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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B2207/00Micro-structural systems or auxiliary parts thereof

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Patents Grantslast 30 patents

Information Patent Grant
Undercut-free patterned aluminum nitride structure and methods for...
- Patent number 12,134,824
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yuan-Chih Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS resonator system
- Patent number 11,987,495
- Issue date May 21, 2024
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked-die MEMS resonator
- Patent number 11,708,264
- Issue date Jul 25, 2023
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Undercut-free patterned aluminum nitride structure and methods for...
- Patent number 11,371,133
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Yuan-Chih Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked-die MEMS resonator
- Patent number 11,370,656
- Issue date Jun 28, 2022
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for packaging a microelectromechanical systems device
- Patent number 11,286,157
- Issue date Mar 29, 2022
- VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
- You Qian
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fluidic microelectromechanical sensors/devices and fabrication meth...
- Patent number 11,033,898
- Issue date Jun 15, 2021
- EZMEMS LTD.
- Tsvi Shmilovich
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturing of integrated circuit resonator
- Patent number 10,913,655
- Issue date Feb 9, 2021
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical systems packages and methods for packaging a...
- Patent number 10,793,422
- Issue date Oct 6, 2020
- VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
- You Qian
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure for micromechanical resonator
- Patent number 10,723,617
- Issue date Jul 28, 2020
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrating MEMS structures with interconnects and vias
- Patent number 10,457,548
- Issue date Oct 29, 2019
- Intel Corporation
- Kevin Lai Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low-profile stacked-die MEMS resonator system
- Patent number 10,287,162
- Issue date May 14, 2019
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Monolithic integration of MEMS and IC devices
- Patent number 10,189,705
- Issue date Jan 29, 2019
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Humberto Campanella Pineda
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromachined monolithic 3-axis gyroscope with single drive
- Patent number 10,050,155
- Issue date Aug 14, 2018
- FAIRCHILD SEMICONDUCTOR CORPORATION
- Cenk Acar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Various stress free sensor packages using wafer level supporting di...
- Patent number 10,041,847
- Issue date Aug 7, 2018
- Apple Inc.
- Caleb C. Han
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-resonator having lid-integrated electrode
- Patent number 9,991,868
- Issue date Jun 5, 2018
- HRL Laboratories, LLC
- Hung Nguyen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and structures of integrated MEMS-CMOS devices
- Patent number 9,950,924
- Issue date Apr 24, 2018
- MCube, Inc.
- Sudheer S. Sridharamurthy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Silicon-on-sapphire device with minimal thermal strain preload and...
- Patent number 9,890,033
- Issue date Feb 13, 2018
- Honeywell International Inc.
- Gregory C. Brown
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS-CMOS device that minimizes outgassing and methods of manufacture
- Patent number 9,862,593
- Issue date Jan 9, 2018
- Invensense, Inc.
- Peter Smeys
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked-die MEMS resonator system
- Patent number 9,821,998
- Issue date Nov 21, 2017
- SiTime Corpoaration
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor
- Patent number 9,809,447
- Issue date Nov 7, 2017
- MIRAMEMS SENSING TECHNOLOGY CO., LTD
- Yu-Hao Chien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Magnet placement for integrated sensor packages
- Patent number 9,791,470
- Issue date Oct 17, 2017
- Intel Corporation
- Feras Eid
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of fabrication of Al/Ge bonding in a wafer packaging environ...
- Patent number 9,751,752
- Issue date Sep 5, 2017
- Invensense, Inc.
- Steven S. Nasiri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
MEMS device and fabrication method
- Patent number 9,731,962
- Issue date Aug 15, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Xuanjie Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device including a MEMS die and a conductive layer
- Patent number 9,725,303
- Issue date Aug 8, 2017
- Infineon Technologies AG
- Dominic Maier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-pressure MEMS package
- Patent number 9,695,039
- Issue date Jul 4, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 9,567,209
- Issue date Feb 14, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated MEMS pressure sensor and MEMS inertial sensor
- Patent number 9,550,668
- Issue date Jan 24, 2017
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Jia Jie Xia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS-CMOS device that minimizes outgassing and methods of manufacture
- Patent number 9,540,228
- Issue date Jan 10, 2017
- Invensense, Inc.
- Peter Smeys
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged sensor assembly
- Patent number 9,540,229
- Issue date Jan 10, 2017
- STMicroelectronics S.r.l.
- Giuseppe Bruno
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
UNDERCUT-FREE PATTERNED ALUMINUM NITRIDE STRUCTURE AND METHODS FOR...
- Publication number 20240368746
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yuan-Chih Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL ELEMENT AND A METHOD FOR MANUFACTURING IT
- Publication number 20230406698
