Flash memory

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H01L2924/1438

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/1438Flash memory

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus for using spacer-on-spacer design for solder...
- Patent number 12,368,113
- Issue date Jul 22, 2025
- Micron Technology, Inc.
- Faxing Che
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management
- Patent number 12,367,939
- Issue date Jul 22, 2025
- Micron Technology, Inc.
- Liang Yu
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory devices with backside bond pads under a memory array
- Patent number 12,354,982
- Issue date Jul 8, 2025
- Eric N. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-guided placement of memory device component packages
- Patent number 12,349,278
- Issue date Jul 1, 2025
- SanDisk Technologies, Inc.
- Uthayarajan A/L Rasalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including uneven structures and electronic de...
- Patent number 12,347,795
- Issue date Jul 1, 2025
- Samsung Electronics Co., Ltd.
- Bonggyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded product for semiconductor strip and method of manufacturing...
- Patent number 12,308,253
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Seunghwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device and methods for forming the same
- Patent number 12,300,317
- Issue date May 13, 2025
- Yangtze Memory Technologies Co., Ltd.
- Mingkang Zhang
- G11 - INFORMATION STORAGE
Information Patent Grant
Fan-out semiconductor package
- Patent number 12,283,577
- Issue date Apr 22, 2025
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 12,283,557
- Issue date Apr 22, 2025
- United Microelectronics Corp.
- Aaron Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,268,005
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having package on package structure and method...
- Patent number 12,261,157
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D stack of split graphics processing logic dies
- Patent number 12,243,797
- Issue date Mar 4, 2025
- Kepler Computing Inc.
- Amrita Mathuriya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interposers for microelectronic devices
- Patent number 12,230,583
- Issue date Feb 18, 2025
- Micron Technology, Inc.
- Owen Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,218,092
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Moonyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,205,875
- Issue date Jan 21, 2025
- Kioxia Corporation
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing optically accessible co-packaged optics
- Patent number 12,197,023
- Issue date Jan 14, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip package based on vertical-through-via connector
- Patent number 12,176,278
- Issue date Dec 24, 2024
- iCometrue Company Ltd.
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,159,856
- Issue date Dec 3, 2024
- Kioxia Corporation
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic surface mount passive component
- Patent number 12,142,402
- Issue date Nov 12, 2024
- SanDisk Technologies, Inc.
- Ai-Wen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly containing different size opposing bonding pads and...
- Patent number 12,125,814
- Issue date Oct 22, 2024
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,094,847
- Issue date Sep 17, 2024
- Samsung Electronics Co., Ltd.
- Seyeong Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and manufacturing method of semiconduct...
- Patent number 12,087,753
- Issue date Sep 10, 2024
- SK hynix Inc.
- Nam Jae Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Microelectronic devices having a memory array region, a control log...
- Patent number 12,068,272
- Issue date Aug 20, 2024
- Akira Goda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using hybrid-type adhesive
- Patent number 12,040,300
- Issue date Jul 16, 2024
- Airoha Technology Corp.
- Ying-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a through intervia through the molding...
- Patent number 12,033,976
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package semiconductor assemblies and methods of manufact...
- Patent number 12,033,929
- Issue date Jul 9, 2024
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with unbalanced die stackup
- Patent number 12,027,497
- Issue date Jul 2, 2024
- Western Digital Technologies, Inc.
- Haiyue Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for heuristic-based power gating of non-CMOS l...
- Patent number 12,026,034
- Issue date Jul 2, 2024
- Kepler Computing Inc.
- Amrita Mathuriya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device including first structure having peripheral circuit and seco...
- Patent number 11,990,450
- Issue date May 21, 2024
- Samsung Electronics Co., Ltd.
- Eunji Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CAVITY TAPE FOR PACKAGE PROTECTION
- Publication number 20250239497
- Publication date Jul 24, 2025
- Western Digital Technologies, Inc.
- Ankit Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20250239278
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Kohji Kanamori
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250233093
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Jungmin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC S...
- Publication number 20250218470
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Haemin LEE
- G11 - INFORMATION STORAGE
Information Patent Application
DIELECTRIC WINDOWS FOR GROUPS OF VIAS THROUGH SEMICONDUCTOR SUBSTRATES
- Publication number 20250218933
- Publication date Jul 3, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONITORING OF ELECTRONIC PACKAGES
- Publication number 20250210444
- Publication date Jun 26, 2025
- SK Hynix NAND Product Solutions Corp. (dba Solidigm)
- Jorge MARTINEZ ARAIZA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING PACKAGE ON PACKAGE STRUCTURE AND METHOD...
- Publication number 20250201784
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOURCE SIDE SELECT GATE ELECTRICAL ISOLATION IN NAND MEMORY USING I...
- Publication number 20250194091
- Publication date Jun 12, 2025
- SANDISK TECHNOLOGIES, INC.
- Kazuki Isozumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A COMPOSITE SPACER
- Publication number 20250192129
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Seunghyun BAIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK CHIP PACKAGE
- Publication number 20250183238
- Publication date Jun 5, 2025
- SK HYNIX INC.
- Dong Sop LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UTILIZING MEMORY CHIP THROUGH-SILICON VIAS FOR CONNECTING LOGIC CHI...
- Publication number 20250167191
- Publication date May 22, 2025
- International Business Machines Corporation
- Robert K. Montoye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-LIKE ADHESIVE AND METHOD FOR PRODUCING SAME, INTEGRATED DICING...
- Publication number 20250157976
- Publication date May 15, 2025
- Resonac Corporation
- Tomoyo KANEKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CHIP PACKAGE BASED ON VERTICAL-THROUGH-VIA CONNECTOR
- Publication number 20250125241
- Publication date Apr 17, 2025
- iCometrue Company Ltd.
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING OPTICALLY ACCESSIBLE CO-PACKAGED OPTICS
- Publication number 20250123452
- Publication date Apr 17, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118718
- Publication date Apr 10, 2025
- SK HYNIX INC.
- Heon Yong CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250118620
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Young-Deuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250118652
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Seunghwan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250105213
- Publication date Mar 27, 2025
- Macronix International Co., Ltd.
- Shao-En Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20250105152
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Hansae Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE AND METHOD OF HEATING SEMICONDUCTOR ST...
- Publication number 20250096102
- Publication date Mar 20, 2025
- KIOXIA Corporation
- Kazuma HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE AND SEMICONDUCTOR STORAGE UNIT
- Publication number 20250098068
- Publication date Mar 20, 2025
- KIOXIA Corporation
- Kiyohito NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250070087
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- JOO-YOUNG OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME
- Publication number 20250063729
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Junhyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, CHIP AND FABRICATION METHOD THEREOF, MEMORY S...
- Publication number 20250054905
- Publication date Feb 13, 2025
- Yangtze Memory Technologies Co., Ltd.
- Ping Mo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER CONFIGURED FOR SINGLE TOUCH-DOWN TESTING
- Publication number 20250054818
- Publication date Feb 13, 2025
- SANDISK TECHNOLOGIES, INC.
- Akira Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250038116
- Publication date Jan 30, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Da Hee JOUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER ALLOY, SOLDER JOINT, AND SEMICONDUCTOR PACKAGE INCLUDING SOL...
- Publication number 20250006680
- Publication date Jan 2, 2025
- DUKSAN HI-METAL CO., LTD.
- Eun Kwang PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429192
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- CHAJEA JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240421122
- Publication date Dec 19, 2024
- KIOXIA Corporation
- Masayuki MIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421011
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- WanSun Kim
- H01 - BASIC ELECTRIC ELEMENTS

