Flash memory

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H01L2924/1438

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/1438Flash memory

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Interposers for microelectronic devices
- Patent number 12,230,583
- Issue date Feb 18, 2025
- Micron Technology, Inc.
- Owen Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,218,092
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Moonyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,205,875
- Issue date Jan 21, 2025
- Kioxia Corporation
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing optically accessible co-packaged optics
- Patent number 12,197,023
- Issue date Jan 14, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip package based on vertical-through-via connector
- Patent number 12,176,278
- Issue date Dec 24, 2024
- iCometrue Company Ltd.
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,159,856
- Issue date Dec 3, 2024
- Kioxia Corporation
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic surface mount passive component
- Patent number 12,142,402
- Issue date Nov 12, 2024
- SanDisk Technologies, Inc.
- Ai-Wen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly containing different size opposing bonding pads and...
- Patent number 12,125,814
- Issue date Oct 22, 2024
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,094,847
- Issue date Sep 17, 2024
- Samsung Electronics Co., Ltd.
- Seyeong Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and manufacturing method of semiconduct...
- Patent number 12,087,753
- Issue date Sep 10, 2024
- SK hynix Inc.
- Nam Jae Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Microelectronic devices having a memory array region, a control log...
- Patent number 12,068,272
- Issue date Aug 20, 2024
- Akira Goda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using hybrid-type adhesive
- Patent number 12,040,300
- Issue date Jul 16, 2024
- Airoha Technology Corp.
- Ying-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a through intervia through the molding...
- Patent number 12,033,976
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package semiconductor assemblies and methods of manufact...
- Patent number 12,033,929
- Issue date Jul 9, 2024
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with unbalanced die stackup
- Patent number 12,027,497
- Issue date Jul 2, 2024
- Western Digital Technologies, Inc.
- Haiyue Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for heuristic-based power gating of non-CMOS l...
- Patent number 12,026,034
- Issue date Jul 2, 2024
- Kepler Computing Inc.
- Amrita Mathuriya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device including first structure having peripheral circuit and seco...
- Patent number 11,990,450
- Issue date May 21, 2024
- Samsung Electronics Co., Ltd.
- Eunji Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and electronic systems including the same
- Patent number 11,967,623
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Sunggil Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding apparatus and method
- Patent number 11,955,454
- Issue date Apr 9, 2024
- Yangtze Memory Technologies Co., Ltd.
- Guoliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic system
- Patent number 11,955,470
- Issue date Apr 9, 2024
- Samsung Electronics Co., Ltd.
- Jiwon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly including an airgap containing bonding-level dielec...
- Patent number 11,948,902
- Issue date Apr 2, 2024
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices with backside bond pads under a memory array
- Patent number 11,935,853
- Issue date Mar 19, 2024
- Eric N. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management
- Patent number 11,935,602
- Issue date Mar 19, 2024
- Micron Technology, Inc.
- Liang Yu
- G11 - INFORMATION STORAGE
Information Patent Grant
Stack package and methods of manufacturing the same
- Patent number 11,929,262
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Jae-in Won
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device having chip stacked a...
- Patent number 11,923,287
- Issue date Mar 5, 2024
- Kabushiki Kaisha Toshiba
- Takayuki Tajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device having vertical structure including a first wafer and...
- Patent number 11,917,818
- Issue date Feb 27, 2024
- SK hynix Inc.
- Sung Lae Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and fabrication method thereof
- Patent number 11,901,318
- Issue date Feb 13, 2024
- United Microelectronics Corp.
- Aaron Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and test method of semiconductor device
- Patent number 11,892,503
- Issue date Feb 6, 2024
- Toshiba Tec Kabushiki Kaisha
- Takuya Kusaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical semiconductor device with side grooves
- Patent number 11,894,343
- Issue date Feb 6, 2024
- Western Digital Technologies, Inc.
- Xianlu Cui
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME
- Publication number 20250063729
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Junhyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, CHIP AND FABRICATION METHOD THEREOF, MEMORY S...
- Publication number 20250054905
- Publication date Feb 13, 2025
- Yangtze Memory Technologies Co., Ltd.
- Ping Mo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER CONFIGURED FOR SINGLE TOUCH-DOWN TESTING
- Publication number 20250054818
- Publication date Feb 13, 2025
- SANDISK TECHNOLOGIES, INC.
- Akira Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250038116
- Publication date Jan 30, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Da Hee JOUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER ALLOY, SOLDER JOINT, AND SEMICONDUCTOR PACKAGE INCLUDING SOL...
- Publication number 20250006680
- Publication date Jan 2, 2025
- DUKSAN HI-METAL CO., LTD.
- Eun Kwang PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429192
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- CHAJEA JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240421122
- Publication date Dec 19, 2024
- KIOXIA Corporation
- Masayuki MIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421011
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- WanSun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240413037
- Publication date Dec 12, 2024
- Jin-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240404972
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Seyeong Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES HAVING SIGNAL ROUTING STRUCTURES AT BONDING INTERFACES
- Publication number 20240404976
- Publication date Dec 5, 2024
- Lodestar Licensing Group LLC
- Akira Goda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCT...
- Publication number 20240395788
- Publication date Nov 28, 2024
- SK HYNIX INC.
- Nam Jae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF
- Publication number 20240379369
- Publication date Nov 14, 2024
- Yangtze Memory Technologies Co., Ltd.
- Qingyi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME
- Publication number 20240347498
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Daesik MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING CONTROL CHIP INCLUDING CHIP ENABLE...
- Publication number 20240339435
- Publication date Oct 10, 2024
- SK HYNIX INC.
- Ki Yong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACT...
- Publication number 20240339390
- Publication date Oct 10, 2024
- Lodestar Licensing Group LLC
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240339420
- Publication date Oct 10, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- JU BIN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240321823
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Donguk Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE...
- Publication number 20240321679
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Youngjoon KOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240312920
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- Keunho CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES WITH BACKSIDE BOND PADS UNDER A MEMORY ARRAY
- Publication number 20240312933
- Publication date Sep 19, 2024
- Lodestar Licensing Group LLC
- Eric N. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240312974
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- KYOUNGLIM SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312868
- Publication date Sep 19, 2024
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package with Die Stackup and Interposer
- Publication number 20240312916
- Publication date Sep 19, 2024
- Western Digital Technologies, Inc.
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240304576
- Publication date Sep 12, 2024
- KIOXIA Corporation
- Yuya KIYOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240304579
- Publication date Sep 12, 2024
- Macronix International Co., Ltd.
- Dai-Ying LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH THERMAL DISSIPATION FEATURES FOR A FLIP CHIP STRUCTURE
- Publication number 20240304515
- Publication date Sep 12, 2024
- Western Digital Technologies, Inc.
- Xuyi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF
- Publication number 20240304607
- Publication date Sep 12, 2024
- KIOXIA Corporation
- Kazuma HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240298444
- Publication date Sep 5, 2024
- KIOXIA Corporation
- Mitsuhiko NODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240297150
- Publication date Sep 5, 2024
- Samsung Electronics Co., Ltd.
- Jongpa HONG
- H01 - BASIC ELECTRIC ELEMENTS

