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THERMOPLASTIC INTERPOSER
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Publication number 20240121882
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Publication date Apr 11, 2024
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Meta Platforms Technologies, LLC
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Brian Toleno
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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MEMORY SUB-SYSTEM ENCLOSURE
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Publication number 20240107657
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Publication date Mar 28, 2024
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Micron Technology, Inc.
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Suresh Reddy Yarragunta
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Carrier Substrate
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Publication number 20240107658
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Publication date Mar 28, 2024
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Solid-tech Co., Ltd.
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Tzu Chien Hung
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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CONTROL DEVICE
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Publication number 20240090174
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Publication date Mar 14, 2024
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BEIJING TUSEN ZHITU TECHNOLOGY CO., LTD.
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Weiwei HUANG
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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ELECTRONIC DEVICE AND PRODUCT
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Publication number 20240090175
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Publication date Mar 14, 2024
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Beji SASAKI
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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PRINTED CIRCUIT BOARD (PCB) COOLING
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Publication number 20240015881
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Publication date Jan 11, 2024
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HAMILTON SUNDSTRAND CORPORATION
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Yongduk Lee
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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ELECTRONIC CIRCUIT MODULE
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Publication number 20230413418
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Publication date Dec 21, 2023
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MURATA MANUFACTURING CO., LTD.
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Toru Komatsu
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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DISPLAY DEVICE
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Publication number 20230341909
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Publication date Oct 26, 2023
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SAMSUNG DISPLAY CO., LTD.
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Yeon-Sun NA
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G06 - COMPUTING CALCULATING COUNTING
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INSULATING RESIN CIRCUIT SUBSTRATE
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Publication number 20230319975
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Publication date Oct 5, 2023
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MITSUBISHI MATERIALS CORPORATION
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Yoshiaki Sakaniwa
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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