Flat leads

Industry

CPC
H05K2201/10818

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10818Flat leads

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device, printed circuit board (PCB), and method of in...
- Patent number 12,080,634
- Issue date Sep 3, 2024
- The Noco Company
- James P. McBride
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical component and a method for producing an electrical compo...
- Patent number 11,342,126
- Issue date May 24, 2022
- EPCOS AG
- Markus Koini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connection contact for a ceramic component, a ceramic co...
- Patent number 10,943,740
- Issue date Mar 9, 2021
- EPCOS AG
- Markus Koini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with relay mounted to substrate
- Patent number 10,945,336
- Issue date Mar 9, 2021
- TE Connectivity Corporation
- Ronald Martin Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-cost superior performance coinless RF power amplifier
- Patent number 10,912,185
- Issue date Feb 2, 2021
- Telefonaktiebolaget LM Ericsson (publ)
- Reginald Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting a power amplifier (AP) assembly
- Patent number 10,842,028
- Issue date Nov 17, 2020
- Telefonaktiebolaget LM Ericsson (publ)
- Ronald Nehring
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressing of wire bond wire tips to provide bent-over tips
- Patent number 10,806,036
- Issue date Oct 13, 2020
- Invensas Corporation
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit assembly with increased mounting area
- Patent number 10,652,994
- Issue date May 12, 2020
- AutoNetworks Technologies, Ltd.
- Arinobu Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency transformer
- Patent number 10,398,029
- Issue date Aug 27, 2019
- Fuji Electric Co., Ltd.
- Qichen Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connection contact for a ceramic component, a ceramic co...
- Patent number 10,395,843
- Issue date Aug 27, 2019
- Epcos AG
- Markus Koini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Special electric component, printed circuit board assembly, and met...
- Patent number 10,264,679
- Issue date Apr 16, 2019
- The Procter & Gamble Company
- Christian Ellsaesser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressing of wire bond wire tips to provide bent-over tips
- Patent number 9,888,579
- Issue date Feb 6, 2018
- Invensas Corporation
- Reynaldo Co
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Printed circuit assembly for a solenoid module for an automatic tra...
- Patent number 9,844,137
- Issue date Dec 12, 2017
- Advanced Powertrain Engineering, LLC
- Paul Fathauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer ceramic electronic component and board having the same
- Patent number 9,818,541
- Issue date Nov 14, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed substrate and printed substrate with terminal using same
- Patent number 9,728,869
- Issue date Aug 8, 2017
- Sumitomo Wiring Systems, Ltd.
- Hideki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder spacer and electronic module comprising such a spacer
- Patent number 9,629,245
- Issue date Apr 18, 2017
- Sagemcom Broadband SAS
- Stephane Kohn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solid electrolytic capacitor for embedding into a circuit board
- Patent number 9,545,008
- Issue date Jan 10, 2017
- AVX Corporation
- Stanislav Zednicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic part and electronic control unit
- Patent number 9,332,645
- Issue date May 3, 2016
- Denso Corporation
- Yuuto Kamiya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit assembly for a solenoid module for an automatic tra...
- Patent number 9,198,301
- Issue date Nov 24, 2015
- Advanced Powertrain Engineering, LLC
- Paul Fathauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure of light emitting diode and method to assemble thereof
- Patent number 8,987,770
- Issue date Mar 24, 2015
- Everlight Electronics Co., Ltd.
- Sheng-Jia Sheu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting apparatus and light unit having the same
- Patent number 8,950,925
- Issue date Feb 10, 2015
- LG Innotek Co., Ltd
- Kyong Jun Kim
- F21 - LIGHTING
Information Patent Grant
Printed circuit board unit
- Patent number 8,884,167
- Issue date Nov 11, 2014
- SHINANO KENSHI CO., LTD.
- Kazuya Miyasaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging board with visual recognition windows
- Patent number 8,867,220
- Issue date Oct 21, 2014
- Sumitomo Wiring Systems, Ltd.
- Yukinori Kita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting apparatus and light unit having the same
- Patent number 8,646,963
- Issue date Feb 11, 2014
- LG Innotek Co., Ltd
- Kyong Jun Kim
- F21 - LIGHTING
Information Patent Grant
Process of manufacturing a light
- Patent number 8,601,682
- Issue date Dec 10, 2013
- Nexxus Lighting, Incorporated
- Zdenko Grajcar
- F21 - LIGHTING
Information Patent Grant
Low profile compliant leads
- Patent number 8,481,862
- Issue date Jul 9, 2013
- General Dynamics Advanced Information Systems, Inc.
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector having a terminal with a tin plated contact pressed again...
- Patent number 8,403,684
- Issue date Mar 26, 2013
- Mitsubishi Electric Corporation
- Norikazu Tateishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Secondary battery protecting module and lead mounting method
- Patent number 8,305,768
- Issue date Nov 6, 2012
- Mitsumi Electric Co., Ltd
- Itaru Takeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting apparatus and light unit having the same
- Patent number 8,277,107
- Issue date Oct 2, 2012
- LG Innotek Co., Ltd
- Kyong Jun Kim
- F21 - LIGHTING
Information Patent Grant
Submount for electronic components
- Patent number 8,259,460
- Issue date Sep 4, 2012
- Koninklijke Philips Electronics N.V.
- Rabin Bhattacharya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240341036
