Flat pressure

Industry

CPC
H05K2203/0278

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0278Flat pressure

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic component on flexible substrate
- Patent number 12,069,808
- Issue date Aug 20, 2024
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Margaretha Maria De Kok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressing method of a flexible printed circuit board and a substrate
- Patent number 11,991,834
- Issue date May 21, 2024
- Samsung Display Co., Ltd.
- Jae Uk Cho
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Sn—Bi and copper powder conductive paste in through hole of insulat...
- Patent number 11,864,317
- Issue date Jan 2, 2024
- Nichia Corporation
- Masaaki Katsumata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,776,932
- Issue date Oct 3, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
UV fixing glue for assembly
- Patent number 11,778,753
- Issue date Oct 3, 2023
- Heraeus Deutschland GmbH & Co. KG
- Ilias Nikolaidis
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,626,383
- Issue date Apr 11, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Light-emitting module
- Patent number 11,611,014
- Issue date Mar 21, 2023
- Nichia Corporation
- Eiko Minato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated body and method for manufacturing the same
- Patent number 11,558,958
- Issue date Jan 17, 2023
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal base circuit board and method of manufacturing the metal base...
- Patent number 11,490,513
- Issue date Nov 1, 2022
- NHK Spring Co., Ltd.
- Katsumi Mizuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated body and method for manufacturing the same
- Patent number 11,445,606
- Issue date Sep 13, 2022
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a printed circuit board using a mould for cond...
- Patent number 11,395,411
- Issue date Jul 19, 2022
- JUMATECH GMBH
- Markus Wölfel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic foil
- Patent number 11,388,815
- Issue date Jul 12, 2022
- Teknologian tutkimuskeskus VTT Oy
- Vesa Pentikäinen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluororesin base material, printed wiring board, and circuit module
- Patent number 11,364,714
- Issue date Jun 21, 2022
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Satoshi Kiya
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multi-layered circuit board
- Patent number 11,297,722
- Issue date Apr 5, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Zhi Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing light-emitting module and light-emitting mo...
- Patent number 11,264,533
- Issue date Mar 1, 2022
- Nichia Corporation
- Eiko Minato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for flip-chip bonding using anisotropic adhesive polymer
- Patent number 11,240,918
- Issue date Feb 1, 2022
- Research & Business Foundation Sungkyunkwan University
- Tae Il Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Selective dielectric resin application on circuitized core layers
- Patent number 11,178,757
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin-clad copper foil, copper-clad laminated plate, and printed wi...
- Patent number 11,166,383
- Issue date Nov 2, 2021
- Mitsui Mining & Smelting Co., Ltd.
- Yoshihiro Yoneda
- B32 - LAYERED PRODUCTS
Information Patent Grant
Fixing apparatus
- Patent number 11,160,173
- Issue date Oct 26, 2021
- Tyco Electronics (Shanghai) Co. Ltd.
- Yingcong Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for laying conductive pathways, method of laying conducti...
- Patent number 11,096,275
- Issue date Aug 17, 2021
- MAS INNOVATION (PRIVATE) LIMITED
- Kosalasiri Jayasundara
- A41 - WEARING APPAREL
Information Patent Grant
Fabricated electrical circuit on touch sensor substrate
- Patent number 11,086,458
- Issue date Aug 10, 2021
- BOE Technology Group Co., Ltd.
- David Guard
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display device and method for manufacturing same
- Patent number 11,075,224
- Issue date Jul 27, 2021
- AU OPTRONICS CORPORATION
- Hao-An Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printable 3D electronic structure
- Patent number 11,064,609
- Issue date Jul 13, 2021
- X Display Company Technology Limited
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid ejection apparatus
- Patent number 11,031,538
- Issue date Jun 8, 2021
- Brother Kogyo Kabushiki Kaisha
- Toru Kakiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing treated sheet and method of manufacturing r...
- Patent number 11,001,042
- Issue date May 11, 2021
- Murata Manufacturing Co., Ltd.
- Ryosuke Takada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Module-embedded multilayer circuit board and method for manufacturi...
- Patent number 10,993,328
- Issue date Apr 27, 2021
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Chih-Chieh Fu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive film
- Patent number 10,985,128
- Issue date Apr 20, 2021
- Dexerials Corporation
- Koji Ejima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for manufacturing a PCB
- Patent number 10,980,126
- Issue date Apr 13, 2021
- The United States of America, as represented by the Secretary of the Navy
- Stephen J. Vetter
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Anisotropic conductive film
- Patent number 10,957,462
- Issue date Mar 23, 2021
- Dexerials Corporation
- Reiji Tsukao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered circuit board and method for manufacturing the same
- Patent number 10,881,008
- Issue date Dec 29, 2020
- Avary Holding (Shenzhen) Co., Limited.
- Zhi Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING...
- Publication number 20240352287
- Publication date Oct 24, 2024
- Resonac Corporation
- Masashi OHKOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF, AND ELECTRONIC...
