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SEMICONDUCTOR STRUCTURE
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Publication number 20240355728
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Publication date Oct 24, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Kai-Chun Chang
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H01 - BASIC ELECTRIC ELEMENTS
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CHIP STRUCTURE WITH CONDUCTIVE LAYER
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Publication number 20240347488
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Publication date Oct 17, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Chih-Fan HUANG
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H01 - BASIC ELECTRIC ELEMENTS
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DISPLAY DEVICE
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Publication number 20240339489
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Publication date Oct 10, 2024
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SAMSUNG DISPLAY CO., LTD.
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Joo Woan CHO
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H01 - BASIC ELECTRIC ELEMENTS
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DISPLAY DEVICE
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Publication number 20240321800
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Publication date Sep 26, 2024
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E Ink Holdings Inc.
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Wenchuan Wang
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H01 - BASIC ELECTRIC ELEMENTS
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POWER CHIP PACKAGING STRUCTURE
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Publication number 20240282727
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Publication date Aug 22, 2024
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TONG HSING ELECTRONIC INDUSTRIES, LTD.
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Chung-Hsiao Lien
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H01 - BASIC ELECTRIC ELEMENTS
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ELECTRONIC DEVICE
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Publication number 20240274559
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Publication date Aug 15, 2024
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Innolux Corporation
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Chia-Ping Tseng
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGES
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Publication number 20240162181
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Publication date May 16, 2024
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Samsung Electronics Co., Ltd.
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Sun Jae KIM
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20240145413
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Publication date May 2, 2024
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SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
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Makoto NISHIHARA
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H01 - BASIC ELECTRIC ELEMENTS
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