- Publication date Oct 10, 2024
- Darwin Precisions Corporation
- Yi Feng Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VARYING DIAMETERS OF POWER-VIAS IN A PCB BASED ON VIA LOCATION
- Publication number 20240260188
- Publication date Aug 1, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Brian Mark Hostetler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-POWER ELECTRONICS DEVICES AND METHODS FOR MANUFACTURING SAME
- Publication number 20240006403
- Publication date Jan 4, 2024
- Molex, LLC
- Victor Zaderej
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20230309229
- Publication date Sep 28, 2023
- TDK Corporation
- Takeshi OOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE WITH RELAY MOUNTED TO SUBSTRATE
- Publication number 20190387627
- Publication date Dec 19, 2019
- TE Connectivity Corporation
- Ronald Martin Weber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONNECTION CONTACT FOR A CERAMIC COMPONENT, A CERAMIC CO...
- Publication number 20190304702
- Publication date Oct 3, 2019
- EPCOS AG
- Markus Koini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SLIDE AND MOUNT MANUFACTURING FOR COINLESS RF POWER AMPLIFIER
- Publication number 20180310416
- Publication date Oct 25, 2018
- Telefonaktiebolaget LM Ericsson (publ)
- Ronald NEHRING
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT ASSEMBLY
- Publication number 20180310410
- Publication date Oct 25, 2018
- AUTONETWORKS TECHNOLOGIES, LTD.
- Arinobu Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pressing of Wire Bond Wire Tips to Provide Bent-Over Tips
- Publication number 20180146557
- Publication date May 24, 2018
- Invensas Corporation
- Reynaldo CO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ELECTRICAL CONNECTION CONTACT FOR A CERAMIC COMPONENT, A CERAMIC CO...
- Publication number 20180047507
- Publication date Feb 15, 2018
- EPCOS AG
- Markus Koini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PART AND ELECTRONIC CONTROL UNIT
- Publication number 20140240885
- Publication date Aug 28, 2014
- Murata Manufacturing Co., Ltd.
- Yuuto KAMIYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING APPARATUS AND LIGHT UNIT HAVING THE SAME
- Publication number 20140146549
- Publication date May 29, 2014
- LG Innotek Co., Ltd.
- Kyong Jun KIM
- G02 - OPTICS
Information Patent Application
LIGHT EMITTING APPARATUS AND LIGHT UNIT HAVING THE SAME
- Publication number 20120326203
- Publication date Dec 27, 2012
- Kyong Jun KIM
- G02 - OPTICS
Information Patent Application
PRINTED CIRCUIT BOARD UNIT
- Publication number 20120181077
- Publication date Jul 19, 2012
- SHINANO KENSHI CO., LTD.
- Kazuya MIYASAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING BOARD
- Publication number 20120145436
- Publication date Jun 14, 2012
- SUMITOMO WIRING SYSTEMS, LTD.
- Yukinori Kita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING APPARATUS AND LIGHT UNIT HAVING THE SAME
- Publication number 20120007136
- Publication date Jan 12, 2012
- Kyong Jun KIM
- G02 - OPTICS
Information Patent Application
PRINTED CIRCUIT ASSEMBLY FOR A SOLENOID MODULE FOR AN AUTOMATIC TRA...
- Publication number 20110248200
- Publication date Oct 13, 2011
- ADVANCED POWERTRAIN ENGINEERING, LLC
- Paul Fathauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE FOR CONNECTING CONNECTOR, AND HEAD LAMP LIGHT SOURCE LIGH...
- Publication number 20110235348
- Publication date Sep 29, 2011
- Norikazu Tateishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE OF LIGHT EMITTING DIODE AND METHOD TO ASSEMBLE THEREOF
- Publication number 20110198663
- Publication date Aug 18, 2011
- EVERLIGHT YI-GUANG TECHNOLOGY (SHANGHAI) LTD
- Sheng-Jia Sheu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RECEPTACLE STRUCTURE, PRINTED WIRING BOARD STRUCTURE, AND ELECTRONI...
- Publication number 20110201214
- Publication date Aug 18, 2011
- PANASONIC CORPORATION
- Ryou MATSUBARA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
LIGHT EMITTING APPARATUS AND LIGHT UNIT HAVING THE SAME
- Publication number 20110103061
- Publication date May 5, 2011
- Kyong Jun KIM
- G02 - OPTICS
Information Patent Application
SUBMOUNT FOR ELECTRONIC COMPONENTS
- Publication number 20100238637
- Publication date Sep 23, 2010
- Koninklijke Philips Electronics N.V.
- Rabin Bhattacharya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT AND PROCESS OF MANUFACTURING A LIGHT
- Publication number 20100212149
- Publication date Aug 26, 2010
- Zdenko GRAJCAR
- F21 - LIGHTING
Information Patent Application
Assembly of electromagnetic relay and circuit board
- Publication number 20100109821
- Publication date May 6, 2010
- FUJITSU COMPONENT LIMITED
- Satoshi Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BATTERY PACK
- Publication number 20090246615
- Publication date Oct 1, 2009
- Samsung SDI Co., Ltd
- Junyoung Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LED LIGHTING DEVICE
- Publication number 20090213587
- Publication date Aug 27, 2009
- The Furukawa Electric CO., LTD
- Noritsugu Enomoto
- F21 - LIGHTING
Information Patent Application
LIGHT EMITTING APPARATUS AND LIGHT UNIT HAVING THE SAME
- Publication number 20090196070
- Publication date Aug 6, 2009
- Kyong Jun KIM
- G02 - OPTICS
Information Patent Application
PCB with improved soldering holes and a battery set with the same
- Publication number 20090124099
- Publication date May 14, 2009
- SIMPLO TECHNOLOGY CO., LTD.
- Ming-Ta Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SECONDARY BATTERY PROTECTING MODULE AND LEAD MOUNTING METHOD
- Publication number 20090072008
- Publication date Mar 19, 2009
- Mitsumi Electric Co. Ltd.
- Itaru Takeda
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Socket with solder pad
- Publication number 20090047805
- Publication date Feb 19, 2009
- HON HAI PRECISION IND. CO., LTD.
- Fang-Chu Liao
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device, printed circuit board (PCB), and method of in...