- Publication number 20240306306
- Publication date Sep 12, 2024
- Canon Kabushiki Kaisha
- JUN TSUKANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRESS APPARATUS AND PRESSING METHOD THEREOF
- Publication number 20240268035
- Publication date Aug 8, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jae Uk CHO
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
SELF-EQUALIZING FRAME FOR THERMAL MANAGEMENT DEVICE PRELOAD
- Publication number 20240121932
- Publication date Apr 11, 2024
- Cisco Technology, Inc.
- Robert Gregory Twiss
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOFORMING DEVICE AND METHOD FOR FLEXIBLE CIRCUIT BOARD
- Publication number 20240098902
- Publication date Mar 21, 2024
- ZTE Corporation
- Da CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TAPE AND MANUFACTURING METHOD THEREOF
- Publication number 20230380072
- Publication date Nov 23, 2023
- Chipbond Technology Corporation
- Yi-Hui Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF, AND ELECTRONIC...
- Publication number 20230247768
- Publication date Aug 3, 2023
- Canon Kabushiki Kaisha
- JUN TSUKANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20230199945
- Publication date Jun 22, 2023
- LG ENERGY SOLUTION, LTD.
- Ga Young WOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A CONDUCTIVE PATTERN ON A SUBSTRATE
- Publication number 20230040740
- Publication date Feb 9, 2023
- Digital Tags Finland Oy
- Lauri HUHTASALO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED BODY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220377886
- Publication date Nov 24, 2022
- Murata Manufacturing Co., Ltd.
- Yusuke KAMITSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT ON FLEXIBLE SUBSTRATE
- Publication number 20220330433
- Publication date Oct 13, 2022
- Nederlandse Organisatie voor toegepast-natuurwetenschapplijk onderzoek TNO
- Margaretha Maria DE KOK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT-EMITTING MODULE
- Publication number 20220149233
- Publication date May 12, 2022
- Nichia Corporation.
- Eiko MINATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR LAYING CONDUCTIVE PATHWAYS, METHOD OF LAYING CONDUCTI...
- Publication number 20220039253
- Publication date Feb 3, 2022
- MAS Innovation (Private) Limited
- Kosalasiri Jayasundara
- B32 - LAYERED PRODUCTS
Information Patent Application
THIN CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210392758
- Publication date Dec 16, 2021
- Avary Holding (Shenzhen) Co., Limited.
- HSIAO-TING HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED BODY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210212203
- Publication date Jul 8, 2021
- Murata Manufacturing Co., Ltd.
- Yusuke KAMITSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYERED CIRCUIT BOARD
- Publication number 20210136926
- Publication date May 6, 2021
- Avary Holding (Shenzhen) Co., Limited.
- ZHI GUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING
- Publication number 20210104488
- Publication date Apr 8, 2021
- DANFOSS SILICON POWER GMBH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Application
UV FIXING GLUE FOR ASSEMBLY
- Publication number 20210068263
- Publication date Mar 4, 2021
- Heraeus Deutschland GmbH & Co. KG
- Ilias Nikolaidis
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
PRESS APPARATUS AND PRESSING METHOD THEREOF
- Publication number 20210045253
- Publication date Feb 11, 2021
- SAMSUNG DISPLAY CO., LTD.
- Jae Uk CHO
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
MODULE-EMBEDDED MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURI...
- Publication number 20210037653
- Publication date Feb 4, 2021
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- CHIH-CHIEH FU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD USING A MOULD FOR COND...
- Publication number 20210029831
- Publication date Jan 28, 2021
- JUMATECH GMBH
- Markus WÖLFEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF ENHANCING ELECTRICAL CONNECTIONS IN 3D-PRINTED OBJECTS
- Publication number 20200375036
- Publication date Nov 26, 2020
- SIGNIFY HOLDING B.V.
- RIFAT ATA MUSTAFA HIKMET
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID EJECTION APPARATUS
- Publication number 20200321510
- Publication date Oct 8, 2020
- BROTHER KOGYO KABUSHIKI KAISHA
- Toru KAKIUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC FOIL
- Publication number 20200260567
- Publication date Aug 13, 2020
- Teknologian Tutkimuskeskus VTT Oy
- Vesa PENTIKÄINEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM
- Publication number 20200152351
- Publication date May 14, 2020
- DEXERIALS CORPORATION
- Reiji TSUKAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FLIP-CHIP BONDING USING ANISOTROPIC ADHESIVE POLYMER
- Publication number 20200077523
- Publication date Mar 5, 2020
- Research & Business Foundation Sungkyunkwan University
- Tae Il KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SiP MODULE AND MANUFACTURING METHOD OF THE SiP MODULE
- Publication number 20190387610
- Publication date Dec 19, 2019
- Universal Scientific Industrial (Shanghai) Co., Ltd.
- JING CAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fabricated Electrical Circuit on Touch Sensor Substrate
- Publication number 20190369761
- Publication date Dec 5, 2019
- David Guard
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MOUNTING METHOD, MOUNTING DEVICE, AND PRODUCTION DEVICE
- Publication number 20190364671
- Publication date Nov 28, 2019
- SHARP KABUSHIKI KAISHA
- Takushi MIHOTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DETERMINING CURING CONDITIONS, METHOD OF PRODUCING CIRCUI...
- Publication number 20190267348
- Publication date Aug 29, 2019
- SONY CORPORATION
- Takeshi Ichimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Flat pressure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic component on flexible substrate

