Filling or covering plated through-holes or blind plated vias

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CPC
H05K3/0094

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/0094Filling or covering plated through-holes or blind plated vias

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package carrier with improved heat dissipation efficiency and manuf...
- Patent number 12,156,325
- Issue date Nov 26, 2024
- Unimicron Technology Corp.
- Ming-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer printed circuit board
- Patent number 12,127,341
- Issue date Oct 22, 2024
- Thales
- Geoffroy Aupee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate, method for manufacturing substrate, and electronic device
- Patent number 12,114,433
- Issue date Oct 8, 2024
- FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
- Hiroshi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buried lines and related fabrication techniques
- Patent number 12,087,758
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Hernan A. Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board having laminated build-up layers
- Patent number 12,057,381
- Issue date Aug 6, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with heat dissipation function
- Patent number 12,052,827
- Issue date Jul 30, 2024
- Hong Heng Sheng Electronical Technology (HuaiAn)Co., Ltd.
- Pan Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of circuit board
- Patent number 12,052,815
- Issue date Jul 30, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Double-sided circuit non-oxide-based ceramic substrate and method f...
- Patent number 12,028,984
- Issue date Jul 2, 2024
- Hitachi Power Solutions Co., Ltd.
- Hideaki Takemori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with a conductive bump mounted on an adhesive layer
- Patent number 12,016,133
- Issue date Jun 18, 2024
- Unimicron Technology Corp.
- Ming-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,991,824
- Issue date May 21, 2024
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertically spaced intra-level interconnect line metallization for i...
- Patent number 11,948,874
- Issue date Apr 2, 2024
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board stack structure and manufacturing method thereof
- Patent number 11,910,535
- Issue date Feb 20, 2024
- Unimicron Technology Corp.
- Ming-Hao Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Injection molded article and method for producing same
- Patent number 11,877,386
- Issue date Jan 16, 2024
- Nissha Co., Ltd.
- Yasuisa Takinishi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Sn—Bi and copper powder conductive paste in through hole of insulat...
- Patent number 11,864,317
- Issue date Jan 2, 2024
- Nichia Corporation
- Masaaki Katsumata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with gradiated dielectric for reducing impedance mismatch
- Patent number 11,837,458
- Issue date Dec 5, 2023
- Intel Corporation
- Jackson Chung Peng Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and manufacturing method thereof and electronic device
- Patent number 11,785,707
- Issue date Oct 10, 2023
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermosetting resin composition, cured product thereof, and printed...
- Patent number 11,746,227
- Issue date Sep 5, 2023
- TAIYO HOLDINGS CO., LTD.
- Tomotaka Noguchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Multilayer circuit board
- Patent number 11,706,878
- Issue date Jul 18, 2023
- INNOGRIT TECHNOLOGIES CO., LTD.
- Yanwen Bai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic control device
- Patent number 11,659,651
- Issue date May 23, 2023
- Hitachi Astemo, Ltd.
- Kazuo Maruyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,641,713
- Issue date May 2, 2023
- Unimicron Technology Corp.
- Chun-Hung Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with heat dissipation function and method for manufac...
- Patent number 11,582,871
- Issue date Feb 14, 2023
- Hong Heng Sheng Electronical Technology (HuaiAn) Co., Ltd
- Pan Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coating of nano-scaled cavities
- Patent number 11,549,184
- Issue date Jan 10, 2023
- AVERATEK CORPORATION
- Sunity K. Sharma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Shield printed wiring board and method of manufacturing shield prin...
- Patent number 11,457,527
- Issue date Sep 27, 2022
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Yuusuke Haruna
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, apparatus and method for forming via hole structure
- Patent number 11,457,529
- Issue date Sep 27, 2022
- ZTE Corporation
- Changgang Yin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing circuit board
- Patent number 11,457,532
- Issue date Sep 27, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Fu-Yun Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 11,452,214
- Issue date Sep 20, 2022
- HELLA GMBH & CO. KGAA
- Ralf Stanzmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with electrically conductive layer structures hav...
- Patent number 11,452,212
- Issue date Sep 20, 2022
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacturing printed wire boards
- Patent number 11,337,309
- Issue date May 17, 2022
- Rohm and Haas Electronic Materials LLC
- Tina Aoude
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin multilayer substrate and electronic apparatus
- Patent number 11,266,016
- Issue date Mar 1, 2022
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240349430
- Publication date Oct 17, 2024
