Flexible insulating substrates

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H01L23/5387

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5387Flexible insulating substrates

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Lighting-emitting device filament including electrode pads
- Patent number 12,237,313
- Issue date Feb 25, 2025
- Seoul Semiconductor Co., Ltd.
- Jae Hyun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible substrate
- Patent number 12,237,270
- Issue date Feb 25, 2025
- Japan Display Inc.
- Takumi Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-film package and display apparatus including the same
- Patent number 12,230,576
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Jaemin Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic components for soft, flexible circuitry layers and metho...
- Patent number 12,230,579
- Issue date Feb 18, 2025
- LOOMIA Technologies, Inc.
- Madison Thea Maxey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel regions having curved surfaces between first and second defin...
- Patent number 12,225,777
- Issue date Feb 11, 2025
- BOE Technology Group Co., Ltd.
- Juanjuan You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible hybrid electronic system processing method and flexible hy...
- Patent number 12,224,246
- Issue date Feb 11, 2025
- Peking University
- Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus
- Patent number 12,219,710
- Issue date Feb 4, 2025
- Samsung Display Co., Ltd.
- Wontae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible substrate
- Patent number 12,211,797
- Issue date Jan 28, 2025
- Japan Display Inc.
- Takumi Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Foldable substrates having a cavity filled with a polymer and metho...
- Patent number 12,207,539
- Issue date Jan 21, 2025
- Corning Incorporated
- Gabriel Pierce Agnello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,207,495
- Issue date Jan 21, 2025
- Innolux Corporation
- Yuan-Lin Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexible interposer
- Patent number 12,199,026
- Issue date Jan 14, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Brian Cobb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive sensor systems and method
- Patent number 12,174,046
- Issue date Dec 24, 2024
- adidas AG
- Bryce Beamer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable display panel, preparation method therefor, and display...
- Patent number 12,176,325
- Issue date Dec 24, 2024
- BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
- Jia Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using cavity substrate and manufacturing methods
- Patent number 12,165,986
- Issue date Dec 10, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable display device
- Patent number 12,166,018
- Issue date Dec 10, 2024
- LG Display Co., Ltd.
- Aesun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device including vertical contact...
- Patent number 12,154,860
- Issue date Nov 26, 2024
- SanDisk Technologies, Inc.
- Zhongli Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including processing element and I/O element
- Patent number 12,107,074
- Issue date Oct 1, 2024
- Advanced Semiconductor Engineering, Inc.
- Chang Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable electronic device
- Patent number 12,094,832
- Issue date Sep 17, 2024
- Innolux Corporation
- Yuan-Lin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device including flexible substrate
- Patent number 12,095,017
- Issue date Sep 17, 2024
- Nichia Corporation
- Yukitoshi Marutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display module and system applications
- Patent number 12,087,749
- Issue date Sep 10, 2024
- Apple Inc.
- Andreas Bibl
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexible circuit board and chip package including same
- Patent number 12,080,654
- Issue date Sep 3, 2024
- LG Innotek Co., Ltd
- Jun Young Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible package architecture concept in fanout
- Patent number 12,074,077
- Issue date Aug 27, 2024
- Apple Inc.
- Karthik Shanmugam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with serpentine conductor and method of...
- Patent number 12,068,232
- Issue date Aug 20, 2024
- Avago Technologies International Sales Pte. Limited
- Michael Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on film assembly, display panel, and display module
- Patent number 12,057,382
- Issue date Aug 6, 2024
- TCL China Star Optoelectronics Technology Co., Ltd.
- Jinfeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure comprising rigid-flexible substrate...
- Patent number 12,040,281
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,033,946
- Issue date Jul 9, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 12,027,465
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curved semiconductor die systems and related methods
- Patent number 12,020,972
- Issue date Jun 25, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method of forming the same
- Patent number 12,009,356
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Yao Ku
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display device and manufacturing method thereof
- Patent number 12,009,464
- Issue date Jun 11, 2024