- Publication date Dec 21, 2023
- Murata Manufacturing Co., Ltd.
- Altti TORKKELI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED DIE PACKAGE AND METHODS OF FORMING THE SAME
- Publication number 20230163103
- Publication date May 25, 2023
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
UNDERCUT-FREE PATTERNED ALUMINUM NITRIDE STRUCTURE AND METHODS FOR...
- Publication number 20220325396
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Yuan-Chih Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS FOR PACKAGING A MICROELECTROMECHANICAL SYSTEMS DEVICE
- Publication number 20200391995
- Publication date Dec 17, 2020
- VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
- You QIAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEMS PACKAGES AND METHODS FOR PACKAGING A...
- Publication number 20200189909
- Publication date Jun 18, 2020
- VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
- You QIAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FLUIDIC MICROELECTROMECHANICAL SENSORS/DEVICES AND FABRICATION METH...
- Publication number 20190160462
- Publication date May 30, 2019
- EZMEMS LTD.
- Tsvi SHMILOVICH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDLINE FOR MM-WAVE APPLICATIONS
- Publication number 20180155184
- Publication date Jun 7, 2018
- Innovative Micro Technology
- Christopher S. GUDEMAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATING MEMS STRUCTURES WITH INTERCONNECTS AND VIAS
- Publication number 20180086627
- Publication date Mar 29, 2018
- Intel Corporation
- Kevin LAI LIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FABRICATION OF Al/GE BONDING IN A WAFER PACKAGING ENVIRON...
- Publication number 20170355597
- Publication date Dec 14, 2017
- InvenSense, Inc.
- Steven S. NASIRI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTI-PRESSURE MEMS PACKAGE
- Publication number 20170283250
- Publication date Oct 5, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Chia Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR
- Publication number 20170129774
- Publication date May 11, 2017
- MiraMEMS Sensing Technology Co., Ltd.
- Yu-Hao CHIEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VARIOUS STRESS FREE SENSOR PACKAGES USING WAFER LEVEL SUPPORTING DI...
- Publication number 20170089783
- Publication date Mar 30, 2017
- Apple Inc.
- Caleb C. Han
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH SEAL STRUCTURE
- Publication number 20170081178
- Publication date Mar 23, 2017
- FREESCALE SEMICONDUCTOR, INC.
- THOMAS C. SPEIGHT
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS-CMOS DEVICE THAT MINIMIZES OUTGASSING AND METHODS OF MANUFACTURE
- Publication number 20170073217
- Publication date Mar 16, 2017
- InvenSense, Inc.
- Peter SMEYS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FABRICATION OF AL/GE BONDING IN A WAFER PACKAGING ENVIRON...
- Publication number 20170073223
- Publication date Mar 16, 2017
- InvenSense, Inc.
- Steven S. NASIRI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170066646
- Publication date Mar 9, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEN CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGED SENSOR ASSEMBLY
- Publication number 20160347606
- Publication date Dec 1, 2016
- STMicroelectronics S.r.l.
- Giuseppe BRUNO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SILICON-ON-SAPPHIRE DEVICE WITH MINIMAL THERMAL STRAIN PRELOAD AND...
- Publication number 20160289061
- Publication date Oct 6, 2016
- Honeywell International Inc.
- Gregory C. Brown
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMACHINED MONOLITHIC 3-AXIS GYROSCOPE WITH SINGLE DRIVE
- Publication number 20160264404
- Publication date Sep 15, 2016
- Fairchild Semiconductor Corporation
- Cenk Acar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND FABRICATION METHOD
- Publication number 20160264409
- Publication date Sep 15, 2016
- Semiconductor Manufacturing International (Shangha) Corporation
- XUANJIE LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS-CMOS DEVICE THAT MINIMIZES OUTGASSING AND METHODS OF MANUFACTURE
- Publication number 20160221819
- Publication date Aug 4, 2016
- InvenSense, Inc.
- Peter SMEYS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Methods and Structures of Integrated MEMS-CMOS Devices
- Publication number 20160176708
- Publication date Jun 23, 2016
- MCUBE, INC.
- Sudheer S. Sridharamurthy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PIEZOELECTRIC MICROPHONE WITH INTEGRATED CMOS
- Publication number 20160090300
- Publication date Mar 31, 2016
- InvenSense, Inc.
- Julius Ming-Lin Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CMOS AND MEMS DEVICES WITH AIR DIELETRICS
- Publication number 20160060102
- Publication date Mar 3, 2016
- MCUBE, INC.
- Xiao Charles Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS AND DEVICES FOR MICROELECTROMECHANICAL PRESSURE SENSORS
- Publication number 20160002026
- Publication date Jan 7, 2016
- The Royal Institution for the Advancement of Learning / McGill University
- Vamsy Chodavarapu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR AND MANUFACTURE METHOD THEREOF
- Publication number 20150375994
- Publication date Dec 31, 2015
- MiraMEMS Sensing Technology Co., Ltd.
- Yu-Hao CHIEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATION OF PRESSURE OR INERTIAL SENSORS INTO INTEGRATED CIRCUIT...
- Publication number 20150183635
- Publication date Jul 2, 2015
- Kyu Oh Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH MOLDING VIAS
- Publication number 20150166329
- Publication date Jun 18, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-wen CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LOW-PROFILE STACKED-DIE MEMS RESONATOR SYSTEM
- Publication number 20150123220
- Publication date May 7, 2015
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Feed-through, via

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Undercut-free patterned aluminum nitride structure and methods for...

