Fan-out arrangement

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CPC
H01L2224/02379

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/02379Fan-out arrangement

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Process control for package formation
- Patent number 12,183,728
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out packages with warpage resistance
- Patent number 12,183,675
- Issue date Dec 31, 2024
- Advanced Micro Devices, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor structure
- Patent number 12,176,344
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating redistribution circuit structure
- Patent number 12,170,223
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method having a through substrate via and...
- Patent number 12,148,664
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode module and display device having the same
- Patent number 12,136,616
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Youngki Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor package
- Patent number 12,132,021
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous fan-out structure and method of manufacture
- Patent number 12,131,984
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-to-face through-silicon via multi-chip semiconductor apparatus...
- Patent number 12,125,768
- Issue date Oct 22, 2024
- Altera Corporation
- Loke Yip Foo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure
- Patent number 12,094,819
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 12,080,629
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging method and package structure
- Patent number 12,080,565
- Issue date Sep 3, 2024
- Pep Innovation PTE Ltd.
- Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages having mechanical brace standoffs
- Patent number 12,080,623
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan Sheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 12,080,600
- Issue date Sep 3, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect integration processes and structures
- Patent number 12,074,106
- Issue date Aug 27, 2024
- Applied Materials, Inc.
- Richard W. Plavidal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out packaging
- Patent number 12,062,622
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-Ping Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package structures with recesses in molding comp...
- Patent number 12,057,432
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-to-face semiconductor device with fan-out porch
- Patent number 12,051,684
- Issue date Jul 30, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 12,051,634
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,046,482
- Issue date Jul 23, 2024
- Adeia Semiconductor Bonding Technologies, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Innovative fan-out panel level package (FOPLP) warpage control
- Patent number 12,040,286
- Issue date Jul 16, 2024
- Intel Corporation
- Eunyong Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a through intervia through the molding...
- Patent number 12,033,976
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, optical structure and method for manufacturing t...
- Patent number 12,033,934
- Issue date Jul 9, 2024
- Advanced Semiconductor Engineering, Inc.
- Yu-Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a conductive pillar and methods of man...
- Patent number 12,027,495
- Issue date Jul 2, 2024
- Samsung Electronics Co., Ltd.
- Kun Sil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,021,026
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,021,045
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device with alternating fan-out lines
- Patent number 12,022,699
- Issue date Jun 25, 2024
- Samsung Display Co., Ltd.
- Tae Jong Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes for reducing leakage and improving adhesion
- Patent number 12,020,983
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun Chen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a semiconductor die and a plurality...
- Patent number 12,021,024
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having a die, an encapsulant, and a redistri...
- Patent number 12,021,047
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING PACKAGE
- Publication number 20240404954
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsai-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH
- Publication number 20240387499
- Publication date Nov 21, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Organic Integrated Circuit Substrate Embedded in Inorg...
- Publication number 20240387456
- Publication date Nov 21, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Minwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Manufacturing The Same
- Publication number 20240387196
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20240387359
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY METAL BONDING PADS FOR UNDERFILL APPLICATION IN SEMICONDUCTOR...
- Publication number 20240381605
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Ming-Chih YEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240379439
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20240379538
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES HAVING MECHANICAL BRACE STANDOFFS
- Publication number 20240363486
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan Sheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240363533
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE
- Publication number 20240312904
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE
- Publication number 20240304542
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240304572
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCA...
- Publication number 20240297131
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240290734
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsuan TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING FOR SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20240282731
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Stacking Structure and Method Forming Same
- Publication number 20240274590
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND HIGH FREQUENCY MODULE
- Publication number 20240250052
- Publication date Jul 25, 2024
- FUJIKURA LTD.
- Michikazu Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED VIA STRUCTURE
- Publication number 20240234299
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LTHC AS CHARGING BARRIER IN INFO PACKAGE FORMATION
- Publication number 20240222352
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Col., Ltd.
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR PACKAGES
- Publication number 20240203971
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturning Company, Ltd.
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240194591
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT PACKAGE WITH INTEGRATED PERIPHERAL DEVICES AND METHODS
- Publication number 20240194552
- Publication date Jun 13, 2024
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240194569
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240186283
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240170419
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC HAVING ELECTRICALLY ISOLATED WARPAGE PREVENTION STRUCTURES
- Publication number 20240128204
- Publication date Apr 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Christlyn Faith Hobrero Arias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Package with Cavity Substrate
- Publication number 20240105705
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC PACKAGE
- Publication number 20240096835
- Publication date Mar 21, 2024
- Siliconware Precision Industries Co., Ltd.
- Pin-Jing SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20240096812
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS

Fan-out arrangement

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Process control for package formation

Fan-out packages with warpage resistance

Methods of forming semiconductor structure

Method of fabricating redistribution circuit structure

Semiconductor device and method having a through substrate via and...

Light emitting diode module and display device having the same

Method for fabricating semiconductor package

Heterogeneous fan-out structure and method of manufacture

Face-to-face through-silicon via multi-chip semiconductor apparatus...

Method for forming package structure

Manufacturing method of semiconductor structure

Chip packaging method and package structure

Integrated circuit packages having mechanical brace standoffs

Semiconductor device and method to minimize stress on stack via

Fan-out interconnect integration processes and structures

Integrated fan-out packaging

Integrated fan-out package structures with recesses in molding comp...

Face-to-face semiconductor device with fan-out porch

Package and package-on-package structure having elliptical columns...

Microelectronic assemblies

Innovative fan-out panel level package (FOPLP) warpage control

Semiconductor package having a through intervia through the molding...

Package structure, optical structure and method for manufacturing t...

Semiconductor devices having a conductive pillar and methods of man...

Package structure and method of fabricating the same

Semiconductor device and method of manufacture

Display device with alternating fan-out lines

Processes for reducing leakage and improving adhesion

Semiconductor device including a semiconductor die and a plurality...

Semiconductor packages having a die, an encapsulant, and a redistri...

Patents Applicationslast 30 patents

METHOD OF FORMING PACKAGE

FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH

Package with Organic Integrated Circuit Substrate Embedded in Inorg...

Semiconductor Package and Method of Manufacturing The Same

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

DUMMY METAL BONDING PADS FOR UNDERFILL APPLICATION IN SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND METHOD

Semiconductor Device and Method of Manufacture

INTEGRATED CIRCUIT PACKAGES HAVING MECHANICAL BRACE STANDOFFS

PACKAGE STRUCTURE

METHOD OF FABRICATING PACKAGE STRUCTURE

METHOD OF FABRICATING PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCA...

PACKAGE STRUCTURE

HYBRID BONDING FOR SEMICONDUCTOR DEVICE ASSEMBLIES

Die Stacking Structure and Method Forming Same

SEMICONDUCTOR PACKAGE AND HIGH FREQUENCY MODULE

STACKED VIA STRUCTURE

LTHC AS CHARGING BARRIER IN INFO PACKAGE FORMATION

METHODS OF FORMING SEMICONDUCTOR PACKAGES

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

FAN OUT PACKAGE WITH INTEGRATED PERIPHERAL DEVICES AND METHODS

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE

IC HAVING ELECTRICALLY ISOLATED WARPAGE PREVENTION STRUCTURES

Fan-Out Package with Cavity Substrate

MANUFACTURING METHOD OF ELECTRONIC PACKAGE

Semiconductor Device and Method of Manufacture