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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Current Industry
H01L21/4821
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Patents Grants
last 30 patents
Information
Patent Grant
Method for manufacturing leadless semiconductor package with wettab...
Patent number
11,929,259
Issue date
Mar 12, 2024
STMicroelectronics, Inc.
Ian Harvey Arellano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead-frame assembly, semiconductor package and methods for improved...
Patent number
11,923,275
Issue date
Mar 5, 2024
NXP USA, INC.
Allen Marfil Descartin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device and method for manufacturing same
Patent number
11,901,253
Issue date
Feb 13, 2024
Denso Corporation
Wataru Kobayashi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Package with an electrode-attached frame supported by a heat sink,...
Patent number
11,901,268
Issue date
Feb 13, 2024
NGK Electronics Devices, Inc.
Yoshio Tsukiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High voltage semiconductor device lead frame and method of fabrication
Patent number
11,881,445
Issue date
Jan 23, 2024
Texas Instruments Incorporated
Enis Tuncer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package component
Patent number
11,869,857
Issue date
Jan 9, 2024
AMOSENSE CO., LTD
Ji-Hyung Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframe package using selectively pre-plated leadframe
Patent number
11,869,832
Issue date
Jan 9, 2024
STMicroelectronics S.r.l.
Paolo Crema
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device for improving heat dissipation and mounting st...
Patent number
11,842,951
Issue date
Dec 12, 2023
Rohm Co., Ltd.
Ippei Yasutake
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flexible circuit board, COF module and electronic device including...
Patent number
11,800,639
Issue date
Oct 24, 2023
LG Innotek Co., Ltd
Jun Young Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Coated semiconductor devices
Patent number
11,791,248
Issue date
Oct 17, 2023
Texas Instruments Incorporated
Sreenivasan Kalyani Koduri
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frame, semiconductor device, and lead frame manufacturing method
Patent number
11,791,250
Issue date
Oct 17, 2023
Shinko Electric Industries Co., Ltd.
Shintaro Hayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Universal semiconductor package molds
Patent number
11,791,170
Issue date
Oct 17, 2023
Texas Instruments Incorporated
Anis Fauzi Bin Abdul Aziz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for creating a wettable surface for improved reliability in...
Patent number
11,791,168
Issue date
Oct 17, 2023
Texas Instruments Incorporated
Sadia Naseem
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and methods of forming the same
Patent number
11,769,716
Issue date
Sep 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yung-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frames having rounded corners and related packages and methods
Patent number
11,769,713
Issue date
Sep 26, 2023
Microchip Technology Incorporated
Behrooz Mehr
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packages with multiple exposed pads
Patent number
11,735,506
Issue date
Aug 22, 2023
Texas Instruments Incorporated
Hung-Yu Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-pitch leads
Patent number
11,694,947
Issue date
Jul 4, 2023
Texas Instruments Incorporated
Sreenivasan K. Koduri
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Isolated temperature sensor device package
Patent number
11,658,101
Issue date
May 23, 2023
Texas Instruments Incorporated
Enis Tuncer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die attachment method and material between a semiconductor device a...
Patent number
11,640,931
Issue date
May 2, 2023
STMicroelectronics S.r.l.
Paolo Crema
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flexible circuit board, COF module and electronic device including...
Patent number
11,622,444
Issue date
Apr 4, 2023
LG Innotek Co., Ltd
Jun Young Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package assembly and method for manufacturing the same
Patent number
11,605,578
Issue date
Mar 14, 2023
Silergy Semiconductor Technology (Hangzhou) Ltd.
Shijie Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged electronic device and multilevel lead frame coupler
Patent number
11,600,581
Issue date
Mar 7, 2023
Texas Instruments Incorporated
Juan Alejandro Herbsommer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Processing method of wafer
Patent number
11,600,513
Issue date
Mar 7, 2023
Disco Corporation
Masaru Nakamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package substrate having integrated passive device(s) between leads
Patent number
11,600,555
Issue date
Mar 7, 2023
Texas Instruments Incorporated
Rajen Manicon Murugan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip to chip interconnect in encapsulant of molded semiconductor pa...
Patent number
11,569,196
Issue date
Jan 31, 2023
Infineon Technologies AG
Khay Chwan Saw
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting device, resin-attached lead frame, and methods of ma...
Patent number
11,515,458
Issue date
Nov 29, 2022
Nichia Corporation
Yukitoshi Marutani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Spacer frame for semiconductor packages
Patent number
11,450,593
Issue date
Sep 20, 2022
Infineon Technologies AG
Ivan Nikitin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frames for semiconductor packages with increased reliability a...
Patent number
11,430,718
Issue date
Aug 30, 2022
Microchip Technology Incorporated
Behrooz Mehr
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip-on-chip power card with embedded direct liquid cooling
Patent number
11,404,351
Issue date
Aug 2, 2022
Toyota Motor Engineering & Manufacturing North America, Inc.
Feng Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flexible circuit board, COF module and electronic device including...
Patent number
11,395,403
Issue date
Jul 19, 2022
LG Innotek Co., Ltd
Jun Young Lim
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
QFN PACKAGE AND FABRICATING METHOD OF THE SAME
Publication number
20240128168
Publication date
Apr 18, 2024
UNITED MICROELECTRONICS CORP.
Chiu-Feng Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240112994
Publication date
Apr 4, 2024
Littelfuse Semiconductor (Wuxi) Co., Ltd
Lucas Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL A...
Publication number
20240096769
Publication date
Mar 21, 2024
NEXPERIA B.V.