Flash memory

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods and apparatus for using spacer-on-spacer design for solder...

Power management

Memory devices with backside bond pads under a memory array

Self-guided placement of memory device component packages

Semiconductor package including uneven structures and electronic de...

Molded product for semiconductor strip and method of manufacturing...

Three-dimensional memory device and methods for forming the same

Fan-out semiconductor package

Integrated circuit structure

Semiconductor structure

Semiconductor device having package on package structure and method...

3D stack of split graphics processing logic dies

Interposers for microelectronic devices

Semiconductor package and method of manufacturing semiconductor pac...

Semiconductor device and manufacturing method thereof

Manufacturing optically accessible co-packaged optics

3D chip package based on vertical-through-via connector

Method for manufacturing semiconductor device

Monolithic surface mount passive component

Integrated fan-out package and the methods of manufacturing

Bonded assembly containing different size opposing bonding pads and...

Semiconductor package and method of manufacturing the same

Semiconductor memory device and manufacturing method of semiconduct...

Microelectronic devices having a memory array region, a control log...

Semiconductor package using hybrid-type adhesive

Semiconductor package having a through intervia through the molding...

Package-on-package semiconductor assemblies and methods of manufact...

Semiconductor device with unbalanced die stackup

Method and apparatus for heuristic-based power gating of non-CMOS l...

Device including first structure having peripheral circuit and seco...

Patents Applicationslast 30 patents

CAVITY TAPE FOR PACKAGE PROTECTION

MEMORY DEVICE

SEMICONDUCTOR PACKAGE

THREE-DIMENSIONAL (3D) SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC S...

DIELECTRIC WINDOWS FOR GROUPS OF VIAS THROUGH SEMICONDUCTOR SUBSTRATES

MONITORING OF ELECTRONIC PACKAGES

SEMICONDUCTOR DEVICE HAVING PACKAGE ON PACKAGE STRUCTURE AND METHOD...

SOURCE SIDE SELECT GATE ELECTRICAL ISOLATION IN NAND MEMORY USING I...

SEMICONDUCTOR PACKAGE INCLUDING A COMPOSITE SPACER

STACK CHIP PACKAGE

UTILIZING MEMORY CHIP THROUGH-SILICON VIAS FOR CONNECTING LOGIC CHI...

FILM-LIKE ADHESIVE AND METHOD FOR PRODUCING SAME, INTEGRATED DICING...

3D CHIP PACKAGE BASED ON VERTICAL-THROUGH-VIA CONNECTOR

MANUFACTURING OPTICALLY ACCESSIBLE CO-PACKAGED OPTICS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SEMICONDUCTOR STORAGE DEVICE AND METHOD OF HEATING SEMICONDUCTOR ST...

SEMICONDUCTOR STORAGE DEVICE AND SEMICONDUCTOR STORAGE UNIT

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME

SEMICONDUCTOR DEVICE, CHIP AND FABRICATION METHOD THEREOF, MEMORY S...

SEMICONDUCTOR WAFER CONFIGURED FOR SINGLE TOUCH-DOWN TESTING

PRINTED CIRCUIT BOARD

SOLDER ALLOY, SOLDER JOINT, AND SEMICONDUCTOR PACKAGE INCLUDING SOL...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE