Features relating to contacting the IC under test

Industry

CPC
G01R31/2886

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Parent Industries

GPHYSICS G01Measuring instruments G01RMEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES G01R31/00Arrangements for testing electric properties Arrangements for locating electric faults Arrangements for electrical testing characterised by what is being tested not provided for elsewhere

Current Industry

G01R31/2886Features relating to contacting the IC under test

Industries

Patents Grantslast 30 patents

Information Patent Grant
Probe head and probe card comprising same
- Patent number 12,135,338
- Issue date Nov 5, 2024
- POINT ENGINEERING CO., LTD.
- Bum Mo Ahn
- G01 - MEASURING TESTING
Information Patent Grant
Semi-automatic prober
- Patent number 12,135,335
- Issue date Nov 5, 2024
- QualiTau, Inc.
- Edward McCloud
- G01 - MEASURING TESTING
Information Patent Grant
Substrate testing with three-dimensional scanning
- Patent number 12,135,348
- Issue date Nov 5, 2024
- Mellanox Technologies, Ltd.
- Barak Freedman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Indirect acquisition of a signal from a device under test
- Patent number 12,135,353
- Issue date Nov 5, 2024
- Tektronix, Inc.
- Sam J. Strickling
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dielectric resonating test contactor and method
- Patent number 12,123,897
- Issue date Oct 22, 2024
- Xcerra Corporation
- James Hattis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate yield prediction based on spectra data from...
- Patent number 12,111,355
- Issue date Oct 8, 2024
- Onto Innovation Inc.
- Xin Song
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Structure and method for testing of PIC with an upturned mirror
- Patent number 12,105,141
- Issue date Oct 1, 2024
- Lucas Soldano
- G01 - MEASURING TESTING
Information Patent Grant
Testing devices and method for testing semiconductor devices
- Patent number 12,092,655
- Issue date Sep 17, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch probe card
- Patent number 12,085,589
- Issue date Sep 10, 2024
- Xallent Inc.
- Kwame Amponsah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods to monitor leakage current
- Patent number 12,085,601
- Issue date Sep 10, 2024
- STMicroelectronics S.r.l.
- Romeo Letor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Managing photonic integrated circuit optical coupling
- Patent number 12,078,674
- Issue date Sep 3, 2024
- Ciena Corporation
- Jérôme Leclerc-Perron
- G01 - MEASURING TESTING
Information Patent Grant
Method and device for wafer-level testing
- Patent number 12,066,484
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jun He
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor wafer and multi-chip parallel testing method
- Patent number 12,066,486
- Issue date Aug 20, 2024
- Winbond Electronics Corp.
- Chih-Chiang Lai
- G01 - MEASURING TESTING
Information Patent Grant
Spring contact and socket having spring contact embedded therein
- Patent number 12,061,212
- Issue date Aug 13, 2024
- HICON CO., LTD.
- Dong Weon Hwang
- G01 - MEASURING TESTING
Information Patent Grant
Method of centering probe head in mounting frame
- Patent number 12,044,704
- Issue date Jul 23, 2024
- FormFactor, Inc.
- Kalyanjit Ghosh
- G01 - MEASURING TESTING
Information Patent Grant
Methods and systems for remote access hardware testing
- Patent number 12,044,728
- Issue date Jul 23, 2024
- DISH Network L.L.C.
- Mansoor Ahmed
- G01 - MEASURING TESTING
Information Patent Grant
Test system for memory card
- Patent number 12,038,470
- Issue date Jul 16, 2024
- Huawei Technologies Co., Ltd.
- Weiwen Pang
- G01 - MEASURING TESTING
Information Patent Grant
Flexible input/output (I/O) allocation for integrated circuit scan...
- Patent number 12,032,015
- Issue date Jul 9, 2024
- Amazon Technologies, Inc.
- Ilan Strulovici
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for wafer-level testing
- Patent number 12,025,655
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jun He
- G01 - MEASURING TESTING
