Field-effect transistor [FET]

Industry

CPC
H01L2924/1306

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1306Field-effect transistor [FET]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Gallium nitride (GAN) three-dimensional integrated circuit technology
- Patent number 12,148,747
- Issue date Nov 19, 2024
- Intel Corporation
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming ultra high density embed...
- Patent number 12,148,677
- Issue date Nov 19, 2024
- JCET Semiconductor (Shaoxing) Co., Ltd.
- See Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a shaped epitaxial region with shaping...
- Patent number 12,142,681
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 12,136,562
- Issue date Nov 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and memory...
- Patent number 12,125,737
- Issue date Oct 22, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor chip package including lead frame and manufacturing m...
- Patent number 12,113,008
- Issue date Oct 8, 2024
- Diodes Incorporated
- Shiau-Shi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistor device having a barrier layer wit...
- Patent number 12,100,756
- Issue date Sep 24, 2024
- United Microelectronics Corp.
- Hao-Ming Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 12,100,611
- Issue date Sep 24, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device with encapsulant deposited along sides and sur...
- Patent number 12,094,729
- Issue date Sep 17, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and a conne...
- Patent number 12,080,630
- Issue date Sep 3, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packages with uniform components and methods of forming the...
- Patent number 12,074,149
- Issue date Aug 27, 2024
- MACOM Technology Solutions Holdings, Inc.
- Michael E. Watts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 12,074,213
- Issue date Aug 27, 2024
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device structure integrating air gaps and methods of...
- Patent number 12,068,372
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with bonding and DRAM memory...
- Patent number 12,068,187
- Issue date Aug 20, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device
- Patent number 12,062,651
- Issue date Aug 13, 2024
- Kabushiki Kaisha Toshiba
- Yasuhiro Isobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including source pad region and drain pad regi...
- Patent number 12,062,716
- Issue date Aug 13, 2024
- ANCORA SEMICONDUCTORS INC.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a plurality of semiconductor chips
- Patent number 12,057,441
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Manho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact and die attach metallization for silicon carbide based devi...
- Patent number 12,051,669
- Issue date Jul 30, 2024
- Wolfspeed, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency switching devices having improved voltage handling...
- Patent number 12,040,238
- Issue date Jul 16, 2024
- Skyworks Solutions, Inc.
- Guillaume Alexandre Blin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device package having a lateral power transistor with segmented chi...
- Patent number 12,040,302
- Issue date Jul 16, 2024
- Infineon Technologies Austria AG
- Hyeongnam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 12,033,884
- Issue date Jul 9, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor devices and structures with metal layers
- Patent number 12,027,518
- Issue date Jul 2, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-N transistor arrangements for reducing nonlinearity of off-stat...
- Patent number 12,027,613
- Issue date Jul 2, 2024
- Intel Corporation
- Nidhi Nidhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including stressors
- Patent number 12,016,203
- Issue date Jun 18, 2024
- Samsung Display Co., Ltd.
- Junehwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a necked semiconductor body and method...
- Patent number 12,015,087
- Issue date Jun 18, 2024
- Intel Corporation
- Bernhard Sell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,996,354
- Issue date May 28, 2024
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,990,455
- Issue date May 21, 2024
- Rohm Co., Ltd.
- Hiroyuki Sakairi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of stacked transistors attached by solder balls
- Patent number 11,984,387
- Issue date May 14, 2024
- Kabushiki Kaisha Toshiba
- Toru Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a chip carrier with a pad offset feature
- Patent number 11,984,392
- Issue date May 14, 2024
- Infineon Technologies AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE INTEGRATING AIR GAPS AND METHODS OF...
- Publication number 20240379761
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Ching WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379579
- Publication date Nov 14, 2024
- Dynax Semiconductor, Inc.
- Yi PEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, COMMUNICATION APPARATUS, AND IMAGE CAPTURING...
- Publication number 20240379591
- Publication date Nov 14, 2024
- Canon Kabushiki Kaisha
- TATSUYA MURAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH THREE LEVELS AND ISOLATI...
- Publication number 20240379502
- Publication date Nov 14, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20240379835
- Publication date Nov 14, 2024
- ROHM CO., LTD.
- Isao TAKOBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20240363385
- Publication date Oct 31, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR MODULE ARRANGEMENTS
- Publication number 20240363497
- Publication date Oct 31, 2024
- INFINEON TECHNOLOGIES AG
- Andressa COLVERO SCHITTLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Devices Including Beryllium Metallization
- Publication number 20240355738
- Publication date Oct 24, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING AN OFFSET INTERCONNECT
- Publication number 20240355781
- Publication date Oct 24, 2024
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTION ELEMENT WITH OUTGASSING GROOVES
- Publication number 20240355772
- Publication date Oct 24, 2024
- INFINEON TECHNOLOGIES AG
- Suhaimi Azizan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHOD FOR MANUFACTURING A SEMICONDUCT...
- Publication number 20240312874
- Publication date Sep 19, 2024
- SERIPHY TECHNOLOGY CORPORATION
- TZU-WEI CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
- Publication number 20240304617
- Publication date Sep 12, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER TRANSISTOR CHIP PACKAGE
- Publication number 20240304528
- Publication date Sep 12, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND POWER CONVERSION DEVICE
- Publication number 20240290698
- Publication date Aug 29, 2024
- HITACHI POWER SEMICONDUCTOR DEVICE, LTD.
- Toru MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282749
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Yuki NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240282682
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Yuki NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE ASSEMBLY AND MANUFACTURING METHOD THEREFOR
- Publication number 20240274571
- Publication date Aug 15, 2024
- Tadatomo SUGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, POWER AMPLI...
- Publication number 20240274688
- Publication date Aug 15, 2024
- Huawei Technologies Co., Ltd
- Zhili ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240274513
- Publication date Aug 15, 2024
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240258208
- Publication date Aug 1, 2024
- Rohm Co., Ltd.
- Hajime OKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240258323
- Publication date Aug 1, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVED VOLTAGE HANDLING...
- Publication number 20240249982
- Publication date Jul 25, 2024
- Skyworks Solutions, Inc.
- Guillaume Alexandre BLIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240250057
- Publication date Jul 25, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electric Circuit Body and Power Conversion Device
- Publication number 20240243032
- Publication date Jul 18, 2024
- Hitachi Astemo, Ltd.
- Nobutake TSUYUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
- Publication number 20240222368
- Publication date Jul 4, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240222327
- Publication date Jul 4, 2024
- Innolux Corporation
- Chia-Ping Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A NECKED SEMICONDUCTOR BODY AND METHOD...
- Publication number 20240222509
- Publication date Jul 4, 2024
- Intel Corporation
- Bernhard SELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH BONDING AND DRAM MEMORY...
- Publication number 20240213073
- Publication date Jun 27, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
EMBEDDED DIE PACKAGING OF POWER SEMICONDUCTOR DEVICES
- Publication number 20240213110
- Publication date Jun 27, 2024
- GaN Systems Inc.
- An-Sheng CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE DEVICES (IPD) HAVING A BASEBAND DAMPING RESISTOR...
- Publication number 20240213184
- Publication date Jun 27, 2024
- Wolfspeed, Inc.
- Haedong JANG
- H01 - BASIC ELECTRIC ELEMENTS