MEMS resonator system

Stacked-die MEMS resonator

Undercut-free patterned aluminum nitride structure and methods for...

Stacked-die MEMS resonator

Methods for packaging a microelectromechanical systems device

Fluidic microelectromechanical sensors/devices and fabrication meth...

Manufacturing of integrated circuit resonator

Microelectromechanical systems packages and methods for packaging a...

Package structure for micromechanical resonator

Integrating MEMS structures with interconnects and vias

Low-profile stacked-die MEMS resonator system

Monolithic integration of MEMS and IC devices

Micromachined monolithic 3-axis gyroscope with single drive

Various stress free sensor packages using wafer level supporting di...

Micro-resonator having lid-integrated electrode

Methods and structures of integrated MEMS-CMOS devices

Silicon-on-sapphire device with minimal thermal strain preload and...

MEMS-CMOS device that minimizes outgassing and methods of manufacture

Stacked-die MEMS resonator system

Pressure sensor

Magnet placement for integrated sensor packages

Method of fabrication of Al/Ge bonding in a wafer packaging environ...

MEMS device and fabrication method

Semiconductor device including a MEMS die and a conductive layer

Multi-pressure MEMS package

Semiconductor structure and manufacturing method thereof

Integrated MEMS pressure sensor and MEMS inertial sensor

MEMS-CMOS device that minimizes outgassing and methods of manufacture

Packaged sensor assembly

Patents Applicationslast 30 patents

UNDERCUT-FREE PATTERNED ALUMINUM NITRIDE STRUCTURE AND METHODS FOR...

MICROELECTROMECHANICAL ELEMENT AND A METHOD FOR MANUFACTURING IT

STACKED DIE PACKAGE AND METHODS OF FORMING THE SAME

UNDERCUT-FREE PATTERNED ALUMINUM NITRIDE STRUCTURE AND METHODS FOR...

METHODS FOR PACKAGING A MICROELECTROMECHANICAL SYSTEMS DEVICE

MICROELECTROMECHANICAL SYSTEMS PACKAGES AND METHODS FOR PACKAGING A...

FLUIDIC MICROELECTROMECHANICAL SENSORS/DEVICES AND FABRICATION METH...

BONDLINE FOR MM-WAVE APPLICATIONS

INTEGRATING MEMS STRUCTURES WITH INTERCONNECTS AND VIAS

METHOD OF FABRICATION OF Al/GE BONDING IN A WAFER PACKAGING ENVIRON...

MULTI-PRESSURE MEMS PACKAGE

PRESSURE SENSOR

VARIOUS STRESS FREE SENSOR PACKAGES USING WAFER LEVEL SUPPORTING DI...

SEMICONDUCTOR DEVICE PACKAGE WITH SEAL STRUCTURE

MEMS-CMOS DEVICE THAT MINIMIZES OUTGASSING AND METHODS OF MANUFACTURE

METHOD OF FABRICATION OF AL/GE BONDING IN A WAFER PACKAGING ENVIRON...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGED SENSOR ASSEMBLY

SILICON-ON-SAPPHIRE DEVICE WITH MINIMAL THERMAL STRAIN PRELOAD AND...

MICROMACHINED MONOLITHIC 3-AXIS GYROSCOPE WITH SINGLE DRIVE

MEMS DEVICE AND FABRICATION METHOD

MEMS-CMOS DEVICE THAT MINIMIZES OUTGASSING AND METHODS OF MANUFACTURE

Methods and Structures of Integrated MEMS-CMOS Devices

PIEZOELECTRIC MICROPHONE WITH INTEGRATED CMOS

INTEGRATED CMOS AND MEMS DEVICES WITH AIR DIELETRICS

METHODS AND DEVICES FOR MICROELECTROMECHANICAL PRESSURE SENSORS

PRESSURE SENSOR AND MANUFACTURE METHOD THEREOF

INTEGRATION OF PRESSURE OR INERTIAL SENSORS INTO INTEGRATED CIRCUIT...

SEMICONDUCTOR DEVICE WITH THROUGH MOLDING VIAS

LOW-PROFILE STACKED-DIE MEMS RESONATOR SYSTEM