Information Patent Grant
Maintenance apparatus, maintenance method, and recording medium hav...
- Patent number 12,014,335
- Issue date Jun 18, 2024
- Advantest Corporation
- Hajime Sugimura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and testing apparatus related to wafer testing
- Patent number 12,013,431
- Issue date Jun 18, 2024
- NANYA TECHNOLOGY CORPORATION
- Ting Wei Yu
- G01 - MEASURING TESTING
Information Patent Grant
Manufacturing method of integrated substrate
- Patent number 12,009,329
- Issue date Jun 11, 2024
- Dyi-Chung Hu
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor test apparatus and semiconductor test method
- Patent number 12,007,414
- Issue date Jun 11, 2024
- Mitsubishi Electric Corporation
- Yoshiyuki Ueda
- G01 - MEASURING TESTING
Information Patent Grant
Detection unit, semiconductor film layer inspection apparatus inclu...
- Patent number 12,000,866
- Issue date Jun 4, 2024
- EnVigth Co., Ltd.
- Hyoung Sik Kim
- G01 - MEASURING TESTING
Information Patent Grant
Resonant-coupled transmission line
- Patent number 12,004,288
- Issue date Jun 4, 2024
- Teradyne, Inc.
- Andrew Westwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Burn-in board and burn-in apparatus
- Patent number 11,994,552
- Issue date May 28, 2024
- Advantest Corporation
- Hiroaki Takeuchi
- G01 - MEASURING TESTING
Information Patent Grant
Probe unit
- Patent number 11,994,535
- Issue date May 28, 2024
- NHK Spring Co., Ltd.
- Tsuyoshi Inuma
- G01 - MEASURING TESTING
Information Patent Grant
Spring contact and test socket with same
- Patent number 11,982,688
- Issue date May 14, 2024
- Hicon Co., Ltd.
- Dong Weon Hwang
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 11,977,099
- Issue date May 7, 2024
- HITACHI HIGH-TECH CORPORATION
- Tomohisa Ohtaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for testing an integrated circuit of a device and its method...
- Patent number 11,977,098
- Issue date May 7, 2024
- AEHR Test Systems
- Scott E. Lindsey
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
CANTILEVER PROBE CARD DEVICE AND SOLDER RECEIVING PROBE
- Publication number 20240385223
- Publication date Nov 21, 2024
- CHUNGHWA PRECISION TEST TECH. CO., LTD.
- HAO-YEN CHENG
- G01 - MEASURING TESTING
Information Patent Application
CONTACTOR FOR MULTI DEVICE SOCKETS AND RELATED
- Publication number 20240377454
- Publication date Nov 14, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Raffy CELIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE CARD DEVICE
- Publication number 20240369599
- Publication date Nov 7, 2024
- Silicon Future Manufacturing Company Ltd.
- TIEN-CHIA LEE
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND DEVICE FOR WAFER-LEVEL TESTING
- Publication number 20240361380
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JUN HE
- G01 - MEASURING TESTING
Information Patent Application
METHODS AND SYSTEMS FOR REMOTE ACCESS HARDWARE TESTING
- Publication number 20240345158
- Publication date Oct 17, 2024
- Dish Network L.L.C.
- Mansoor Ahmed
- G01 - MEASURING TESTING
Information Patent Application
TEST APPARATUS FOR SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20240345156
- Publication date Oct 17, 2024
- Mitsubishi Electric Corporation
- Takuya YOSHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE CARD AND CALIBRATION METHOD FOR PROBER
- Publication number 20240337678
- Publication date Oct 10, 2024
- United Microelectronics Corp.
- Huan-Chen Peng
- G01 - MEASURING TESTING
Information Patent Application
APPARATUS FOR TESTING SEMICONDUCTOR PACKAGE
- Publication number 20240337688
- Publication date Oct 10, 2024
- TSE CO., LTD.
- Dae Hyun ROH
- G01 - MEASURING TESTING
Information Patent Application
Apparatus and Method for Testing Semiconductor Devices
- Publication number 20240329134
- Publication date Oct 3, 2024
- Testmetrix, Inc.
- Christian O. Cojocneanu
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND SYSTEM FOR WAFER-LEVEL TESTING
- Publication number 20240310434
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JUN HE
- G01 - MEASURING TESTING
