Fan-out arrangement of the internal vias

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CPC
H01L2924/15172

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/15172Fan-out arrangement of the internal vias

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device
- Patent number 12,040,315
- Issue date Jul 16, 2024
- Innolux Corporation
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level fan out semiconductor device and manufacturing method t...
- Patent number 11,855,023
- Issue date Dec 26, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Boo Yang Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon interposer including through-silicon via structures with en...
- Patent number 11,456,245
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Ju Tsou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out electronic device
- Patent number 11,410,875
- Issue date Aug 9, 2022
- Texas Instruments Incorporated
- Hau Thanh Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having thermal through vias (TTV)
- Patent number 11,373,922
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die with embedded communication cavity
- Patent number 11,239,186
- Issue date Feb 1, 2022
- Intel Corporation
- Digvijay Raorane
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrate having electronic component embedded therein
- Patent number 11,183,462
- Issue date Nov 23, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Mi Sun Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package module
- Patent number 11,094,640
- Issue date Aug 17, 2021
- Samsung Electronics Co., Ltd.
- Sangkyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,971,454
- Issue date Apr 6, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jong Rok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level fan out semiconductor device and manufacturing method t...
- Patent number 10,903,181
- Issue date Jan 26, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Boo Yang Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded substrate package in fan-out wafer level package
- Patent number 10,720,393
- Issue date Jul 21, 2020
- Intel IP Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded substrate package in fan-out wafer level package
- Patent number 10,403,580
- Issue date Sep 3, 2019
- Intel IP Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-surface edge pads for vertical mount packages and methods of...
- Patent number 10,354,945
- Issue date Jul 16, 2019
- Invensas Corporation
- Rajesh Katkar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fan-out semiconductor package including electromagnetic interferenc...
- Patent number 10,283,439
- Issue date May 7, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Jung Hyun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out semiconductor device including a plurality of semiconductor...
- Patent number 10,177,119
- Issue date Jan 8, 2019
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Cong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die flip-chip package assembly
- Patent number 10,128,205
- Issue date Nov 13, 2018
- Intel Corporation
- Thorsten Meyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,026,678
- Issue date Jul 17, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Jung Hyun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumpless build-up layer package design with an interposer
- Patent number 9,818,719
- Issue date Nov 14, 2017
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip, face-up and face-down centerbond memory wirebond assemblies
- Patent number 9,806,017
- Issue date Oct 31, 2017
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pop devices and methods of forming the same
- Patent number 9,793,246
- Issue date Oct 17, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out pop stacking process
- Patent number 9,754,924
- Issue date Sep 5, 2017
- Apple Inc.
- Chih-Ming Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming anisotropic conductive f...
- Patent number 9,620,455
- Issue date Apr 11, 2017
- STATS ChipPAC Pte. Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including RDL along sloped side surface of sem...
- Patent number 9,437,538
- Issue date Sep 6, 2016
- STATS ChipPAC Pte. Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 9,437,586
- Issue date Sep 6, 2016
- Samsung Electronics Co., Ltd.
- Min gi Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out PoP stacking process
- Patent number 9,379,097
- Issue date Jun 28, 2016
- Apple Inc.
- Chih-Ming Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect substrate with embedded semiconductor device and built...
- Patent number 9,147,587
- Issue date Sep 29, 2015
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Interposer and electronic device using the same
- Patent number 8,975,529
- Issue date Mar 10, 2015
- Kyocera Corporation
- Katsura Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package device and method of fabricating the same
- Patent number 8,952,517
- Issue date Feb 10, 2015
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip, face-up and face-down centerbond memory wirebond assemblies
- Patent number 8,928,153
- Issue date Jan 6, 2015
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid wiring board with built-in stopper, interposer and build-up...
- Patent number 8,901,435
- Issue date Dec 2, 2014
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...
- Publication number 20240421051
- Publication date Dec 19, 2024
- Deca Technologies USA, Inc.
