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Stacked via structure
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Patent number 11,973,023
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Issue date Apr 30, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd
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Po-Han Wang
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package and method
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Patent number 11,942,464
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Issue date Mar 26, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd
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Hao-Jan Pei
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H01 - BASIC ELECTRIC ELEMENTS
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Antenna module
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Patent number 11,909,099
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Issue date Feb 20, 2024
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Samsung Electronics Co., Ltd.
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Won Wook So
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H01 - BASIC ELECTRIC ELEMENTS
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Integrated fan-out package
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Patent number 11,901,303
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Issue date Feb 13, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd
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Ming-Yen Chiu
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package
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Patent number 11,881,472
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Issue date Jan 23, 2024
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Samsung Electronics Co., Ltd.
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Yongjin Park
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device and method
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Patent number 11,855,014
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Issue date Dec 26, 2023
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Chen-Hua Yu
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H01 - BASIC ELECTRIC ELEMENTS
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Integrated fan-out package
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Patent number 11,854,993
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Issue date Dec 26, 2023
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Taiwan Semiconductor Manufacturing Company, Ltd
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Ming-Yen Chiu
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H01 - BASIC ELECTRIC ELEMENTS
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