Information Patent Application
ELECTRICAL TEST CONTACT TERMINAL FOR A PIN-TYPE DEVICE LEAD
- Publication number 20240280607
- Publication date Aug 22, 2024
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUND-SIGNAL-GROUND DEVICE STRUCTURE
- Publication number 20240264224
- Publication date Aug 8, 2024
- UNITED MICROELECTRONICS CORP.
- Ching-Wen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE CARD
- Publication number 20240264038
- Publication date Aug 8, 2024
- SK HYNIX INC.
- Sung Wook CHO
- G01 - MEASURING TESTING
Information Patent Application
SOCKET, JIG, SOCKET MAINTENANCE SET, AND DISASSEMBLY METHOD
- Publication number 20240241172
- Publication date Jul 18, 2024
- YOKOWO CO., LTD.
- Kohei AMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING ALIGNMENT DURING A THERMAL CYCLE
- Publication number 20240230714
- Publication date Jul 11, 2024
- Aehr Test Systems
- Scott E. Lindsey
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR TEST APPARATUS AND SEMICONDUCTOR TEST METHOD
- Publication number 20240219426
- Publication date Jul 4, 2024
- Mitsubishi Electric Corporation
- Yoshiyuki Ueda
- G01 - MEASURING TESTING
Information Patent Application
CHIP SOCKET, TESTING FIXTURE AND CHIP TESTING METHOD THEREOF
- Publication number 20240192252
- Publication date Jun 13, 2024
- NANYA TECHNOLOGY CORPORATION
- SHIH-TING LIN
- G01 - MEASURING TESTING
Information Patent Application
TEST SYSTEM FOR TESTING SEMICONDUCTOR DEVICES
- Publication number 20240183878
- Publication date Jun 6, 2024
- TAIWAN MASK CORPORATION
- Chih-Ming CHEN
- G01 - MEASURING TESTING
Information Patent Application
Probe head for wafer-level burn-in test (WLBI) and probe card compr...
- Publication number 20240183882
- Publication date Jun 6, 2024
- Microsoft S.p.A
- Giuseppe AMELIO
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR ACCURATE REFERENCE VOLTAGE TRIMMING
- Publication number 20240175913
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kar Hou Chai
- G01 - MEASURING TESTING
Information Patent Application
Test socket
- Publication number 20240159794
- Publication date May 16, 2024
- OKINS ELECTRONICS CO.,LTD
- Jin Kook JUN
- G01 - MEASURING TESTING
Information Patent Application
MODULAR LOW LEVEL CONTACT RESISTANCE TESTING APPARATUS FOR PROCESS...
- Publication number 20240133945
- Publication date Apr 25, 2024
- Mohanraj Prabhugoud
- G01 - MEASURING TESTING
Information Patent Application
APPARATUS FOR TESTING ELECTRONIC DEVICES
- Publication number 20240103068
- Publication date Mar 28, 2024
- Aehr Test Systems
- Donald P. Richmond
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TEST SOCKET WITH CONDUCTIVE COMPRESSION CONTACTS FOR INTEGRATED CIR...
- Publication number 20240094245
- Publication date Mar 21, 2024
- Ironwood Electronics, Inc.
- Ilavarasan M. Palaniappa
- G01 - MEASURING TESTING
Information Patent Application
CIRCUIT TEST STRUCTURE AND METHOD OF USING
- Publication number 20240094282
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANAGING PHOTONIC INTEGRATED CIRCUIT OPTICAL COUPLING
- Publication number 20240077532
- Publication date Mar 7, 2024
- CIENA CORPORATION
- Jérôme Leclerc-Perron
- G01 - MEASURING TESTING
Information Patent Application
PROBE CARD, METHOD FOR DESIGNING PROBE CARD, METHOD FOR PRODUCING T...
- Publication number 20240077519
- Publication date Mar 7, 2024
- MPI CORPORATION
- Yang-Hung Cheng
- G01 - MEASURING TESTING
Information Patent Application
TEST AND MEASUREMENT INSTRUMENT ACCESSORY WITH RECONFIGURABLE PROCE...
- Publication number 20240069094
- Publication date Feb 29, 2024
- Tektronix, Inc.
- Charles W. Case
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Test Equipment and Method of Performing Current and V...
- Publication number 20240053400
- Publication date Feb 15, 2024
- JCET STATS ChipPAC Korea Limited
- YongJu Lee
- G01 - MEASURING TESTING
Information Patent Application
METHODS AND SYSTEMS FOR REMOTE ACCESS HARDWARE TESTING
- Publication number 20240044972
- Publication date Feb 8, 2024
- Dish Network L.L.C.
- Mansoor Ahmed
- G01 - MEASURING TESTING