- Au Optronics Corporation
- Wei-Fu Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY APPARATUS
- Publication number 20250063934
- Publication date Feb 20, 2025
- SAMSUNG DISPLAY CO., LTD.
- Kyungmin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY HIGH-POWER DENSITY MODULE POWER SUPPLY, PARALLEL COM...
- Publication number 20250062243
- Publication date Feb 20, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND METHOD FOR PRODUCING SAME
- Publication number 20250054907
- Publication date Feb 13, 2025
- ROBERT BOSCH GmbH
- Irfan AYDOGMUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE BRIDGE AND METHOD FOR MANUFACTURING IT
- Publication number 20250054868
- Publication date Feb 13, 2025
- ROBERT BOSCH GmbH
- Irfan AYDOGMUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE AND SYSTEM APPLICATIONS
- Publication number 20250038160
- Publication date Jan 30, 2025
- Apple Inc.
- Andreas Bibl
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250022818
- Publication date Jan 16, 2025
- MURATA MANUFACTURING CO., LTD.
- Yoshiki NAKAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PROCESSING ELEMENT AND I/O ELEMENT
- Publication number 20250022848
- Publication date Jan 16, 2025
- Advanced Semiconductor Engineering, Inc.
- Chang Chi LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEGRADABLE POLYIMIDES FOR FLEXIBLE ELECTRONIC SUBSTRATES USING THIO...
- Publication number 20240409690
- Publication date Dec 12, 2024
- University of Utah Research Foundation
- Caleb Reese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240413092
- Publication date Dec 12, 2024
- InnoLux Corporation
- Yuan-Lin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH SERPENTINE CONDUCTOR AND METHOD OF...
- Publication number 20240395689
- Publication date Nov 28, 2024
- Avago Technologies International Sales Pte. Limited
- Michael Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND CHIP PACKAGE INCLUDING SAME
- Publication number 20240395724
- Publication date Nov 28, 2024
- LG Innotek Co., Ltd.
- Jun Young LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE FILAMENT SPLICING STRUCTURES
- Publication number 20240379576
- Publication date Nov 14, 2024
- Hangzhou Hangke Optoelectronics Co., Ltd.
- Qianjun YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH RIGID-FLEX SUB-ASSEMBLY AND METHOD THEREFOR
- Publication number 20240363519
- Publication date Oct 31, 2024
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240355744
- Publication date Oct 24, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME
- Publication number 20240332280
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yao KU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE COMPRISING RIGID-FLEXIBLE SUBSTRATE...
- Publication number 20240321757
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURVED SEMICONDUCTOR DIE SYSTEMS AND RELATED METHODS
- Publication number 20240297065
- Publication date Sep 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONALLY INTEGRATED MULTI-IC SYSTEM WITH INTERCONNECT CO...
- Publication number 20240290724
- Publication date Aug 29, 2024
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Christof LANDESBERGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL, DISPLAY APPARATUS INCLUDING DISPLAY PANEL, AND METHO...
- Publication number 20240288734
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Bupmyoung KIM
- G02 - OPTICS
Information Patent Application
DISPLAY PANEL, DISPLAY PANEL SUBASSEMBLY AND DISPLAY APPARATUS
- Publication number 20240282903
- Publication date Aug 22, 2024
- BOE MLED TECHNOLOGY CO., LTD.
- Shaofei GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240250037
- Publication date Jul 25, 2024
- SAMSUNG DISPLAY CO., LTD.
- Gana KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240243070
- Publication date Jul 18, 2024
- Japan Display Inc.
- Takumi SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOLDABLE MICROLED DISPLAY
- Publication number 20240234382
- Publication date Jul 11, 2024
- Prilit Optronics, Inc.
- Biing-Seng Wu
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
POWER MODULE
- Publication number 20240234327
- Publication date Jul 11, 2024
- Hyundai Motor Company
- Sung Taek HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED LIGHT SOURCE HAVING A LOW-DENSITY SET OF LIGHT-EMITTING E...
- Publication number 20240162199
- Publication date May 16, 2024
- Lumileds LLC
- Wouter SOER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYERS
- Publication number 20240162111
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Seunghyun CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATION OF A LIGHT SOURCE HAVING A LOW-DENSITY SET OF LIGHT-EMIT...
- Publication number 20240162200
- Publication date May 16, 2024
- Lumileds LLC
- Wouter SOER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
- Publication number 20240162213
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Yechung CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES
- Publication number 20240162134
- Publication date May 16, 2024
- Intel Corporation
- Xiao LU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER MODULE
- Publication number 20240136296
- Publication date Apr 25, 2024
- Hyundai Motor Company
- Sung Taek HWANG
- H01 - BASIC ELECTRIC ELEMENTS