- IBIDEN CO., LTD.
- Kentaro WADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STORAGE
- Publication number 20240324116
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Hayato YAMAGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD STRUCTURE
- Publication number 20240306298
- Publication date Sep 12, 2024
- Unimicron Technology Corp.
- Tzyy-Jang TSENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20240282687
- Publication date Aug 22, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, MANUFACTURING METHOD, AND DISPLAY MODULE
- Publication number 20240284608
- Publication date Aug 22, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Gang Yuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ORGANIC SUBSTRATE-BASED WEARABLE PLATFORM AND METHODS FOR ON-BODY S...
- Publication number 20240268037
- Publication date Aug 8, 2024
- Takaroa Corporation, Inc.
- Ethan M. Devine
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD FOR SEMICONDUCTOR TESTING AND METHOD OF MANUFACTURING...
- Publication number 20240264219
- Publication date Aug 8, 2024
- MPI Corporation
- SHIH-CHING CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD FOR A POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR...
- Publication number 20240260168
- Publication date Aug 1, 2024
- VITESCO TECHNOLOGIES GMBH
- Detlev Bagung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICALLY SPACED INTRA-LEVEL INTERCONNECT LINE METALLIZATION FOR I...
- Publication number 20240243052
- Publication date Jul 18, 2024
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO VIAS FILLED WITH LIQUID METAL FILL
- Publication number 20240196540
- Publication date Jun 13, 2024
- SAMTEC, INC.
- Christopher David BOHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures for Forming Printed Board Interconnects Using Solder
- Publication number 20240172372
- Publication date May 23, 2024
- Conductor Analysis Technologies, Inc.
- Timothy A. Estes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING STRETCHABLE CIRCUIT BOARD, METAL-CLAD LAMI...
- Publication number 20240147609
- Publication date May 2, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Tomohiro FUKAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240098897
- Publication date Mar 21, 2024
- IBIDEN CO., LTD.
- Yoshio MIZUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLVENT-FREE RESIN COMPOSITION AND USES OF THE SAME
- Publication number 20240084063
- Publication date Mar 14, 2024
- TAIWAN UNION TECHNOLOGY CORPORATION
- Jui-Hsiang TANG
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR FORMING THROUGH-VIA METAL WIRING
- Publication number 20240080993
- Publication date Mar 7, 2024
- EXTOLCO.,LTD.
- Sung Woong KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS TO FILL THROUGH-HOLES OF A SUBSTRATE WITH METAL PASTE
- Publication number 20240049397
- Publication date Feb 8, 2024
- Reophotonics, Ltd.
- Michael Zenou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Filing at least One Hole formed in a Printed Circuit Boa...
- Publication number 20230403797
- Publication date Dec 14, 2023
- ITC Intercircuit Electronic GmbH
- Hubertus Hein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND CIRCUIT BOARD MODULE WITH DOCKING STRUCTURE AND M...
- Publication number 20230328900
- Publication date Oct 12, 2023
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITOR IN A SUBSTRATE VIA
- Publication number 20230319997
- Publication date Oct 5, 2023
- Intel Corporation
- Aslam HASWAREY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20230284380
- Publication date Sep 7, 2023
- IBIDEN CO., LTD.
- Kiyoteru OTOMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20230276570
- Publication date Aug 31, 2023
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE
- Publication number 20230262893
- Publication date Aug 17, 2023
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR AT LEAST PARTIALLY CLOSING A CHANNEL-SHAPED OPENING
- Publication number 20230262904
- Publication date Aug 17, 2023
- Peters Research GmbH & Co. Kommanditgesellschaft
- Ralf SCHWARTZ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD MESH ROUTING TO REDUCE SOLDER BALL JOINT FAIL...
- Publication number 20230254968
- Publication date Aug 10, 2023
- Microsoft Technology Licensing, LLC
- Benito Joseph RODRIGUEZ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD STACK STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230240014
- Publication date Jul 27, 2023
- Unimicron Technology Corp.
- Ming-Hao Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INJECTION MOLDED ARTICLE AND METHOD FOR PRODUCING SAME
- Publication number 20230171878
- Publication date Jun 1, 2023
- NISSHA CO., LTD.
- Yasuisa Takinishi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CIRCUIT BOARD WITH HEAT DISSIPATION FUNCTION
- Publication number 20230139231
- Publication date May 4, 2023
- Hong Heng Sheng Electronical Technology (HuaiAn)Co.,Ltd.
- PAN TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMING WAVEGUIDES AND HEAT TRANSFER ELEMENTS IN PRINTED CIRCUIT BO...
- Publication number 20230082429
- Publication date Mar 16, 2023
- TTM TECHNOLOGIES INC.
- Niels Kirkeby
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COAXIAL VIA SHIELDED INTERPOSER
- Publication number 20230063808
- Publication date Mar 2, 2023
- Apple Inc.
- Nima Shahidi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20230063719
- Publication date Mar 2, 2023
- IBIDEN CO., LTD.
- Michimasa TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Filling or covering plated through-holes or blind plated vias