- Timothy L. OLSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...
- Publication number 20240421052
- Publication date Dec 19, 2024
- Deca Technologies USA, Inc.
- Timothy L. OLSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGING METHOD AND PACKAGING STRUCTURE OF STACKED CHIPS T...
- Publication number 20240321704
- Publication date Sep 26, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Maohua DU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL FAN OUT SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD T...
- Publication number 20240243084
- Publication date Jul 18, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Boo Yang Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRENCH FOR CONTROLLING UNDERFILL FILLET AREA AND METHODS...
- Publication number 20230317671
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON INTERPOSER INCLUDING THROUGH-SILICON VIA STRUCTURES WITH EN...
- Publication number 20230020959
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Ju TSOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR PACKAGES HAVING THERMAL THROUGH VIA...
- Publication number 20220285241
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20220122946
- Publication date Apr 21, 2022
- InnoLux Corporation
- Jen-Hai CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON INTERPOSER INCLUDING THROUGH-SILICON VIA STRUCTURES WITH EN...
- Publication number 20210375741
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Ju TSOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL FAN OUT SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD T...
- Publication number 20210217717
- Publication date Jul 15, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Boo Yang Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200328160
- Publication date Oct 15, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Jong Rok KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT ELECTRONIC DEVICE
- Publication number 20200203219
- Publication date Jun 25, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Hau Thanh Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE MODULE
- Publication number 20200161248
- Publication date May 21, 2020
- Samsung Electronics Co., Ltd.
- Sangkyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SUBSTRATE PACKAGE IN FAN-OUT WAFER LEVEL PACKAGE
- Publication number 20190393154
- Publication date Dec 26, 2019
- Intel IP Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20180286790
- Publication date Oct 4, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Jung Hyun CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20180182691
- Publication date Jun 28, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Jung Hyun CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP, FACE-UP AND FACE-DOWN CENTERBOND MEMORY WIREBOND ASSEMBLIES
- Publication number 20180025967
- Publication date Jan 25, 2018
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF SEMICONDUCTOR...
- Publication number 20180019228
- Publication date Jan 18, 2018
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Cong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL FAN OUT SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD T...
- Publication number 20170323862
- Publication date Nov 9, 2017
- Amkor Technology, Inc.
- Boo Yang Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING THREE-DIMENSIONAL INTEGRATED CIRCUIT
- Publication number 20160126110
- Publication date May 5, 2016
- PRINCO CORP.
- Chih-Kuang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including RDL Along Sloped Side Surface of Sem...
- Publication number 20140264786
- Publication date Sep 18, 2014
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT SUBSTRATE WITH EMBEDDED SEMICONDUCTOR DEVICE AND BUILT...
- Publication number 20140048944
- Publication date Feb 20, 2014
- Bridge Semiconductor Corporation
- Charles W.C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID WIRING BOARD WITH BUILT-IN STOPPER, INTERPOSER AND BUILD-UP...
- Publication number 20140048324
- Publication date Feb 20, 2014
- Charles W.C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20140001653
- Publication date Jan 2, 2014
- Samsung Electronics Co., Ltd.
- HEUNGKYU KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMPLESS BUILD-UP LAYER PACKAGE DESIGN WITH AN INTERPOSER
- Publication number 20130334696
- Publication date Dec 19, 2013
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER SUBSTRATE, ELECTRONIC DEVICE PACKAGE, AND ELECTRONIC COM...
- Publication number 20130335936
- Publication date Dec 19, 2013
- FUJIKURA LTD.
- Satoshi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND ELECTRONIC DEVICE USING THE SAME
- Publication number 20130027895
- Publication date Jan 31, 2013
- KYOCERA CORPORATION
- Katsura Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP, FACE-UP AND FACE-DOWN CENTERBOND MEMORY WIREBOND ASSEMBLIES
- Publication number 20120267796
- Publication date Oct 25, 2012
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip and semiconductor device
- Publication number 20120133055
- Publication date May 31, 2012
- RENESAS ELECTRONICS CORPORATION
- Kei Machida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE WITH FAN-OUT WLCSP
- Publication number 20120032314
- Publication date Feb 9, 2012
- Nan-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS

Fan-out arrangement of the internal vias

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device

Wafer level fan out semiconductor device and manufacturing method t...