Flexible insulating substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Lighting-emitting device filament including electrode pads

Flexible substrate

Chip-on-film package and display apparatus including the same

Electronic components for soft, flexible circuitry layers and metho...

Pixel regions having curved surfaces between first and second defin...

Flexible hybrid electronic system processing method and flexible hy...

Display apparatus

Flexible substrate

Foldable substrates having a cavity filled with a polymer and metho...

Display device

Flexible interposer

Capacitive sensor systems and method

Stretchable display panel, preparation method therefor, and display...

Semiconductor package using cavity substrate and manufacturing methods

Stretchable display device

Method of forming a semiconductor device including vertical contact...

Semiconductor package including processing element and I/O element

Stretchable electronic device

Light emitting device including flexible substrate

Display module and system applications

Flexible circuit board and chip package including same

Flexible package architecture concept in fanout

Integrated circuit package with serpentine conductor and method of...

Chip on film assembly, display panel, and display module

Semiconductor package structure comprising rigid-flexible substrate...

Semiconductor devices and methods of manufacturing semiconductor de...

Impedance controlled electrical interconnection employing meta-mate...

Curved semiconductor die systems and related methods

Integrated circuit and method of forming the same

Display device and manufacturing method thereof

Patents Applicationslast 30 patents

DISPLAY APPARATUS

HIGH-FREQUENCY HIGH-POWER DENSITY MODULE POWER SUPPLY, PARALLEL COM...

POWER MODULE AND METHOD FOR PRODUCING SAME

POWER MODULE BRIDGE AND METHOD FOR MANUFACTURING IT

DISPLAY MODULE AND SYSTEM APPLICATIONS

SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE INCLUDING PROCESSING ELEMENT AND I/O ELEMENT

DEGRADABLE POLYIMIDES FOR FLEXIBLE ELECTRONIC SUBSTRATES USING THIO...

ELECTRONIC DEVICE

INTEGRATED CIRCUIT PACKAGE WITH SERPENTINE CONDUCTOR AND METHOD OF...

FLEXIBLE CIRCUIT BOARD AND CHIP PACKAGE INCLUDING SAME

FLEXIBLE FILAMENT SPLICING STRUCTURES

SEMICONDUCTOR DEVICE WITH RIGID-FLEX SUB-ASSEMBLY AND METHOD THEREFOR

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE COMPRISING RIGID-FLEXIBLE SUBSTRATE...

CURVED SEMICONDUCTOR DIE SYSTEMS AND RELATED METHODS

THREE-DIMENSIONALLY INTEGRATED MULTI-IC SYSTEM WITH INTERCONNECT CO...

DISPLAY PANEL, DISPLAY APPARATUS INCLUDING DISPLAY PANEL, AND METHO...

DISPLAY PANEL, DISPLAY PANEL SUBASSEMBLY AND DISPLAY APPARATUS

DISPLAY DEVICE

ELECTRONIC DEVICE

FOLDABLE MICROLED DISPLAY

POWER MODULE

LAMINATED LIGHT SOURCE HAVING A LOW-DENSITY SET OF LIGHT-EMITTING E...

SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYERS

LAMINATION OF A LIGHT SOURCE HAVING A LOW-DENSITY SET OF LIGHT-EMIT...

CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME

VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES

POWER MODULE