Field-effect transistor [FET]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Gallium nitride (GAN) three-dimensional integrated circuit technology

Semiconductor device and method of forming ultra high density embed...

Power amplifier modules including semiconductor resistor and tantal...

Semiconductor device having a shaped epitaxial region with shaping...

3D semiconductor device and structure with single-crystal layers

3D semiconductor device and structure with metal layers and memory...

Semiconductor chip package including lead frame and manufacturing m...

High electron mobility transistor device having a barrier layer wit...

Methods for producing a 3D semiconductor device and structure with...

Semiconductor device with encapsulant deposited along sides and sur...

3D semiconductor device and structure with metal layers and a conne...

Device packages with uniform components and methods of forming the...

Methods and devices for fabricating and assembling printable semico...

Semiconductor device structure integrating air gaps and methods of...

3D semiconductor device and structure with bonding and DRAM memory...

Semiconductor device

Semiconductor device including source pad region and drain pad regi...

Semiconductor package including a plurality of semiconductor chips

Contact and die attach metallization for silicon carbide based devi...

Radio-frequency switching devices having improved voltage handling...

Device package having a lateral power transistor with segmented chi...

Methods for producing a 3D semiconductor device and structure with...

3D semiconductor devices and structures with metal layers

III-N transistor arrangements for reducing nonlinearity of off-stat...

Display device including stressors

Semiconductor device having a necked semiconductor body and method...

Semiconductor device

Semiconductor device

Plurality of stacked transistors attached by solder balls

Semiconductor package having a chip carrier with a pad offset feature

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE STRUCTURE INTEGRATING AIR GAPS AND METHODS OF...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE, COMMUNICATION APPARATUS, AND IMAGE CAPTURING...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH THREE LEVELS AND ISOLATI...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

SEMICONDUCTOR MODULE ARRANGEMENTS

Power Semiconductor Devices Including Beryllium Metallization

INTEGRATED DEVICE COMPRISING AN OFFSET INTERCONNECT

ELECTRICAL CONNECTION ELEMENT WITH OUTGASSING GROOVES

SEMICONDUCTOR STRUCTURES AND METHOD FOR MANUFACTURING A SEMICONDUCT...

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS

POWER TRANSISTOR CHIP PACKAGE

POWER SEMICONDUCTOR MODULE AND POWER CONVERSION DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR SUBSTRATE ASSEMBLY AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, POWER AMPLI...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVED VOLTAGE HANDLING...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Electric Circuit Body and Power Conversion Device

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE HAVING A NECKED SEMICONDUCTOR BODY AND METHOD...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH BONDING AND DRAM MEMORY...

EMBEDDED DIE PACKAGING OF POWER SEMICONDUCTOR DEVICES

INTEGRATED PASSIVE DEVICES (IPD) HAVING A BASEBAND DAMPING RESISTOR...