Silicon interposer including through-silicon via structures with en...

Fan-out electronic device

Semiconductor packages having thermal through vias (TTV)

Die with embedded communication cavity

Substrate having electronic component embedded therein

Package module

Semiconductor package

Wafer level fan out semiconductor device and manufacturing method t...

Molded substrate package in fan-out wafer level package

Molded substrate package in fan-out wafer level package

Multi-surface edge pads for vertical mount packages and methods of...

Fan-out semiconductor package including electromagnetic interferenc...

Fan out semiconductor device including a plurality of semiconductor...

Embedded die flip-chip package assembly

Fan-out semiconductor package

Bumpless build-up layer package design with an interposer

Flip-chip, face-up and face-down centerbond memory wirebond assemblies

Pop devices and methods of forming the same

Fan-out pop stacking process

Semiconductor device and method of forming anisotropic conductive f...

Semiconductor device including RDL along sloped side surface of sem...

Semiconductor package and method of fabricating the same

Fan-out PoP stacking process

Interconnect substrate with embedded semiconductor device and built...

Interposer and electronic device using the same

Package-on-package device and method of fabricating the same

Flip-chip, face-up and face-down centerbond memory wirebond assemblies

Hybrid wiring board with built-in stopper, interposer and build-up...

Patents Applicationslast 30 patents

MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...

MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...

FAN-OUT PACKAGING METHOD AND PACKAGING STRUCTURE OF STACKED CHIPS T...

WAFER LEVEL FAN OUT SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD T...

SUBSTRATE TRENCH FOR CONTROLLING UNDERFILL FILLET AREA AND METHODS...

SILICON INTERPOSER INCLUDING THROUGH-SILICON VIA STRUCTURES WITH EN...

METHOD OF FORMING SEMICONDUCTOR PACKAGES HAVING THERMAL THROUGH VIA...

ELECTRONIC DEVICE

SILICON INTERPOSER INCLUDING THROUGH-SILICON VIA STRUCTURES WITH EN...

WAFER LEVEL FAN OUT SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD T...

SEMICONDUCTOR PACKAGE

FAN-OUT ELECTRONIC DEVICE

PACKAGE MODULE

MOLDED SUBSTRATE PACKAGE IN FAN-OUT WAFER LEVEL PACKAGE

FAN-OUT SEMICONDUCTOR PACKAGE

FAN-OUT SEMICONDUCTOR PACKAGE

FLIP-CHIP, FACE-UP AND FACE-DOWN CENTERBOND MEMORY WIREBOND ASSEMBLIES

FAN OUT SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF SEMICONDUCTOR...

WAFER LEVEL FAN OUT SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD T...

METHOD FOR MANUFACTURING THREE-DIMENSIONAL INTEGRATED CIRCUIT

Semiconductor Device Including RDL Along Sloped Side Surface of Sem...

INTERCONNECT SUBSTRATE WITH EMBEDDED SEMICONDUCTOR DEVICE AND BUILT...

HYBRID WIRING BOARD WITH BUILT-IN STOPPER, INTERPOSER AND BUILD-UP...

PACKAGE-ON-PACKAGE DEVICE AND METHOD OF FABRICATING THE SAME

BUMPLESS BUILD-UP LAYER PACKAGE DESIGN WITH AN INTERPOSER

INTERPOSER SUBSTRATE, ELECTRONIC DEVICE PACKAGE, AND ELECTRONIC COM...

INTERPOSER AND ELECTRONIC DEVICE USING THE SAME

FLIP-CHIP, FACE-UP AND FACE-DOWN CENTERBOND MEMORY WIREBOND ASSEMBLIES

Semiconductor chip and semiconductor device

PACKAGE-ON-PACKAGE WITH FAN-OUT WLCSP