Haibo Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE FOR ASYMMETRIC TRANSIENT VOLTAGE SUPPRESSOR
Publication number
20240096763
Publication date
Mar 21, 2024
Littelfuse Semiconductor (Wuxi) Co., Ltd
Lucas Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEADLESS CURRENT SENSOR PACKAGE WITH HIGH ISOLATION
Publication number
20240044946
Publication date
Feb 8, 2024
ALLEGRO MICROSYSTEMS, LLC
Robert A. Briano
G01 - MEASURING TESTING
Information
Patent Application
METHOD FOR CREATING A WETTABLE SURFACE FOR IMPROVED RELIABILITY IN...
Publication number
20240047226
Publication date
Feb 8, 2024
TEXAS INSTRUMENTS INCORPORATED
Sadia Naseem
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MOUNTING STRUCTURE THEREOF
Publication number
20240030107
Publication date
Jan 25, 2024
Rohm Co., Ltd.
Ippei YASUTAKE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
Publication number
20240014105
Publication date
Jan 11, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yung-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE WITH STAR-CONNECTED LEAD
Publication number
20240006273
Publication date
Jan 4, 2024
TEXAS INSTRUMENTS INCORPORATED
Kumar Anurag SHRIVASTAVA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERDIGITAL CAPACITOR
Publication number
20230402356
Publication date
Dec 14, 2023
TEXAS INSTRUMENTS INCORPORATED
Yiqi Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGES WITH MULTIPLE EXPOSED PADS
Publication number
20230395472
Publication date
Dec 7, 2023
TEXAS INSTRUMENTS INCORPORATED
Hung-Yu CHOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SILVER SINTERED MOLYBDENUM (SSM) PACKAGING FOR POWER SEMICONDUCTOR...
Publication number
20230352372
Publication date
Nov 2, 2023
McMaster University
Yuhang Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20230352313
Publication date
Nov 2, 2023
RENESAS ELECTRONICS CORPORATION
Toshiyuki HATA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEAD FINGER WITH Z-DIRECTION OBSTRUCTION FEATURE
Publication number
20230317571
Publication date
Oct 5, 2023
TEXAS INSTRUMENTS INCORPORATED
Hsiang Ming Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING TH...
Publication number
20230317574
Publication date
Oct 5, 2023
HAESUNG DS CO., LTD.
Suyoen SON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20230298983
Publication date
Sep 21, 2023
Hitachi Astemo, Ltd.
Osamu IKEDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE WITH IMPROVED BOARD LEVEL RELIABILITY
Publication number
20230298982
Publication date
Sep 21, 2023
TEXAS INSTRUMENTS INCORPORATED
Nazila Dadvand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ISOLATED TEMPERATURE SENSOR DEVICE PACKAGE
Publication number
20230298979
Publication date
Sep 21, 2023
TEXAS INSTRUMENTS INCORPORATED
Enis TUNCER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH OVERLAPPING LEADS AND DIE PAD
Publication number
20230275008
Publication date
Aug 31, 2023
STMICROELECTRONICS, INC.
Jefferson TALLEDO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SENSOR PACKAGE WITH CAVITY CREATED USING SACRIFICIAL MATERIAL
Publication number
20230253281
Publication date
Aug 10, 2023
TEXAS INSTRUMENTS INCORPORATED
Daiki Komatsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLEXIBLE CIRCUIT BOARD, COF MODULE AND ELECTRONIC DEVICE INCLUDING...
Publication number
20230209705
Publication date
Jun 29, 2023
LG Innotek Co., Ltd.
Jun Young LIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE SUBSTRATE HAVING INTEGRATED PASSIVE DEVICE(S) BETWEEN LEADS
Publication number
20230207430
Publication date
Jun 29, 2023
TEXAS INSTRUMENTS INCORPORATED
Rajen Manicon Murugan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20230187225
Publication date
Jun 15, 2023
Mitsubishi Electric Corporation
Naoki YOSHIMATSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE ATTACHMENT METHOD FOR SEMICONDUCTOR DEVICES AND CORRESPONDING S...
Publication number
20230187296
Publication date
Jun 15, 2023
STMicroelectronics S.r.l.
Guendalina CATALANO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEADLESS SEMICONDUCTOR PACKAGE WITH SHIELDED DIE-TO-PAD CONTACTS
Publication number
20230187321
Publication date
Jun 15, 2023
NXP USA, Inc.
Pat Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEADFRAME WITH PRE-SEPARATED LEADS
Publication number
20230133029
Publication date
May 4, 2023
Texas Instruments Incorporated
Makoto Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE WITH WETTABLE FLANK LEAD
Publication number
20230114872
Publication date
Apr 13, 2023
TEXAS INSTRUMENTS INCORPORATED
Nazila Dadvand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER SURFACE FEATURES FOR INTEGRATED CIRCUIT PACKAGES
Publication number
20230069741
Publication date
Mar 2, 2023
TEXAS INSTRUMENTS INCORPORATED
AMIRUL AFIQ BIN HUD
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE WITH STEPPED SIDE SURFACE
Publication number
20230017286
Publication date
Jan 19, 2023
TEXAS INSTRUMENTS INCORPORATED
Rongwei Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SUBSTRATES FOR SEMICONDUCTOR DEVICES, CORRE...
Publication number
20230005824
Publication date
Jan 5, 2023
STMicroelectronics S.r.l
Mauro MAZZOLA
H01 - BASIC ELECTRIC ELEMENTS