Electrical component and a method for producing an electrical compo...

Electrical connection contact for a ceramic component, a ceramic co...

Electronic device with relay mounted to substrate

Low-cost superior performance coinless RF power amplifier

Method for mounting a power amplifier (AP) assembly

Pressing of wire bond wire tips to provide bent-over tips

Circuit assembly with increased mounting area

High-frequency transformer

Electrical connection contact for a ceramic component, a ceramic co...

Special electric component, printed circuit board assembly, and met...

Pressing of wire bond wire tips to provide bent-over tips

Printed circuit assembly for a solenoid module for an automatic tra...

Multilayer ceramic electronic component and board having the same

Printed substrate and printed substrate with terminal using same

Solder spacer and electronic module comprising such a spacer

Solid electrolytic capacitor for embedding into a circuit board

Electronic part and electronic control unit

Printed circuit assembly for a solenoid module for an automatic tra...

Structure of light emitting diode and method to assemble thereof

Light emitting apparatus and light unit having the same

Printed circuit board unit

Packaging board with visual recognition windows

Light emitting apparatus and light unit having the same

Process of manufacturing a light

Low profile compliant leads

Connector having a terminal with a tin plated contact pressed again...

Secondary battery protecting module and lead mounting method

Light emitting apparatus and light unit having the same

Submount for electronic components

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

VARYING DIAMETERS OF POWER-VIAS IN A PCB BASED ON VIA LOCATION

HIGH-POWER ELECTRONICS DEVICES AND METHODS FOR MANUFACTURING SAME

ELECTRONIC COMPONENT

ELECTRONIC DEVICE WITH RELAY MOUNTED TO SUBSTRATE

ELECTRICAL CONNECTION CONTACT FOR A CERAMIC COMPONENT, A CERAMIC CO...

SLIDE AND MOUNT MANUFACTURING FOR COINLESS RF POWER AMPLIFIER

CIRCUIT ASSEMBLY

Pressing of Wire Bond Wire Tips to Provide Bent-Over Tips

ELECTRICAL CONNECTION CONTACT FOR A CERAMIC COMPONENT, A CERAMIC CO...

ELECTRONIC PART AND ELECTRONIC CONTROL UNIT

LIGHT EMITTING APPARATUS AND LIGHT UNIT HAVING THE SAME

LIGHT EMITTING APPARATUS AND LIGHT UNIT HAVING THE SAME

PRINTED CIRCUIT BOARD UNIT

PACKAGING BOARD

LIGHT EMITTING APPARATUS AND LIGHT UNIT HAVING THE SAME

PRINTED CIRCUIT ASSEMBLY FOR A SOLENOID MODULE FOR AN AUTOMATIC TRA...

STRUCTURE FOR CONNECTING CONNECTOR, AND HEAD LAMP LIGHT SOURCE LIGH...

STRUCTURE OF LIGHT EMITTING DIODE AND METHOD TO ASSEMBLE THEREOF

RECEPTACLE STRUCTURE, PRINTED WIRING BOARD STRUCTURE, AND ELECTRONI...

LIGHT EMITTING APPARATUS AND LIGHT UNIT HAVING THE SAME

SUBMOUNT FOR ELECTRONIC COMPONENTS

LIGHT AND PROCESS OF MANUFACTURING A LIGHT

Assembly of electromagnetic relay and circuit board

BATTERY PACK

LED LIGHTING DEVICE

LIGHT EMITTING APPARATUS AND LIGHT UNIT HAVING THE SAME

PCB with improved soldering holes and a battery set with the same

SECONDARY BATTERY PROTECTING MODULE AND LEAD MOUNTING METHOD

Socket with solder pad