufacturing method of insulated metal substrate

Use of bimetals in a heat sink to benefit heat transfer from high t...

Covering film, and circuit board and manufacturing method

Power electronics cooling assemblies and methods for making the same

Electronic device and cooling device with fan blade and related method

Display device having a display panel including a member for induci...

Power tools with high-emissivity heat sinks

Power supply apparatus

Electronic device and electronic device system

Display device

Angled faceplates for a network element

Indium-based interface structures, apparatus, and methods for formi...

Electronic assemblies having embedded passive heat pipes and associ...

Monolithic Pstages and methods for voltage regulators

Electronic device including antenna

Connector and method for manufacturing same

Internal architecture of a computing device

Battery management system circuit

Highly heat-dissipating flexible printed circuit board (GFPCB), man...

Camera module, spacer component, and method for producing camera mo...

Wiring substrate, electronic device and electronic module

Low cost panel AESA with thermal management

Power device assemblies having embedded PCBS and enhanced cooling a...

Patents Applicationslast 30 patents

THIN FILM CIRCUIT BOARD

PRINTED CIRCUIT BOARD ASSEMBLIES WITH ALUMINUM PCB SUBSTRATES IN HO...

THERMAL SOLUTIONS FOR COOLING ELECTRONIC DEVICES

Printed Circuit Board And Method For Soldering A Chip Housing In A...

HEAT-DISSIPATING CIRCUIT BOARD, HEAT-DISSIPATING MEMBER, AND PRODUC...

ELECTRONIC ASSEMBLIES HAVING EMBEDDED PASSIVE HEAT PIPES AND ASSOCI...

BIOPOLYMER-BASED ELECTROMAGENTIC INTERFERRENCE SHIELDING MATERIALS

DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME

DRIVING CHIP ACCOMMODATING CIRCUIT BOARD AND DISPLAY DEVICE HAVING...

CONNECTOR AND METHOD FOR MANUFACTURING SAME

PACKAGE STRUCTURE

COOLING OF ULTRASOUND ENERGIZERS MOUNTED ON PRINTED CIRCUIT BOARDS

THERMALLY DISSIPATIVE ELECTROMAGNETIC INTERFERENCE SHIELD OR COVER...

PRINTED CIRCUIT BOARD FOR PHASED ARRAY ANTENNA TRANSCEIVER ASSEMBLY...

Flexible Polytetrafluoroethylene Substrate With Electrical Circuit...

MOLDED ELECTRONIC ASSEMBLY

BIOPOLYMER-BASED ELECTROMAGENTIC INTERFERRENCE SHIELDING MATERIALS

DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME

COOLING CONDUIT FOR ELECTRICAL COMPONENTS ON A PCB

THERMOPLASTIC INTERPOSER

METHOD OF MANUFACTURING BONDED SUBSTRATE, METHOD OF MANUFACTURING C...

MEMORY SUB-SYSTEM ENCLOSURE

Carrier Substrate

ELECTRICAL MODULE AND PRINTED CIRCUIT BOARD ASSEMBLY COMPRISING AN...

PIN-FIN COOLING FOR PRINTED CIRCUIT BOARDS (PCBS)

POWER ADAPTER AND ELECTRONIC DEVICE SYSTEM

CONTROL DEVICE

ELECTRONIC DEVICE AND PRODUCT

HIGH DENSITY INTERPOSERS WITH MODULAR MEMORY UNITS

Exerting-Pressure Device and Electronic Apparatus Comprising the Same