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H01L2224/78267
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/78267
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Patents Grants
last 30 patents
Information
Patent Grant
Full-automatic deep access ball bonding head device
Patent number
11,437,343
Issue date
Sep 6, 2022
ZHEJIANG RUIQUN TECHNOLOGY CO., LTD.
Wen Chen
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wafer level package using stud bump coated with solder
Patent number
8,071,470
Issue date
Dec 6, 2011
Carsem (M) SDN. BHD.
Lily Khor
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
FULL-AUTOMATIC DEEP ACCESS BALL BONDING HEAD DEVICE
Publication number
20210057374
Publication date
Feb 25, 2021
NINGBO SHANGJIN AUTOMATION TECHNOLOGY CO., LTD.
Wen CHEN
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRICAL CONTACT STRUCTURES SUITABLE FOR USE ON WAFER TRANSLATORS...
Publication number
20120067940
Publication date
Mar 22, 2012
Dodgie Reigh M. Calpito
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WAFER-LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER
Publication number
20120043655
Publication date
Feb 23, 2012
CARSEM (M) SDN. BHD.
Lily Khor
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER
Publication number
20100102444
Publication date
Apr 29, 2010
CARSEM (M) SDN. BHD.
Lily Khor
H01 - BASIC ELECTRIC ELEMENTS