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package carrier with improved heat dissipation efficiency and manuf...

Multilayer printed circuit board

Substrate, method for manufacturing substrate, and electronic device

Buried lines and related fabrication techniques

Circuit board having laminated build-up layers

Circuit board with heat dissipation function

Manufacturing method of circuit board

Double-sided circuit non-oxide-based ceramic substrate and method f...

Circuit board with a conductive bump mounted on an adhesive layer

Advanced device assembly structures and methods

Circuit board structure and manufacturing method thereof

Vertically spaced intra-level interconnect line metallization for i...

Printed circuit board stack structure and manufacturing method thereof

Injection molded article and method for producing same

Sn—Bi and copper powder conductive paste in through hole of insulat...

Substrate with gradiated dielectric for reducing impedance mismatch

Circuit board and manufacturing method thereof and electronic device

Thermosetting resin composition, cured product thereof, and printed...

Multilayer circuit board

Electronic control device

Circuit board structure and manufacturing method thereof

Circuit board with heat dissipation function and method for manufac...

Coating of nano-scaled cavities

Shield printed wiring board and method of manufacturing shield prin...

Circuit board, apparatus and method for forming via hole structure

Method of manufacturing circuit board

Printed circuit board

Component carrier with electrically conductive layer structures hav...

Methods of manufacturing printed wire boards

Resin multilayer substrate and electronic apparatus

Patents Applicationslast 30 patents

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

STORAGE

MANUFACTURING METHOD OF CIRCUIT BOARD STRUCTURE

MANUFACTURING METHOD OF CIRCUIT BOARD

CIRCUIT BOARD, MANUFACTURING METHOD, AND DISPLAY MODULE

ORGANIC SUBSTRATE-BASED WEARABLE PLATFORM AND METHODS FOR ON-BODY S...

CIRCUIT BOARD FOR SEMICONDUCTOR TESTING AND METHOD OF MANUFACTURING...

CIRCUIT BOARD FOR A POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR...

VERTICALLY SPACED INTRA-LEVEL INTERCONNECT LINE METALLIZATION FOR I...

HIGH ASPECT RATIO VIAS FILLED WITH LIQUID METAL FILL

Structures for Forming Printed Board Interconnects Using Solder

METHOD FOR MANUFACTURING STRETCHABLE CIRCUIT BOARD, METAL-CLAD LAMI...

WIRING SUBSTRATE

SOLVENT-FREE RESIN COMPOSITION AND USES OF THE SAME

METHOD FOR FORMING THROUGH-VIA METAL WIRING

METHODS TO FILL THROUGH-HOLES OF A SUBSTRATE WITH METAL PASTE

Method for Filing at least One Hole formed in a Printed Circuit Boa...

CIRCUIT BOARD AND CIRCUIT BOARD MODULE WITH DOCKING STRUCTURE AND M...

CAPACITOR IN A SUBSTRATE VIA

WIRING SUBSTRATE

PRINTED WIRING BOARD

CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE

METHOD FOR AT LEAST PARTIALLY CLOSING A CHANNEL-SHAPED OPENING

PRINTED CIRCUIT BOARD MESH ROUTING TO REDUCE SOLDER BALL JOINT FAIL...

PRINTED CIRCUIT BOARD STACK STRUCTURE AND MANUFACTURING METHOD THEREOF

INJECTION MOLDED ARTICLE AND METHOD FOR PRODUCING SAME

CIRCUIT BOARD WITH HEAT DISSIPATION FUNCTION

FORMING WAVEGUIDES AND HEAT TRANSFER ELEMENTS IN PRINTED CIRCUIT BO...

COAXIAL VIA SHIELDED INTERPOSER

METHOD FOR MANUFACTURING WIRING SUBSTRATE