Pressing method of a flexible printed circuit board and a substrate

Sn—Bi and copper powder conductive paste in through hole of insulat...

Process and device for low-temperature pressure sintering

UV fixing glue for assembly

Process and device for low-temperature pressure sintering

Light-emitting module

Laminated body and method for manufacturing the same

Metal base circuit board and method of manufacturing the metal base...

Laminated body and method for manufacturing the same

Method for producing a printed circuit board using a mould for cond...

Electronic foil

Fluororesin base material, printed wiring board, and circuit module

Multi-layered circuit board

Method of manufacturing light-emitting module and light-emitting mo...

Method for flip-chip bonding using anisotropic adhesive polymer

Selective dielectric resin application on circuitized core layers

Resin-clad copper foil, copper-clad laminated plate, and printed wi...

Fixing apparatus

Apparatus for laying conductive pathways, method of laying conducti...

Fabricated electrical circuit on touch sensor substrate

Display device and method for manufacturing same

Printable 3D electronic structure

Liquid ejection apparatus

Method of manufacturing treated sheet and method of manufacturing r...

Module-embedded multilayer circuit board and method for manufacturi...

Anisotropic conductive film

Apparatus for manufacturing a PCB

Anisotropic conductive film

Multi-layered circuit board and method for manufacturing the same

Patents Applicationslast 30 patents

CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING...

ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF, AND ELECTRONIC...

PRESS APPARATUS AND PRESSING METHOD THEREOF

SELF-EQUALIZING FRAME FOR THERMAL MANAGEMENT DEVICE PRELOAD

THERMOFORMING DEVICE AND METHOD FOR FLEXIBLE CIRCUIT BOARD

TAPE AND MANUFACTURING METHOD THEREOF

ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF, AND ELECTRONIC...

METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD

METHOD FOR PRODUCING A CONDUCTIVE PATTERN ON A SUBSTRATE

LAMINATED BODY AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC COMPONENT ON FLEXIBLE SUBSTRATE

LIGHT-EMITTING MODULE

APPARATUS FOR LAYING CONDUCTIVE PATHWAYS, METHOD OF LAYING CONDUCTI...

THIN CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

LAMINATED BODY AND METHOD FOR MANUFACTURING THE SAME

MULTI-LAYERED CIRCUIT BOARD

PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING

UV FIXING GLUE FOR ASSEMBLY

PRESS APPARATUS AND PRESSING METHOD THEREOF

MODULE-EMBEDDED MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURI...

METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD USING A MOULD FOR COND...

METHOD OF ENHANCING ELECTRICAL CONNECTIONS IN 3D-PRINTED OBJECTS

LIQUID EJECTION APPARATUS

ELECTRONIC FOIL

ANISOTROPIC CONDUCTIVE FILM

METHOD FOR FLIP-CHIP BONDING USING ANISOTROPIC ADHESIVE POLYMER

SiP MODULE AND MANUFACTURING METHOD OF THE SiP MODULE

Fabricated Electrical Circuit on Touch Sensor Substrate

MOUNTING METHOD, MOUNTING DEVICE, AND PRODUCTION DEVICE

METHOD OF DETERMINING CURING CONDITIONS, METHOD OF PRODUCING CIRCUI...