Features relating to contacting the IC under test

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Probe head and probe card comprising same

Semi-automatic prober

Substrate testing with three-dimensional scanning

Indirect acquisition of a signal from a device under test

Dielectric resonating test contactor and method

Semiconductor substrate yield prediction based on spectra data from...

Structure and method for testing of PIC with an upturned mirror

Testing devices and method for testing semiconductor devices

Fine pitch probe card

Systems and methods to monitor leakage current

Managing photonic integrated circuit optical coupling

Method and device for wafer-level testing

Semiconductor wafer and multi-chip parallel testing method

Spring contact and socket having spring contact embedded therein

Method of centering probe head in mounting frame

Methods and systems for remote access hardware testing

Test system for memory card

Flexible input/output (I/O) allocation for integrated circuit scan...

Method and system for wafer-level testing

Maintenance apparatus, maintenance method, and recording medium hav...

Method and testing apparatus related to wafer testing

Manufacturing method of integrated substrate

Semiconductor test apparatus and semiconductor test method

Detection unit, semiconductor film layer inspection apparatus inclu...

Resonant-coupled transmission line

Burn-in board and burn-in apparatus

Probe unit

Spring contact and test socket with same

Method for manufacturing semiconductor device

System for testing an integrated circuit of a device and its method...

Patents Applicationslast 30 patents

CANTILEVER PROBE CARD DEVICE AND SOLDER RECEIVING PROBE

CONTACTOR FOR MULTI DEVICE SOCKETS AND RELATED

PROBE CARD DEVICE

METHOD AND DEVICE FOR WAFER-LEVEL TESTING

METHODS AND SYSTEMS FOR REMOTE ACCESS HARDWARE TESTING

TEST APPARATUS FOR SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...

PROBE CARD AND CALIBRATION METHOD FOR PROBER

APPARATUS FOR TESTING SEMICONDUCTOR PACKAGE

Apparatus and Method for Testing Semiconductor Devices

METHOD AND SYSTEM FOR WAFER-LEVEL TESTING

ELECTRICAL TEST CONTACT TERMINAL FOR A PIN-TYPE DEVICE LEAD

GROUND-SIGNAL-GROUND DEVICE STRUCTURE

PROBE CARD

SOCKET, JIG, SOCKET MAINTENANCE SET, AND DISASSEMBLY METHOD

CONTROLLING ALIGNMENT DURING A THERMAL CYCLE

SEMICONDUCTOR TEST APPARATUS AND SEMICONDUCTOR TEST METHOD

CHIP SOCKET, TESTING FIXTURE AND CHIP TESTING METHOD THEREOF

TEST SYSTEM FOR TESTING SEMICONDUCTOR DEVICES

Probe head for wafer-level burn-in test (WLBI) and probe card compr...

METHOD FOR ACCURATE REFERENCE VOLTAGE TRIMMING

Test socket

MODULAR LOW LEVEL CONTACT RESISTANCE TESTING APPARATUS FOR PROCESS...

APPARATUS FOR TESTING ELECTRONIC DEVICES

TEST SOCKET WITH CONDUCTIVE COMPRESSION CONTACTS FOR INTEGRATED CIR...

CIRCUIT TEST STRUCTURE AND METHOD OF USING

MANAGING PHOTONIC INTEGRATED CIRCUIT OPTICAL COUPLING

PROBE CARD, METHOD FOR DESIGNING PROBE CARD, METHOD FOR PRODUCING T...

TEST AND MEASUREMENT INSTRUMENT ACCESSORY WITH RECONFIGURABLE PROCE...

Semiconductor Test Equipment and Method of Performing Current and V...

METHODS AND SYSTEMS FOR REMOTE ACCESS HARDWARE TESTING