Flash memory

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interposers for microelectronic devices

Semiconductor package and method of manufacturing semiconductor pac...

Semiconductor device and manufacturing method thereof

Manufacturing optically accessible co-packaged optics

3D chip package based on vertical-through-via connector

Method for manufacturing semiconductor device

Monolithic surface mount passive component

Integrated fan-out package and the methods of manufacturing

Bonded assembly containing different size opposing bonding pads and...

Semiconductor package and method of manufacturing the same

Semiconductor memory device and manufacturing method of semiconduct...

Microelectronic devices having a memory array region, a control log...

Semiconductor package using hybrid-type adhesive

Semiconductor package having a through intervia through the molding...

Package-on-package semiconductor assemblies and methods of manufact...

Semiconductor device with unbalanced die stackup

Method and apparatus for heuristic-based power gating of non-CMOS l...

Device including first structure having peripheral circuit and seco...

Semiconductor devices and electronic systems including the same

Wafer bonding apparatus and method

Semiconductor device and electronic system

Bonded assembly including an airgap containing bonding-level dielec...

Memory devices with backside bond pads under a memory array

Power management

Stack package and methods of manufacturing the same

Method for manufacturing semiconductor device having chip stacked a...

Memory device having vertical structure including a first wafer and...

Integrated circuit structure and fabrication method thereof

Semiconductor device and test method of semiconductor device

Vertical semiconductor device with side grooves

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME

SEMICONDUCTOR DEVICE, CHIP AND FABRICATION METHOD THEREOF, MEMORY S...

SEMICONDUCTOR WAFER CONFIGURED FOR SINGLE TOUCH-DOWN TESTING

PRINTED CIRCUIT BOARD

SOLDER ALLOY, SOLDER JOINT, AND SEMICONDUCTOR PACKAGE INCLUDING SOL...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

MEMORY DEVICES HAVING SIGNAL ROUTING STRUCTURES AT BONDING INTERFACES

SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCT...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF

MEMORY DEVICES, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING CONTROL CHIP INCLUDING CHIP ENABLE...

PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACT...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE...

SEMICONDUCTOR PACKAGE

MEMORY DEVICES WITH BACKSIDE BOND PADS UNDER A MEMORY ARRAY

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

Semiconductor Device Package with Die Stackup and Interposer

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

HIGH THERMAL DISSIPATION FEATURES FOR A FLIP CHIP STRUCTURE

SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE